A methodology for predicting variability in microstructurally short fatigue crack growth rates

Ken Gall, Huseyin Sehitoglu, Yavuz Kadioglu

Research output: Contribution to journalArticlepeer-review


A finite element model, which implements single crystal constitutive relationships, was used to simulate fatigue cracks growing at the microstructural level. Plastic deformation (slip) was allowed along two specified microscopic crystallographic planes. A.? the orientations of the slip systems were changed several crucial fatigue crack growth parameters, measured over all possible orientations, were found to vary: (I) crack tip forward slip hand size, rp0.03 ≤ rp(Kmax/λ;0)2 ≤0.31 where λ0 is the critical resolved shear stress on a slip system, (2) crack opening displacement, δ, 1.2 ≤ δ/(K2max/Emaxσ0) ≤ 7.8 where Em and σ0, are the elastic modulus and yield stress of a polycrystalline material with many randomly oriented double slip crystals, and (3) crack closure level, Sopen/Smax, 0.02 ≤ Sopen/Smax ≤ 0.35. Corresponding to these differences in crack growth parameters, crack growth laws were used to estimate the expected changes in crack growth rates when microstructurally short cracks grow through grains with different crystallographic orientations. The resulting predictions form approximate upper and lower bounds on crack growth rates for microstructurally short cracks. For several different materials, the crack growth rate variability predictions were in the range 7 ≤ (da/dN)(max)/(da/dN)(min) ≤ 37, which is consistent with experimentally measured variations.

Original languageEnglish (US)
Pages (from-to)171-179
Number of pages9
JournalJournal of Engineering Materials and Technology, Transactions of the ASME
Issue number2
StatePublished - Apr 1997

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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