Abstract
The fatigue resistance of the interface between electroless-nickel and the eutectic tin-lead solder alloy was examined in the as-reflowed and aged conditions and compared to fatigue behavior of the copper/solder interface under the same conditions. In the as-reflowed state, the fatigue resistance of the solder/electroless-nickel interface was slightly superior to that of the solder/copper interface. However, after long-term aging, the fatigue resistance of the solder/electroless-nickel interface became far worse in the high crack growth rate regime. Examinations of interfacial microstructures and crack growth mechanisms indicated that the differences in fatigue resistance between the two interfaces were not directly related to the thickness of the intermetallic phase at the interface, as commonly believed, but were due to differences in crack growth mechanisms.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 2347-2355 |
| Number of pages | 9 |
| Journal | Journal of Materials Research |
| Volume | 15 |
| Issue number | 11 |
| DOIs | |
| State | Published - Nov 2000 |
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering