TY - GEN
T1 - A pseudo-supervised machine learning approach to broadband LTI macro-modeling
AU - Nguyen, Thong
AU - Schutt-Aine, Jose E.
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/22
Y1 - 2018/6/22
N2 - Neural networks have been popularized by their ability to learn complex, non-linear mappings between features and output spaces. They have been used for learning the mapping between geometry and network parameters for various electrical structures such as interconnects. In this work, a novel neural network architecture is applied to black-box identification problems in which poles and residues of a dynamical system are the quantities to be extracted from frequency domain network parameters. Once poles and residues are extracted, time-domain simulation can be performed using well-establish time-domain simulation techniques.
AB - Neural networks have been popularized by their ability to learn complex, non-linear mappings between features and output spaces. They have been used for learning the mapping between geometry and network parameters for various electrical structures such as interconnects. In this work, a novel neural network architecture is applied to black-box identification problems in which poles and residues of a dynamical system are the quantities to be extracted from frequency domain network parameters. Once poles and residues are extracted, time-domain simulation can be performed using well-establish time-domain simulation techniques.
UR - http://www.scopus.com/inward/record.url?scp=85050112044&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85050112044&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2018.8393939
DO - 10.1109/ISEMC.2018.8393939
M3 - Conference contribution
AN - SCOPUS:85050112044
T3 - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
SP - 1018
EP - 1021
BT - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
Y2 - 14 May 2018 through 18 May 2018
ER -