A parametric study of laser induced thin film spallation

Keyphrases

• Al Thin Film 50%
• Decompression 50%
• Different Substrate Materials 50%
• Elastic Waves 50%
• Film Thickness 100%
• Film-substrate Interface 50%
• Fused Silica 50%
• Fused Silica Substrate 50%
• Geometric Attenuation 50%
• High Stress 50%
• Interface Stress 50%
• Interferometry 50%
• Laser Energy 50%
• Laser Fluence 50%
• Laser-induced 100%
• Maximum Stress 50%
• Pulsed Laser 50%
• Shock 100%
• Si(111) 50%
• Single Crystal Si 50%
• Spallation 100%
• Spallation Behavior 50%
• Spalling 50%
• Stress Wave 50%
• Substrate Stress 50%
• Substrate Thickness 100%
• Surface Displacement 50%
• Surface Film 50%
• Tensile Stress 50%
• Thick Sample 50%
• Thin Film Interface 50%
• Thin Surface 50%
• Wave Generation 50%

Engineering

• Decompression 33%
• Elastic Wave 33%
• Fused Silica 66%
• High Tensile Stress 33%
• Interferometry 33%
• Laser Energy 33%
• Laser Fluence 33%
• Maximum Stress 33%
• Parametric Study 100%
• Pulsed Laser 33%
• Stress Wave 33%
• Substrate Interface 33%
• Substrate Material 33%
• Surface Film 33%
• Thin Films 100%

Material Science

• Film 100%
• Film Thickness 66%
• Silicon Dioxide 66%
• Single Crystal 33%
• Thin Films 100%
• Ultimate Tensile Strength 33%