A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Cunman Liang, Fujun Wang, Yanling Tian, Xingyu Zhao, Hongjie Zhang, Liangyu Cui, Dawei Zhang, Placid Ferreira

Research output: Contribution to journalArticle

Abstract

A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate, and robust microelectronic device packaging. The wire clamp has compact, flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and a parallelogram leverage mechanism was designed. Pseudo-rigid-body model and Lagrange approaches were employed to conduct the kinematic, static, and dynamic modeling of the wire clamp and optimization design was carried out. The displacement amplification ratio, maximum allowable stress, and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire electro discharge machining technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance and the experimental results match well with the theoretical calculation and FEA. The amplification ratio of the clamp is 20.96 and the working mode frequency is 895 Hz. Step response test shows that the wire clamp has fast response and high accuracy and the motion resolution is 0.2 μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

Original languageEnglish (US)
Article number045106
JournalReview of Scientific Instruments
Volume86
Issue number4
DOIs
StatePublished - Apr 1 2015

ASJC Scopus subject areas

  • Instrumentation

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