TY - GEN
T1 - 9nm node wafer defect inspection using visible light
AU - Zhou, Renjie
AU - Edwards, Chris
AU - Popescu, Gabriel
AU - Goddard, Lynford L.
PY - 2014
Y1 - 2014
N2 - Over the past 2 years, we have developed a common optical-path, 532 nm laser epi-illumination diffraction phase microscope (epi-DPM) and successfully applied it to detect different types of defects down to 20 by 100 nm in a 22nm node intentional defect array (IDA) wafer. An image post-processing method called 2DISC, using image frame 2nd order differential, image stitching, and convolution, was used to significantly improve sensitivity of the measured images. To address 9nm node IDA wafer inspection, we updated our system with a highly stable 405 nm diode laser. By using the 2DISC method, we detected parallel bridge defects in the 9nm node wafer. To further enhance detectability, we are exploring 3D wafer scanning, white-light illumination, and dark-field inspection.
AB - Over the past 2 years, we have developed a common optical-path, 532 nm laser epi-illumination diffraction phase microscope (epi-DPM) and successfully applied it to detect different types of defects down to 20 by 100 nm in a 22nm node intentional defect array (IDA) wafer. An image post-processing method called 2DISC, using image frame 2nd order differential, image stitching, and convolution, was used to significantly improve sensitivity of the measured images. To address 9nm node IDA wafer inspection, we updated our system with a highly stable 405 nm diode laser. By using the 2DISC method, we detected parallel bridge defects in the 9nm node wafer. To further enhance detectability, we are exploring 3D wafer scanning, white-light illumination, and dark-field inspection.
KW - 9nm node wafer
KW - dark-field imaging
KW - image processing
KW - phase imaging
KW - signal to noise ratio
KW - wafer defect inspection
UR - http://www.scopus.com/inward/record.url?scp=84902108722&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84902108722&partnerID=8YFLogxK
U2 - 10.1117/12.2046451
DO - 10.1117/12.2046451
M3 - Conference contribution
AN - SCOPUS:84902108722
SN - 9780819499738
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Metrology, Inspection, and Process Control for Microlithography XXVIII
PB - SPIE
T2 - Metrology, Inspection, and Process Control for Microlithography XXVIII
Y2 - 24 February 2014 through 27 February 2014
ER -