TY - GEN
T1 - A novel stochastic integral equation method for MIMO communication in diffuse multipath environments
AU - Peng, Zhen
AU - Lin, Shen
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/6/22
Y1 - 2018/6/22
N2 - This paper investigates a novel stochastic integral equation method for the statistical analysis of wireless communication in diffuse multipath environments. The stochastic integral equation rigorously resolves the transmitting correlation, propagation correlation, and receiving correlation in the dense multipath environment. Moreover, it leads to nonstandard statistical models, which utilize the macroscopic properties of environments instead of detailed environmental specifics. The theoretical research is evaluated and validated through semi-empirical statistical fading models.
AB - This paper investigates a novel stochastic integral equation method for the statistical analysis of wireless communication in diffuse multipath environments. The stochastic integral equation rigorously resolves the transmitting correlation, propagation correlation, and receiving correlation in the dense multipath environment. Moreover, it leads to nonstandard statistical models, which utilize the macroscopic properties of environments instead of detailed environmental specifics. The theoretical research is evaluated and validated through semi-empirical statistical fading models.
UR - http://www.scopus.com/inward/record.url?scp=85050109120&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85050109120&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2018.8394051
DO - 10.1109/ISEMC.2018.8394051
M3 - Conference contribution
AN - SCOPUS:85050109120
T3 - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
SP - 74
BT - 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 60th IEEE International Symposium on Electromagnetic Compatibility and 9th IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018
Y2 - 14 May 2018 through 18 May 2018
ER -