@inproceedings{3e5796c1a49f471496d6024bde1aa5b4,
title = "A Methodology to Optimize the Number and Placement of Decoupling Capacitors in a Multilevel Power Delivery Network",
abstract = "It is increasingly challenging to satisfy the requirements placed on the power delivery network for a multilevel hierarchical system, due to aggressive voltage scaling and stringent limits on the chip-level voltage droop. This paper presents a methodology to obtain the minimal number of decoupling capacitors for a 4-level hierarchical system to meet the on-chip voltage droop constraints and to optimize the location of those decoupling capacitors to meet a user-specified target impedance. The number and location optimizations are performed using nature-based and Bayesian optimization algorithms along with the quantitative comparison of results.",
keywords = "Bayesian Optimization, Decoupling capacitors, PDN Design, target impedance, voltage droop",
author = "Ram Krishna and Thong Nguyen and Watanabe, {Atom O.} and Dale Becker and Arvind Kumar and Elyse Rosenbaum",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022 ; Conference date: 12-12-2022 Through 14-12-2022",
year = "2022",
doi = "10.1109/EDAPS56906.2022.9995085",
language = "English (US)",
series = "IEEE Electrical Design of Advanced Packaging and Systems Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022",
address = "United States",
}