Keyphrases
Multicrystalline Silicon
100%
In Situ
100%
Thermomechanical Test
100%
MEMS Stage
100%
Microbeam
100%
High Temperature
50%
Elastic Modulus
50%
Uniaxial
50%
Finite Element Model
50%
Room Temperature
50%
Brittle-ductile Transition
50%
High Stress
50%
Alignment Error
50%
Uniaxial Tension Test
50%
Micro-nano
50%
High Strength
50%
Stress State
50%
Premature Failure
50%
Piezoelectric Actuator
50%
Induced Fracture
50%
Ductile-brittle Transition Temperature
50%
Silicon MEMS
50%
Bending Stress
50%
In Situ Bending Tests
50%
Engineering
Microelectromechanical System
100%
Silicon Single Crystal
100%
Nanoscale
50%
Finite Element Modeling
50%
Room Temperature
50%
Modulus of Elasticity
50%
Test Result
50%
Bending Tests
50%
Premature Failure
50%
Test Setup
50%
Ductile-to-Brittle Transition Temperature
50%
Bending Stress
50%
Misalignment Problem
50%
Handling Problem
50%
Material Science
Microelectromechanical System
100%
Silicon
100%
Single Crystal
100%
Ductile-to-Brittle Transition
66%
Mechanical Strength
33%
Elastic Moduli
33%
Scanning Electron Microscopy
33%
Finite Element Modeling
33%
Tensile Testing
33%