TY - GEN
T1 - A temperature sensor from a self-assembled carbon nanotube microbridge
AU - De Volder, M.
AU - Reynaerts, D.
AU - Van Hoof, C.
AU - Tawfick, S.
AU - Hart, A. J.
PY - 2010
Y1 - 2010
N2 - Recent studies show that carbon nanotubes (CNTs) can be used as temperature sensors, and offer great opportunities towards extreme miniaturization, high sensitivity, low power consumption, and rapid response. Previous CNT based temperature sensors are fabricated by either dielectrophoresis or piece-wise alignment of read-out electronics around randomly dispersed CNTs. We introduce a new deterministic and parallel microsensor fabrication method based on the self-assembly of CNTs into three-dimensional microbridges. We fabricated prototype microbridge sensors on patterned electrodes, and found their sensitivity to be better than -0.1 %/K at temperatures between 300K and 420K. This performance is comparable to previously published CNT based temperature sensors. Importantly, however, our research shows how unique sensor architectures can be made by self-assembly, which can be achieved using batch processing rather than piecewise assembly.
AB - Recent studies show that carbon nanotubes (CNTs) can be used as temperature sensors, and offer great opportunities towards extreme miniaturization, high sensitivity, low power consumption, and rapid response. Previous CNT based temperature sensors are fabricated by either dielectrophoresis or piece-wise alignment of read-out electronics around randomly dispersed CNTs. We introduce a new deterministic and parallel microsensor fabrication method based on the self-assembly of CNTs into three-dimensional microbridges. We fabricated prototype microbridge sensors on patterned electrodes, and found their sensitivity to be better than -0.1 %/K at temperatures between 300K and 420K. This performance is comparable to previously published CNT based temperature sensors. Importantly, however, our research shows how unique sensor architectures can be made by self-assembly, which can be achieved using batch processing rather than piecewise assembly.
UR - http://www.scopus.com/inward/record.url?scp=79951864431&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79951864431&partnerID=8YFLogxK
U2 - 10.1109/ICSENS.2010.5690868
DO - 10.1109/ICSENS.2010.5690868
M3 - Conference contribution
AN - SCOPUS:79951864431
SN - 9781424481682
T3 - Proceedings of IEEE Sensors
SP - 2369
EP - 2372
BT - IEEE Sensors 2010 Conference, SENSORS 2010
T2 - 9th IEEE Sensors Conference 2010, SENSORS 2010
Y2 - 1 November 2010 through 4 November 2010
ER -