A novel fluidic switch for high power applications

Joel D. Barrera, Gregory H. Huff, Scott R White, Nancy R Sottos, Anthony Griffin, Jennifer Truman Bernhard

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work proposes a novel fluidic switch topology on coplanar waveguide transmission lines for high power applications. The bridge is created from a transverse fluidic network over the coplanar waveguide containing dispersions of spherical and high aspect ratio nanoparticles. In particular, the volume fraction of gold or silver nanoparticles dispersed into a low-dielectric oil to provide 'on-off' switching states from the electrical conductivity of the fluid. First-order approximations for the fluids specific heat and thermal conductivity show good heat transfer properties for high power applications.

Original languageEnglish (US)
Title of host publication8th European Conference on Antennas and Propagation, EuCAP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages122-123
Number of pages2
ISBN (Electronic)9788890701849
DOIs
StatePublished - Jan 1 2014
Event8th European Conference on Antennas and Propagation, EuCAP 2014 - The Hague, Netherlands
Duration: Apr 6 2014Apr 11 2014

Publication series

Name8th European Conference on Antennas and Propagation, EuCAP 2014

Other

Other8th European Conference on Antennas and Propagation, EuCAP 2014
CountryNetherlands
CityThe Hague
Period4/6/144/11/14

Keywords

  • Coplanar waveguide
  • Fluidics
  • High power
  • Switch
  • Thermal management

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering

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  • Cite this

    Barrera, J. D., Huff, G. H., White, S. R., Sottos, N. R., Griffin, A., & Bernhard, J. T. (2014). A novel fluidic switch for high power applications. In 8th European Conference on Antennas and Propagation, EuCAP 2014 (pp. 122-123). [6901707] (8th European Conference on Antennas and Propagation, EuCAP 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuCAP.2014.6901707