@inproceedings{d1030951909d4874b1a05c6dd9ed2966,
title = "A new broadband transmission line model for accurate simulation of dispersive interconnects",
abstract = "This paper presents a new method for the extraction of the frequency-dependent, per-unit-length resistance and inductance parameters of multi-conductor interconnects. The proposed extraction methodology is based on a new formulation of the magneto-quasi-static problem that allows lossy ground planes of finite thickness to be modeled rigorously. The formulation is such that the per-unit-length impedance matrix for the multi-conductor interconnect is extracted directly at a prescribed frequency. Once the matrix has been calculated over the bandwidth of interest, rational function representations of its elements are generated through a robust matrix curve-fitting process. Such a formulation enables subsequent transient analysis of interconnects through a variety of approaches, all of them compatible with general-purpose circuit simulators.",
keywords = "Bandwidth, Curve fitting, Frequency, Impedance, Inductance, Integrated circuit interconnections, Multiconductor transmission lines, Robustness, Transmission line matrix methods, Transmission lines",
author = "J. Morsey and K. Coperich and V. Okhmatovski and Cangellaris, {A. C.} and A. Ruehli",
note = "Publisher Copyright: {\textcopyright} 2000 IEEE.; 3rd Electronics Packaging Technology Conference, EPTC 2000 ; Conference date: 05-12-2000 Through 07-12-2000",
year = "2000",
doi = "10.1109/EPTC.2000.906398",
language = "English (US)",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "345--351",
editor = "Charles Lee and Toh, {Kok Chuan} and Lim, {Thiam Beng}",
booktitle = "Proceedings of 3rd Electronics Packaging Technology Conference, EPTC 2000",
address = "United States",
}