A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities

Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Yves Martin, Hidetoshi Numata, Jae Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan H. Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier

Research output: Contribution to journalArticle

Abstract

Silicon photonics leverages microelectronic fabrication facilities to achieve photonic circuits of unprecedented complexity and cost efficiency. This efficiency does not yet translate to optical packaging, however, which has not evolved substantially from legacy devices. To reach the potential of silicon photonics, we argue that disruptive advances in the packaging cost, scalability in the optical port count, and scalability in the manufacturing volume are required. To attain these, we establish a novel photonic packaging direction based on leveraging existing microelectronics packaging facilities. We demonstrate two approaches to fiber-to-chip interfacing and one to hybrid photonic integration involving direct flip-chip assembly of photonic dies. Self-alignment is used throughout to compensate for insufficient placement accuracy of high-throughput pick and place tools. We show a self-aligned peak transmission of -1.3 dB from standard cleaved fibers to chip and of -1.1 dB from chip to chip. The demonstrated approaches are meant to be universal by simultaneously allowing wide spectral bandwidth for coarse wavelength division multiplexing and large optical-port count.

Original languageEnglish (US)
Article number7517347
Pages (from-to)455-466
Number of pages12
JournalIEEE Journal of Selected Topics in Quantum Electronics
Volume22
Issue number6
DOIs
StatePublished - Nov 1 2016

Keywords

  • Integrated optoelectronics
  • flip-chip devices
  • optical fiber communication
  • optical polymers
  • packaging

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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  • Cite this

    Barwicz, T., Taira, Y., Lichoulas, T. W., Boyer, N., Martin, Y., Numata, H., Nah, J. W., Takenobu, S., Janta-Polczynski, A., Kimbrell, E. L., Leidy, R., Khater, M. H., Kamlapurkar, S., Engelmann, S., Vlasov, Y. A., & Fortier, P. (2016). A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities. IEEE Journal of Selected Topics in Quantum Electronics, 22(6), 455-466. [7517347]. https://doi.org/10.1109/JSTQE.2016.2593637