A novel low-cost pluggable chip scale package for high pin-count applications

Keyphrases

• Electrical Performance 100%
• Pluggable 100%
• Chip Scale Package 100%
• Semiconductors 50%
• Printed Circuit Board 50%
• Design Requirements 50%
• Semiconductor Fabrication 50%
• Highly Integrated 50%
• Competitive Cost 50%
• Design Decisions 50%
• Fabrication Constraints 50%
• GHz Bandwidth 50%
• Signal Distribution 50%
• Engineering Community 50%
• Power Distribution 50%
• Signal Integrity 50%
• Price Pressure 50%
• Decision Tree 50%
• Package Design 50%
• Thermal Challenge 50%
• Array Size 50%
• Wattage 50%
• High Density Packaging 50%
• Price Extremes 50%
• Integrated Package 50%
• Place Design 50%
• Semiconductor Design 50%
• Mechanical Challenges 50%

Engineering

• Electrical Performance 100%
• Chip Scale Packages 100%
• Engineering 50%
• Printed Circuit Board 50%
• Package Design 50%
• Array Size 50%