A new physical picture for surface diffusion at high temperatures

I. I. Suni; E. G. Seebauer

doi:10.1016/0039-6028(94)91279-3

A new physical picture for surface diffusion at high temperatures

I. I. Suni, E. G. Seebauer

Chemical and Biomolecular Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

A new model for the physical mechanism of surface diffusion at high temperatures is developed based on molecular dynamics simulations that explains in a realistic way the high activation energies and pre-exponential factors typically observed at temperatures above about 70% of the substrate melting point. The model is based on adatom-vacancy pair formation on terraces and should apply quite generally to a wide variety of solids.

Original language	English (US)
Pages (from-to)	L235-L238
Journal	Surface Science
Volume	301
Issue number	1-3
DOIs	https://doi.org/10.1016/0039-6028(94)91279-3
State	Published - Jan 10 1994

ASJC Scopus subject areas

Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1016/0039-6028(94)91279-3

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author = "Suni, {I. I.} and Seebauer, {E. G.}",

note = "Funding Information: I{\textquoteleft}his WOIk was supported by NSF Award CTS-(1I ? I9 I7 and by DOE, Materials Research Labo-mtory Con1r act DEFG02-91ER4.5439.",

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AU - Seebauer, E. G.

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A new physical picture for surface diffusion at high temperatures

Abstract

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