Abstract
An analytical model is developed for predicting electroplated copper thickness distributions on multilayer printed wiring boards. Plated copper thickness distributions are predicted within a plated-through hole (PTH) by coupled solutions of the potential, kinetics, and mass diffusion equations. The model establishes: (a) correlation parameters including geometric, charge transfer, mass transfer, and ohmic solution effects, and (b) the minimum electrolyte convection required in a PTH to avoid rough or powdery deposits. Predictions are compared with experimental data obtained over a wide range of operating scales from breakers to full-scale production tanks.
Original language | English (US) |
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Pages (from-to) | 990-999 |
Number of pages | 10 |
Journal | Journal of the Electrochemical Society |
Volume | 123 |
Issue number | 7 |
DOIs | |
State | Published - Jul 1976 |
Keywords
- copper deposition
- current distribution
- mathematical model
- multilayer circuit board
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Renewable Energy, Sustainability and the Environment
- Surfaces, Coatings and Films
- Electrochemistry
- Materials Chemistry