A Novel Statistical Model for the Electromagnetic Coupling to Electronics inside Enclosures

Shen Lin, Zhen Peng, Edl Schamiloglu, Zachary B. Drikas, Thomas Antonsen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The goal of this paper is to investigate fundamental mathematical and statistical algorithms for the spatio-spectral analysis of electromagnetic coupling in large, complex electronic systems. A novel stochastic Green's function and a statistical representation formula are proposed, which statistically replicates the multipath wave-chaotic dynamics inside cavity environments. The work achieves a physics-based modeling and simulation capability that predicts the probabilistic behavior of high power radio-frequency induced current and voltages in complex electronic systems.

Original languageEnglish (US)
Title of host publication2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages499-504
Number of pages6
ISBN (Electronic)9781538691991
DOIs
StatePublished - Jul 2019
Event2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 - New Orleans, United States
Duration: Jul 22 2019Jul 26 2019

Publication series

Name2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019

Conference

Conference2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
CountryUnited States
CityNew Orleans
Period7/22/197/26/19

Keywords

  • electromagnetic coupling
  • intentional electromagnetic interference
  • statistical analysis

ASJC Scopus subject areas

  • Signal Processing
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Lin, S., Peng, Z., Schamiloglu, E., Drikas, Z. B., & Antonsen, T. (2019). A Novel Statistical Model for the Electromagnetic Coupling to Electronics inside Enclosures. In 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (pp. 499-504). [8825194] (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISEMC.2019.8825194