A spectral scheme for the simulation of dynamic mode 3 delamination of thin films

Keyphrases

• Delamination 100%
• Dynamic Simulation 100%
• Spectral Scheme 100%
• Numerical Scheme 100%
• Dynamic Mode 100%
• Displacement Field 50%
• Laser-induced 50%
• Propagating Crack 50%
• Stress Field 50%
• Fracture Problems 50%
• Anti-plane Shear 50%
• Modal Analysis 50%
• Frictional Model 50%
• Dynamic Motion 50%
• Shear Mode 50%
• Film-substrate Interface 50%
• Elastodynamics 50%
• Spallation 50%
• Spectral Mode 50%
• Interface Conditions 50%
• Non-propagating 50%
• Dynamic Failure 50%
• Thin Film Structure 50%
• Wave Reflection 50%
• Spectral Representation 50%
• Near-tip 50%
• Load Case 50%
• Dynamic Fracture 50%
• Cohesive Failure 50%

Engineering

• Thin Films 100%
• Delamination 100%
• Mode Dynamic 100%
• Numerical Scheme 66%
• Displacement Field 33%
• Propagating Crack 33%
• Interface Condition 33%
• Dynamic Fracture 33%
• Contact Model 33%
• Shear Plane 33%
• Wave Reflection 33%
• Modal Analysis 33%
• Substrate Interface 33%
• Loading Case 33%
• Cohesive Failure 33%
• Frictional Contact 33%
• Dynamic Motion 33%