A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- , Yoichi Taira
- , Ted W. Lichoulas
- , Nicolas Boyer
- , Yves Martin
- , Hidetoshi Numata
- , Jae Woong Nah
- , Shotaro Takenobu
- , Alexander Janta-Polczynski
- , Eddie L. Kimbrell
- , Robert Leidy
- , Marwan H. Khater
- , Swetha Kamlapurkar
- , Sebastian Engelmann
- , Yurii A. Vlasov
- , Paul Fortier
Research output: Contribution to journal › Article › peer-review