@inproceedings{53ff23374a2e443a96bfadebd46013f1,
title = "A study of conductor modeling using the surface integral equation",
abstract = "A rigorous method to solve conductor problems using the surface integral equation is introduced. This formulation is based on the augmented electric field integral equation. In order to model conductors and accurately capture the losses, some integration techniques are analyzed and compared. The line integral method will be an optimal option for conductor problems. After incorporating this technique, this method can be applied to interconnect and packaging problems.",
author = "Tian Xia and Hui Gan and Michael Wei and Chew, {Weng Cho}",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015 ; Conference date: 25-10-2015 Through 28-10-2015",
year = "2015",
month = dec,
day = "3",
doi = "10.1109/EPEPS.2015.7347146",
language = "English (US)",
series = "2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "131--134",
booktitle = "2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015",
address = "United States",
}