TY - GEN
T1 - A novel decoupling capacitance platform for substrates, sockets, and interposers
AU - Nickel, Josh G.
AU - Rosenberger, Joseph F.
AU - Crane, Stanford W.
AU - Horvath, Zsolt
AU - Jeon, James
AU - Codd, Patrick T.
AU - Cangellaris, Andreas C.
PY - 2004
Y1 - 2004
N2 - Due to increasing demands on the power delivery networks within current and next-generation computer systems, power integrity has become a leading focus, in addition to signal integrity, in system design. In this paper, we will present a technology deployed within substrates, interposers, or sockets to enhance core power delivery. Our technology is comprised of a novel integration of decoupling capacitance between the core power nets and ground. This decoupling replaces the numerous decoupling capacitors suboptimally placed on traditional printed circuit boards (PCBs). The net result it lowered power supply noise and increased core power stability, permitting greater semiconductor switching frequency while reducing overall system cost. Studying actual system applications, we compare this technology to a wide range of expensive and largely ineffective decoupling strategies that have been proposed and even deployed, and demonstrate its superiority in both cost and performance.
AB - Due to increasing demands on the power delivery networks within current and next-generation computer systems, power integrity has become a leading focus, in addition to signal integrity, in system design. In this paper, we will present a technology deployed within substrates, interposers, or sockets to enhance core power delivery. Our technology is comprised of a novel integration of decoupling capacitance between the core power nets and ground. This decoupling replaces the numerous decoupling capacitors suboptimally placed on traditional printed circuit boards (PCBs). The net result it lowered power supply noise and increased core power stability, permitting greater semiconductor switching frequency while reducing overall system cost. Studying actual system applications, we compare this technology to a wide range of expensive and largely ineffective decoupling strategies that have been proposed and even deployed, and demonstrate its superiority in both cost and performance.
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M3 - Conference contribution
AN - SCOPUS:28444484348
SN - 0780388216
SN - 9780780388215
T3 - Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
SP - 231
EP - 234
BT - Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
A2 - Toh, K.C.
A2 - Mui, Y.C.
A2 - How, J.
A2 - Pang, J.H.L.
T2 - 6th Electronics Packaging Technology Conference, EPTC 2004
Y2 - 8 December 2005 through 10 December 2005
ER -