@inproceedings{0f5d95d4ef1640fb896b7058d877a14b,
title = "A surface integral equation method for solving complicated electrically small structures",
abstract = "A Surface Integral Equation (SE) method based on contact-region modeling is applied for complicated electrically small structures in packaging and interconnect analysis. LF-MLFMA is employed to solve the matrix equation with O(N) computational cost.",
author = "Chu Yunhui and Weng, {Cho Chew}",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; Electrical Performance of Electronic Packaging, 2003 ; Conference date: 27-10-2003 Through 29-10-2003",
year = "2003",
doi = "10.1109/EPEP.2003.1250064",
language = "English (US)",
series = "Electrical Performance of Electronic Packaging",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "341--344",
booktitle = "Electrical Performance of Electronic Packaging",
address = "United States",
}