A hierarchical domain decomposition method for rigorous conductor modeling of signal integrity in multi-scale integrated circuits

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a hierarchical multi-solver domain decomposition method to accurately analyzing the signal integrity problems in multi-scale integrated circuits. Particularly, we discuss in detail a 3-D full wave method to model the conductor loss due to finite conductivities in metals. The proposed multi-solver non-conformal domain decomposition method follows a hierarchical domain partitioning strategy and the original problem is decomposed into non-overlapping subregions. A finite element domain decomposition method is adopted for the dielectric subregion with complex geometries and non-uniform material properties. While for the conductor subregion, a surface integral equation domain decomposition method is applied. To further improve the convergence in the DDM iterations, optimized transmission conditions are introduced to enforce the field continuities across sub-domain interfaces. Moreover, a hierarchical multi-level fast multiple method is adopted to address the low frequency issues particularly in IC applications. Rigorous numerical experiments validate the potential benefits offered by the proposed method.

Original languageEnglish (US)
Title of host publication2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
DOIs
StatePublished - Dec 1 2013
Externally publishedYes
Event2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013 - Seattle, WA, United States
Duration: Jun 2 2013Jun 7 2013

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Other

Other2013 IEEE MTT-S International Microwave Symposium Digest, MTT 2013
Country/TerritoryUnited States
CitySeattle, WA
Period6/2/136/7/13

Keywords

  • Conductor loss
  • Generalized combined field integral equation
  • Multi-solver domain decomposition method
  • Signal integrity
  • Surface integral equation

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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