A novel MEMS-based technique for in-situ characterization of freestanding nanometer scale thin films inside SEM and TEM

M. A. Haque, M Taher A Saif

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a MEMS-based technique for in-situ uniaxial tensile testing of freestanding thin films inside SEM and TEM. It integrates a freestanding thin film specimen with MEMS force sensors and structures to produce an on-chip tensile testing facility. Cofabrication of the specimen with force and displacement measuring mechanisms produces the following unique features: 1) Quantitative experimentation can be carried out in both SEM and TEM, 2) No extra gripping mechanism is required, 3) Specimen misalignment can be eliminated, 4) Prestress in specimen can be determined, and 5) Specimens with micrometer to nanometer thickness can be tested. We demonstrate the technique by testing a 200-nanometer thick Aluminum specimen in-situ in SEM. Significant strengthening and anelasticity were observed at this size scale.

Original languageEnglish (US)
Title of host publicationMicro-Electro-Mechanical Systems (MEMS) - 2001
EditorsA.L. Lee, J. Simon, K. Breuer, S. Chen, R.S. Keynton, A. Malshe, J.-I. Mou, M. Dunn
Pages15-20
Number of pages6
Volume3
StatePublished - 2001
Event2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States
Duration: Nov 11 2001Nov 16 2001

Other

Other2001 ASME International Mechanical Engineering Congress and Exposition
CountryUnited States
CityNew York, NY
Period11/11/0111/16/01

ASJC Scopus subject areas

  • Engineering(all)

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    Haque, M. A., & Saif, M. T. A. (2001). A novel MEMS-based technique for in-situ characterization of freestanding nanometer scale thin films inside SEM and TEM. In A. L. Lee, J. Simon, K. Breuer, S. Chen, R. S. Keynton, A. Malshe, J-I. Mou, & M. Dunn (Eds.), Micro-Electro-Mechanical Systems (MEMS) - 2001 (Vol. 3, pp. 15-20)