A novel method for in situ uniaxial tests at the micro/nanoscalepart II: Experiment

Wonmo Kang, Jong H. Han, M. Taher A. Saif

Research output: Contribution to journalArticle

Abstract

Here, we experimentally investigate the sources of misalignment during uniaxial test and their substantial influence on mechanical measurement of microspecimens. To avoid possible misalignment errors, we propose a novel MEMS-based uniaxial testing stage and a specimen design for measuring the mechanical response of material samples in situ in scanning electron microscope (SEM). The proposed stage and the specimen ensure uniaxiality of loading due to the introduction of hingelike self-aligning mechanisms both in the stage and in the specimen. Using the stage and the sample, we measure the elastic modulus of single-crystal silicon (SCS) within 99.5% of the known value. We also experimentally demonstrate that the bending strain due to any misalignment can be limited to within 1% of the average strain by using the proposed stage and specimen.

Original languageEnglish (US)
Article number5597909
Pages (from-to)1322-1330
Number of pages9
JournalJournal of Microelectromechanical Systems
Volume19
Issue number6
DOIs
StatePublished - Dec 1 2010

Keywords

  • Electron microscopy
  • materials testing
  • microassembly
  • microelectromechanical devices
  • strain measurement
  • stress measurement

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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