Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

X. F. Zhang; J. D. Guo; J. K. Shang

doi:10.1016/j.scriptamat.2007.05.023

Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

X. F. Zhang, J. D. Guo, J. K. Shang

Research output: Contribution to journal › Article › peer-review

Abstract

Interfacial reactions in a eutectic Sn-Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 × 10⁴ A cm^-2 for 166 h, an abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was about 2.3 μm thicker than that at the anode. Upon increasing the temperature to about 185 °C, Cu-Zn compounds were replaced by Cu-Sn compounds at the anode and by a mixture of Cu-Zn and Cu-Sn compounds at the cathode.

Original language	English (US)
Pages (from-to)	513-516
Number of pages	4
Journal	Scripta Materialia
Volume	57
Issue number	6
DOIs	https://doi.org/10.1016/j.scriptamat.2007.05.023
State	Published - Sep 2007
Externally published	Yes

Keywords

Abnormal polarity effect
Electromigration
Intermetallic compound

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Online availability

10.1016/j.scriptamat.2007.05.023

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title = "Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect",

abstract = "Interfacial reactions in a eutectic Sn-Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 × 104 A cm-2 for 166 h, an abnormal {"}polarity effect{"} was found where the intermetallic compound layer at the cathode was about 2.3 μm thicker than that at the anode. Upon increasing the temperature to about 185 °C, Cu-Zn compounds were replaced by Cu-Sn compounds at the anode and by a mixture of Cu-Zn and Cu-Sn compounds at the cathode.",

keywords = "Abnormal polarity effect, Electromigration, Intermetallic compound",

author = "Zhang, {X. F.} and Guo, {J. D.} and Shang, {J. K.}",

note = "Funding Information: This work was supported by the Chinese Natural Science Foundation under Grant No. 50228101 and the National Basic Research Program of China, Grant No. 2004CB619306.",

year = "2007",

month = sep,

doi = "10.1016/j.scriptamat.2007.05.023",

language = "English (US)",

volume = "57",

pages = "513--516",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "6",

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TY - JOUR

T1 - Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

AU - Zhang, X. F.

AU - Guo, J. D.

AU - Shang, J. K.

N1 - Funding Information: This work was supported by the Chinese Natural Science Foundation under Grant No. 50228101 and the National Basic Research Program of China, Grant No. 2004CB619306.

PY - 2007/9

Y1 - 2007/9

N2 - Interfacial reactions in a eutectic Sn-Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 × 104 A cm-2 for 166 h, an abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was about 2.3 μm thicker than that at the anode. Upon increasing the temperature to about 185 °C, Cu-Zn compounds were replaced by Cu-Sn compounds at the anode and by a mixture of Cu-Zn and Cu-Sn compounds at the cathode.

AB - Interfacial reactions in a eutectic Sn-Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 × 104 A cm-2 for 166 h, an abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was about 2.3 μm thicker than that at the anode. Upon increasing the temperature to about 185 °C, Cu-Zn compounds were replaced by Cu-Sn compounds at the anode and by a mixture of Cu-Zn and Cu-Sn compounds at the cathode.

KW - Abnormal polarity effect

KW - Electromigration

KW - Intermetallic compound

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U2 - 10.1016/j.scriptamat.2007.05.023

DO - 10.1016/j.scriptamat.2007.05.023

M3 - Article

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SN - 1359-6462

VL - 57

SP - 513

EP - 516

JO - Scripta Materialia

JF - Scripta Materialia

IS - 6

ER -

Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect

Abstract

Keywords

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