Abstract

Electrical conductivity of mechanically damaged silver ink circuits is automatically restored using core-shell microcapsules. Upon mechanical damage to the circuit and microcapsules, silver particles reorganize by dissolution of the polymer binder layer upon release of solvent, hexyl acetate, from microcapsule cores. Conductivity is restored within minutes of damage, and no short-circuiting is revealed during the healing of closely spaced lines.

Original languageEnglish (US)
Pages (from-to)2578-2581
Number of pages4
JournalAdvanced Materials
Volume24
Issue number19
DOIs
StatePublished - May 15 2012

Keywords

  • electrical conductivity
  • microencapsulation
  • restoration
  • self-healing
  • silver ink

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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