Abstract
Self-healing offers promise for addressing structural failures, increasing lifespan, and improving durability in polymeric materials. Implementing self-healing in thermoset polymers faces significant manufacturing challenges, especially due to the elevated temperature requirements of thermoset processing. To introduce self-healing into structural thermosets, the self-healing system must be thermally stable and compatible with the thermoset chemistry. This article demonstrates a self-healing microcapsule-based system stable to frontal polymerization (FP), a rapid and energy-efficient manufacturing process with a self-propagating exothermic reaction (≈200 °C). A thermally latent Grubbs-type complex bearing two N-heterocyclic carbene ligands addresses limitations in conventional G2-based self-healing approaches. Under FP's elevated temperatures, the catalyst remains dormant until activated by a Cu(I) co-reagent, ensuring efficient polymerization of the dicyclopentadiene (DCPD) upon damage to the polyDCPD matrix. The two-part microcapsule system consists of one capsule containing the thermally latent Grubbs-type catalyst dissolved in the solvent, and another capsule containing a Cu(I) coagent blended with liquid DCPD monomer. Using the same chemistry for both matrix fabrication and healing results in strong interfaces as demonstrated by lap-shear tests. In an optimized system, the self-healing system restores the mechanical properties of the tough polyDCPD thermoset. Self-healing efficiencies greater than 90% via tapered double cantilever beam tests are observed.
Original language | English (US) |
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Article number | 2309662 |
Journal | Advanced Materials |
Volume | 36 |
Issue number | 11 |
Early online date | Dec 13 2023 |
DOIs | |
State | Published - Mar 14 2024 |
Keywords
- Frontal polymerization
- Microcapsule
- Ring Opening Metathesis Polymerization
- Self-healing
- Thermal stability
- thermal stability
- microcapsule
- frontal polymerization
- ring-opening metathesis polymerization
- self-healing
ASJC Scopus subject areas
- Mechanics of Materials
- Mechanical Engineering
- General Materials Science