TY - GEN
T1 - A modular segmentation approach for comprehensive electromagnetic modeling of the power distribution network
AU - Kollia, Varvara
AU - Cangellaris, Andreas C.
PY - 2008/9/15
Y1 - 2008/9/15
N2 - The accurate electromagnetic modeling of the power distribution network at the board level is critical for today's digital applications. In this work, we propose a modular approach for board power distribution network design. The proposed approach relies on the decomposition of the board metallization layers into parallel-plate polygons and the various geometric discontinuities introduced by vias, slots and splits in metallization planes, and the edges of the board. Electromagnetic models for the various segments are generated a-priori and are brought together in a physically consistent manner to yield a compact model for the board that lends itself to an expedient numerical solution toward the generation of a SPICE-compatible, broadband, frequency-dependent multi-port network. Numerical studies are presented that validate the proposed methodology and demonstrate its attributes.
AB - The accurate electromagnetic modeling of the power distribution network at the board level is critical for today's digital applications. In this work, we propose a modular approach for board power distribution network design. The proposed approach relies on the decomposition of the board metallization layers into parallel-plate polygons and the various geometric discontinuities introduced by vias, slots and splits in metallization planes, and the edges of the board. Electromagnetic models for the various segments are generated a-priori and are brought together in a physically consistent manner to yield a compact model for the board that lends itself to an expedient numerical solution toward the generation of a SPICE-compatible, broadband, frequency-dependent multi-port network. Numerical studies are presented that validate the proposed methodology and demonstrate its attributes.
UR - http://www.scopus.com/inward/record.url?scp=51349090686&partnerID=8YFLogxK
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U2 - 10.1109/ECTC.2008.4550039
DO - 10.1109/ECTC.2008.4550039
M3 - Conference contribution
AN - SCOPUS:51349090686
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 638
EP - 645
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -