A millinewton microloading device

Keyphrases

• Material Characterization 100%
• Microloading 100%
• Low Temperature 50%
• High Temperature 50%
• Single Crystal 50%
• High Pressure 50%
• Environmental Conditions 50%
• Capacitors 50%
• Capacitance 50%
• Etching Process 50%
• Tensile Force 50%
• Material Sample 50%
• Compressive Force 50%
• Polysilicon 50%
• Spring Constant 50%
• Resonant Frequency 50%
• Composite Beam 50%
• Surface Analysis 50%
• Micromechanical Structures 50%
• High Vacuum 50%
• Metallization Process 50%
• Electron Microscopic Analysis 50%
• Submicron Scale 50%
• Vibration Isolation 50%
• Loading Device 50%
• High Humidity 50%
• Microelectromechanical Devices 50%
• Low Thermal Mass 50%
• Vacuum Compatibility 50%
• Vacuum Electron 50%
• Slender Bars 50%
• Reactive Etching 50%
• Buckling Test 50%
• Comb Capacitor 50%

Engineering

• Buckling 100%
• Thin Films 100%
• Low-Temperature 50%
• Metallizations 50%
• Test Sample 50%
• Compressive Force 50%
• Tensile Force 50%
• Polysilicon 50%
• Material Sample 50%
• Resonance Frequency 50%
• Spring Constant 50%
• Composite Beam 50%
• Vibration Isolation 50%
• Loading Device 50%
• High Pressure and High Temperature 50%
• Tip Diameter 50%

Material Science

• Thin Films 100%
• Capacitor 100%
• Single Crystal 50%
• Electron Microscopy 50%
• Capacitance 50%
• Surface Analysis 50%