A review of MEMS-based miroscale and nanoscale tensile and bending testing

M. A. Haque, M Taher A Saif

Research output: Contribution to journalArticle

Abstract

Thin films at the micrometer and submicrometer scales exhibit mechanical properties that are different than those of bulk polycrystals. Industrial application of these materials requires accurate mechanical characterization. Also, a fundamental understanding of the deformation processes at smaller length scales is required to exploit the size and interface effects to develop new and technologically attractive materials. Specimen fabrication, small-scale force and displacement generation, and high resolution in the measurements are generic challenges in microscale and nanoscale mechanical testing. In this paper, we review small-scale materials testing techniques with special focus on the application of microelectromechanical systems (MEMS). Small size and high force and displacement resolution make MEMS suitable for small-scale mechanical testing. We discuss the development of tensile and bending testing techniques using MEMS, along with the experimental results on nanoscale aluminum specimens.

Original languageEnglish (US)
Pages (from-to)248-255
Number of pages8
JournalExperimental Mechanics
Volume43
Issue number3
DOIs
StatePublished - Sep 2003

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MEMS
Mechanical testing
Testing
Materials testing
Polycrystals
Industrial applications
Aluminum
Fabrication
Thin films
Mechanical properties

Keywords

  • Bending testing
  • MEMS
  • Tensile testing
  • Thin films

ASJC Scopus subject areas

  • Aerospace Engineering
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

A review of MEMS-based miroscale and nanoscale tensile and bending testing. / Haque, M. A.; Saif, M Taher A.

In: Experimental Mechanics, Vol. 43, No. 3, 09.2003, p. 248-255.

Research output: Contribution to journalArticle

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