A Methodology to Optimize the Number and Placement of Decoupling Capacitors in a Multilevel Power Delivery Network

Ram Krishna, Thong Nguyen, Atom O. Watanabe, Dale Becker, Arvind Kumar, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

It is increasingly challenging to satisfy the requirements placed on the power delivery network for a multilevel hierarchical system, due to aggressive voltage scaling and stringent limits on the chip-level voltage droop. This paper presents a methodology to obtain the minimal number of decoupling capacitors for a 4-level hierarchical system to meet the on-chip voltage droop constraints and to optimize the location of those decoupling capacitors to meet a user-specified target impedance. The number and location optimizations are performed using nature-based and Bayesian optimization algorithms along with the quantitative comparison of results.

Original languageEnglish (US)
Title of host publication2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665491945
DOIs
StatePublished - 2022
Externally publishedYes
Event2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022 - Urbana, United States
Duration: Dec 12 2022Dec 14 2022

Publication series

NameIEEE Electrical Design of Advanced Packaging and Systems Symposium
Volume2022-December
ISSN (Print)2151-1225
ISSN (Electronic)2151-1233

Conference

Conference2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022
Country/TerritoryUnited States
CityUrbana
Period12/12/2212/14/22

Keywords

  • Bayesian Optimization
  • Decoupling capacitors
  • PDN Design
  • target impedance
  • voltage droop

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Automotive Engineering
  • General Computer Science

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