TY - GEN
T1 - A hierarchical domain decomposition method for rigorous conductor modeling of signal integrity in multi-scale integrated circuits
AU - Shao, Yang
AU - Peng, Zhen
AU - Lee, Jin Fa
PY - 2013
Y1 - 2013
N2 - We present a hierarchical multi-solver domain decomposition method to accurately analyzing the signal integrity problems in multi-scale integrated circuits. Particularly, we discuss in detail a 3-D full wave method to model the conductor loss due to finite conductivities in metals. The proposed multi-solver non-conformal domain decomposition method follows a hierarchical domain partitioning strategy and the original problem is decomposed into non-overlapping subregions. A finite element domain decomposition method is adopted for the dielectric subregion with complex geometries and non-uniform material properties. While for the conductor subregion, a surface integral equation domain decomposition method is applied. To further improve the convergence in the DDM iterations, optimized transmission conditions are introduced to enforce the field continuities across sub-domain interfaces. Moreover, a hierarchical multi-level fast multiple method is adopted to address the low frequency issues particularly in IC applications. Rigorous numerical experiments validate the potential benefits offered by the proposed method.
AB - We present a hierarchical multi-solver domain decomposition method to accurately analyzing the signal integrity problems in multi-scale integrated circuits. Particularly, we discuss in detail a 3-D full wave method to model the conductor loss due to finite conductivities in metals. The proposed multi-solver non-conformal domain decomposition method follows a hierarchical domain partitioning strategy and the original problem is decomposed into non-overlapping subregions. A finite element domain decomposition method is adopted for the dielectric subregion with complex geometries and non-uniform material properties. While for the conductor subregion, a surface integral equation domain decomposition method is applied. To further improve the convergence in the DDM iterations, optimized transmission conditions are introduced to enforce the field continuities across sub-domain interfaces. Moreover, a hierarchical multi-level fast multiple method is adopted to address the low frequency issues particularly in IC applications. Rigorous numerical experiments validate the potential benefits offered by the proposed method.
KW - Conductor loss
KW - Generalized combined field integral equation
KW - Multi-solver domain decomposition method
KW - Signal integrity
KW - Surface integral equation
UR - http://www.scopus.com/inward/record.url?scp=84893232394&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893232394&partnerID=8YFLogxK
U2 - 10.1109/MWSYM.2013.6697703
DO - 10.1109/MWSYM.2013.6697703
M3 - Conference contribution
AN - SCOPUS:84893232394
SN - 9781467361767
T3 - IEEE MTT-S International Microwave Symposium Digest
BT - 2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
T2 - 2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
Y2 - 2 June 2013 through 7 June 2013
ER -