A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Yves Martin, Hidetoshi Numata, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan H. Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

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