TY - GEN
T1 - A Shape Memory Polymer Adhesive Gripper for Pick-and-Place Applications
AU - Son, Chang Hee
AU - Kim, Seok
N1 - Publisher Copyright:
© 2020 IEEE.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2020/5
Y1 - 2020/5
N2 - Over the past few years, shape memory polymer (SMP) has been extensively studied in terms of its remarkable reversible dry adhesive properties and related smart adhesive applications. However, its exceptional properties have not been exploited for further opportunities such as pick-and-place applications, which would otherwise advance the robotic manipulation. This work explores the use of an SMP to design an adhesive gripper that picks and places a target solid object employing the reversible dry adhesion of an SMP. Compared with other single surface contact grippers including vacuum, electromagnetic, electroadhesion, and gecko grippers, the SMP adhesive gripper interacts with not only flat and smooth dry surfaces but also moderately rough and even wet surfaces for pick-and-place with high adhesion strength (> 2 atmospheres). In this work, associated physical mechanisms, SMP adhesive mechanics, and thermal conditions are studied. In particular, the numerical and experimental study elucidates that the optimal compositional and topological SMP design may substantially enhance its adhesion strength and reversibility, which leads to a strong grip force simultaneously with a minimized releasing force. Finally, the versatility and utility of the SMP adhesive gripper are highlighted through diverse pick-and-place demonstrations.
AB - Over the past few years, shape memory polymer (SMP) has been extensively studied in terms of its remarkable reversible dry adhesive properties and related smart adhesive applications. However, its exceptional properties have not been exploited for further opportunities such as pick-and-place applications, which would otherwise advance the robotic manipulation. This work explores the use of an SMP to design an adhesive gripper that picks and places a target solid object employing the reversible dry adhesion of an SMP. Compared with other single surface contact grippers including vacuum, electromagnetic, electroadhesion, and gecko grippers, the SMP adhesive gripper interacts with not only flat and smooth dry surfaces but also moderately rough and even wet surfaces for pick-and-place with high adhesion strength (> 2 atmospheres). In this work, associated physical mechanisms, SMP adhesive mechanics, and thermal conditions are studied. In particular, the numerical and experimental study elucidates that the optimal compositional and topological SMP design may substantially enhance its adhesion strength and reversibility, which leads to a strong grip force simultaneously with a minimized releasing force. Finally, the versatility and utility of the SMP adhesive gripper are highlighted through diverse pick-and-place demonstrations.
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U2 - 10.1109/ICRA40945.2020.9197511
DO - 10.1109/ICRA40945.2020.9197511
M3 - Conference contribution
AN - SCOPUS:85092719108
T3 - Proceedings - IEEE International Conference on Robotics and Automation
SP - 10010
EP - 10016
BT - 2020 IEEE International Conference on Robotics and Automation, ICRA 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE International Conference on Robotics and Automation, ICRA 2020
Y2 - 31 May 2020 through 31 August 2020
ER -