A novel method for in situ uniaxial tests at the micro/nanoscalepart II: Experiment

Wonmo Kang, Jong H. Han, M. Taher A. Saif

Research output: Contribution to journalArticle

Abstract

Here, we experimentally investigate the sources of misalignment during uniaxial test and their substantial influence on mechanical measurement of microspecimens. To avoid possible misalignment errors, we propose a novel MEMS-based uniaxial testing stage and a specimen design for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The proposed stage and the specimen ensure uniaxiality of loading due to the introduction of hingelike self-aligning mechanisms both in the stage and in the specimen. Using the stage and the sample, we measure the elastic modulus of single-crystal silicon (SCS) within 99.5% of the known value. We also experimentally demonstrate that the bending strain due to any misalignment can be limited to within 1% of the average strain by using the proposed stage and specimen.

Original languageEnglish (US)
Article number5597909
Pages (from-to)1322-1330
Number of pages9
JournalJournal of Microelectromechanical Systems
Volume19
Issue number6
DOIs
StatePublished - Dec 1 2010

Fingerprint

MEMS
Electron microscopes
Elastic moduli
Experiments
Single crystals
Scanning
Silicon
Testing

Keywords

  • Electron microscopy
  • materials testing
  • microassembly
  • microelectromechanical devices
  • strain measurement
  • stress measurement

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

A novel method for in situ uniaxial tests at the micro/nanoscalepart II : Experiment. / Kang, Wonmo; Han, Jong H.; Saif, M. Taher A.

In: Journal of Microelectromechanical Systems, Vol. 19, No. 6, 5597909, 01.12.2010, p. 1322-1330.

Research output: Contribution to journalArticle

@article{37f224487fe04955bed7b24d7908b5ad,
title = "A novel method for in situ uniaxial tests at the micro/nanoscalepart II: Experiment",
abstract = "Here, we experimentally investigate the sources of misalignment during uniaxial test and their substantial influence on mechanical measurement of microspecimens. To avoid possible misalignment errors, we propose a novel MEMS-based uniaxial testing stage and a specimen design for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The proposed stage and the specimen ensure uniaxiality of loading due to the introduction of hingelike self-aligning mechanisms both in the stage and in the specimen. Using the stage and the sample, we measure the elastic modulus of single-crystal silicon (SCS) within 99.5{\%} of the known value. We also experimentally demonstrate that the bending strain due to any misalignment can be limited to within 1{\%} of the average strain by using the proposed stage and specimen.",
keywords = "Electron microscopy, materials testing, microassembly, microelectromechanical devices, strain measurement, stress measurement",
author = "Wonmo Kang and Han, {Jong H.} and Saif, {M. Taher A.}",
year = "2010",
month = "12",
day = "1",
doi = "10.1109/JMEMS.2010.2076782",
language = "English (US)",
volume = "19",
pages = "1322--1330",
journal = "Journal of Microelectromechanical Systems",
issn = "1057-7157",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "6",

}

TY - JOUR

T1 - A novel method for in situ uniaxial tests at the micro/nanoscalepart II

T2 - Experiment

AU - Kang, Wonmo

AU - Han, Jong H.

AU - Saif, M. Taher A.

PY - 2010/12/1

Y1 - 2010/12/1

N2 - Here, we experimentally investigate the sources of misalignment during uniaxial test and their substantial influence on mechanical measurement of microspecimens. To avoid possible misalignment errors, we propose a novel MEMS-based uniaxial testing stage and a specimen design for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The proposed stage and the specimen ensure uniaxiality of loading due to the introduction of hingelike self-aligning mechanisms both in the stage and in the specimen. Using the stage and the sample, we measure the elastic modulus of single-crystal silicon (SCS) within 99.5% of the known value. We also experimentally demonstrate that the bending strain due to any misalignment can be limited to within 1% of the average strain by using the proposed stage and specimen.

AB - Here, we experimentally investigate the sources of misalignment during uniaxial test and their substantial influence on mechanical measurement of microspecimens. To avoid possible misalignment errors, we propose a novel MEMS-based uniaxial testing stage and a specimen design for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The proposed stage and the specimen ensure uniaxiality of loading due to the introduction of hingelike self-aligning mechanisms both in the stage and in the specimen. Using the stage and the sample, we measure the elastic modulus of single-crystal silicon (SCS) within 99.5% of the known value. We also experimentally demonstrate that the bending strain due to any misalignment can be limited to within 1% of the average strain by using the proposed stage and specimen.

KW - Electron microscopy

KW - materials testing

KW - microassembly

KW - microelectromechanical devices

KW - strain measurement

KW - stress measurement

UR - http://www.scopus.com/inward/record.url?scp=78649640084&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78649640084&partnerID=8YFLogxK

U2 - 10.1109/JMEMS.2010.2076782

DO - 10.1109/JMEMS.2010.2076782

M3 - Article

AN - SCOPUS:78649640084

VL - 19

SP - 1322

EP - 1330

JO - Journal of Microelectromechanical Systems

JF - Journal of Microelectromechanical Systems

SN - 1057-7157

IS - 6

M1 - 5597909

ER -