A method for modeling the impact of conductor surface roughness on waveguiding properties of interconnects

Xiao Ma, Juan S. Ochoa, Andreas C. Cangellaris

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A methodology is proposed for accounting for the impact of random conductor surface roughness in the electromagnetic analysis of the propagation characteristics of high-speed interconnects. The proposed methodology replaces the rough-surface conductor cross-section with a compound one, where a thin outer layer, conforming to the conductor contour and of frequency-dependent thickness and conductivity is used in place of the surface roughness. The resulting compound conductor model facilitates extraction of the waveguiding properties of the interconnect using electromagnetic field solvers. The attributes of the method are demonstrated through the electromagnetic analysis of a microstrip transmission line structure and through correlations with measurement data.

Original languageEnglish (US)
Title of host publication2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
PublisherIEEE Computer Society
Pages11-14
Number of pages4
ISBN (Print)9781467325363
DOIs
StatePublished - Jan 1 2013
Event2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013 - San Jose, CA, United States
Duration: Oct 27 2013Oct 30 2013

Publication series

Name2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013

Other

Other2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013
CountryUnited States
CitySan Jose, CA
Period10/27/1310/30/13

Keywords

  • Propagation losses
  • surface roughness
  • transmission lines

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Ma, X., Ochoa, J. S., & Cangellaris, A. C. (2013). A method for modeling the impact of conductor surface roughness on waveguiding properties of interconnects. In 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013 (pp. 11-14). [6703456] (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013). IEEE Computer Society. https://doi.org/10.1109/EPEPS.2013.6703456