A delayed curing ROMP based thermosetting resin

Ryan Baumgartner, Konrad Ryba, Ziyuan Song, Ruibo Wang, Keith Harris, Joshua S. Katz, Jianjun Cheng

Research output: Contribution to journalArticle

Abstract

Here, we develop a heat curing thermosetting resin using ring-opening metathesis polymerization. The resin has a prolonged working time at room temperature and cures rapidly at elevated temperatures. We detail the delayed cure activity and investigate the resulting thermal and mechanical properties of the cured materials.

Original languageEnglish (US)
Pages (from-to)5093-5098
Number of pages6
JournalPolymer Chemistry
Volume7
Issue number32
DOIs
StatePublished - Aug 28 2016

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Thermosets
Curing
Thermodynamic properties
Hot Temperature
Temperature
Ring opening polymerization
Polymerization
Resins
Mechanical properties

ASJC Scopus subject areas

  • Bioengineering
  • Biochemistry
  • Polymers and Plastics
  • Organic Chemistry

Cite this

Baumgartner, R., Ryba, K., Song, Z., Wang, R., Harris, K., Katz, J. S., & Cheng, J. (2016). A delayed curing ROMP based thermosetting resin. Polymer Chemistry, 7(32), 5093-5098. https://doi.org/10.1039/c6py00754f

A delayed curing ROMP based thermosetting resin. / Baumgartner, Ryan; Ryba, Konrad; Song, Ziyuan; Wang, Ruibo; Harris, Keith; Katz, Joshua S.; Cheng, Jianjun.

In: Polymer Chemistry, Vol. 7, No. 32, 28.08.2016, p. 5093-5098.

Research output: Contribution to journalArticle

Baumgartner, R, Ryba, K, Song, Z, Wang, R, Harris, K, Katz, JS & Cheng, J 2016, 'A delayed curing ROMP based thermosetting resin', Polymer Chemistry, vol. 7, no. 32, pp. 5093-5098. https://doi.org/10.1039/c6py00754f
Baumgartner R, Ryba K, Song Z, Wang R, Harris K, Katz JS et al. A delayed curing ROMP based thermosetting resin. Polymer Chemistry. 2016 Aug 28;7(32):5093-5098. https://doi.org/10.1039/c6py00754f
Baumgartner, Ryan ; Ryba, Konrad ; Song, Ziyuan ; Wang, Ruibo ; Harris, Keith ; Katz, Joshua S. ; Cheng, Jianjun. / A delayed curing ROMP based thermosetting resin. In: Polymer Chemistry. 2016 ; Vol. 7, No. 32. pp. 5093-5098.
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