A low cost approach to calibrate on-chip thermal sensors

Krishna Bharath, Chunhua Yao, Nam Sung Kim, Parameswaran Ramanathan, Kewal K. Saluja

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Thermal management of Integration Circuit (IC) becomes more and more important with the scaling of CMOS technology and dramatic increase of power density. Performance of thermal management application is highly related to the accuracy of the temperature monitoring devices. However, due to increasing process variations and parameter drifts, temperature measurements by on-chip thermal sensors may not be accurate unless these sensors are calibrated before shipping the devices to the users. Existing calibration methods impose large time cost and cannot be used for in-field calibration. In this paper, we propose a technique to calibrate on-chip thermal sensors during manufacturing as well as in-field. We model the cyclic dependence between leakage power and temperature and perform calibrations to evaluate the calibration accuracy. Experimental results on 100 dies with different process variation parameters and three corner cases show that our technique have very high accuracy.

Original languageEnglish (US)
Title of host publicationProceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011
Pages572-576
Number of pages5
DOIs
StatePublished - Jun 22 2011
Externally publishedYes
Event12th International Symposium on Quality Electronic Design, ISQED 2011 - Santa Clara, CA, United States
Duration: Mar 14 2011Mar 16 2011

Publication series

NameProceedings of the 12th International Symposium on Quality Electronic Design, ISQED 2011

Other

Other12th International Symposium on Quality Electronic Design, ISQED 2011
Country/TerritoryUnited States
CitySanta Clara, CA
Period3/14/113/16/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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