TY - GEN
T1 - A new approach for the evaluation of interfacial reliability in micro-scale
AU - Zhu, Qingsheng
AU - Zhang, Zhefeng
AU - Shang, Jian Ku
AU - Wang, Zhongguang
PY - 2007
Y1 - 2007
N2 - Lead-free solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the lead-free solder/copper single crystal joint. The types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the damage modes of the IMC interface, the interfacial reliability can be well evaluated in micro-scale.
AB - Lead-free solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the lead-free solder/copper single crystal joint. The types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the damage modes of the IMC interface, the interfacial reliability can be well evaluated in micro-scale.
UR - http://www.scopus.com/inward/record.url?scp=50249161066&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249161066&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2007.4441515
DO - 10.1109/ICEPT.2007.4441515
M3 - Conference contribution
AN - SCOPUS:50249161066
SN - 1424413923
SN - 9781424413928
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
BT - Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
T2 - 2007 8th International Conference on Electronic Packaging Technology, ICEPT
Y2 - 14 August 2007 through 17 August 2007
ER -