TY - GEN
T1 - A Novel Statistical Model for the Electromagnetic Coupling to Electronics inside Enclosures
AU - Lin, Shen
AU - Peng, Zhen
AU - Schamiloglu, Edl
AU - Drikas, Zachary B.
AU - Antonsen, Thomas
N1 - Funding Information:
The work is supported by U.S. NSF CAREER award, #1750839, and U.S. AFOSR/AFRL Center of Excellence on the Science of Electronics in Extreme Electromagnetic Environments, Grant FA9550-15-1-0171.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/7
Y1 - 2019/7
N2 - The goal of this paper is to investigate fundamental mathematical and statistical algorithms for the spatio-spectral analysis of electromagnetic coupling in large, complex electronic systems. A novel stochastic Green's function and a statistical representation formula are proposed, which statistically replicates the multipath wave-chaotic dynamics inside cavity environments. The work achieves a physics-based modeling and simulation capability that predicts the probabilistic behavior of high power radio-frequency induced current and voltages in complex electronic systems.
AB - The goal of this paper is to investigate fundamental mathematical and statistical algorithms for the spatio-spectral analysis of electromagnetic coupling in large, complex electronic systems. A novel stochastic Green's function and a statistical representation formula are proposed, which statistically replicates the multipath wave-chaotic dynamics inside cavity environments. The work achieves a physics-based modeling and simulation capability that predicts the probabilistic behavior of high power radio-frequency induced current and voltages in complex electronic systems.
KW - electromagnetic coupling
KW - intentional electromagnetic interference
KW - statistical analysis
UR - http://www.scopus.com/inward/record.url?scp=85073048448&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85073048448&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.2019.8825194
DO - 10.1109/ISEMC.2019.8825194
M3 - Conference contribution
AN - SCOPUS:85073048448
T3 - 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
SP - 499
EP - 504
BT - 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019
Y2 - 22 July 2019 through 26 July 2019
ER -