40 Gb/s VCSELs test data collection, analysis, and process problem identification

Junyi Qiu; Hsiao Lun Wang; Curtis Y.L. Wang; Xin Yu; Milton Feng

40 Gb/s VCSELs test data collection, analysis, and process problem identification

Junyi Qiu, Hsiao Lun Wang, Curtis Y.L. Wang, Xin Yu, Milton Feng

Electrical and Computer Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper reviews the on-wafer testing and subsequent data analysis procedures of 40 Gb/s oxide-confined VCSELs. Several key performance metrics are carefully defined and their measurement procedure explained. After data collection, a wafer-scale heat map is constructed to help to visualize device performance uniformity in terms of output power, threshold, and optical aperture diameter. Further data analysis reveals that the large variation of output power in this sample can be attributed to the VCSEL window quality, which is confirmed by reexamining the sample. Thus we have used VCSEL testing data analysis techniques to identify device processing issues, fully utilizing device testing as important quality assurance and information feedback step.

Original language	English (US)
State	Published - 2017
Event	2017 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2017 - Indian Wells, United States Duration: May 22 2017 → May 25 2017

Other

Other	2017 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2017
Country/Territory	United States
City	Indian Wells
Period	5/22/17 → 5/25/17

Keywords

Data analysis
Testing
VCSEL

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

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title = "40 Gb/s VCSELs test data collection, analysis, and process problem identification",

abstract = "This paper reviews the on-wafer testing and subsequent data analysis procedures of 40 Gb/s oxide-confined VCSELs. Several key performance metrics are carefully defined and their measurement procedure explained. After data collection, a wafer-scale heat map is constructed to help to visualize device performance uniformity in terms of output power, threshold, and optical aperture diameter. Further data analysis reveals that the large variation of output power in this sample can be attributed to the VCSEL window quality, which is confirmed by reexamining the sample. Thus we have used VCSEL testing data analysis techniques to identify device processing issues, fully utilizing device testing as important quality assurance and information feedback step.",

keywords = "Data analysis, Testing, VCSEL",

author = "Junyi Qiu and Wang, {Hsiao Lun} and Wang, {Curtis Y.L.} and Xin Yu and Milton Feng",

note = "Funding Information: We sincerely acknowledge the generous sponsorship of this research project by Foxconn Interconnect Technology (FIT) and guidance from Mr. Joe Liu and Dr. Ben Liaw. This work is supported in part by Dr. Michael Gerhold, Army Research Office (ARO) under Grant W911NF-17-1-0112, as well as Dr. Kenneth C. Goretta, Air Force of Scientific Research (AFOSR) under Grant FA9550-15-1-0122. Mr. Curtis Wang would like to thank the National Defense Science and Engineering Graduate (NDSEG) Fellowship for the support.; 2017 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2017 ; Conference date: 22-05-2017 Through 25-05-2017",

year = "2017",

language = "English (US)",

}

TY - CONF

T1 - 40 Gb/s VCSELs test data collection, analysis, and process problem identification

AU - Qiu, Junyi

AU - Wang, Hsiao Lun

AU - Wang, Curtis Y.L.

AU - Yu, Xin

AU - Feng, Milton

N1 - Funding Information: We sincerely acknowledge the generous sponsorship of this research project by Foxconn Interconnect Technology (FIT) and guidance from Mr. Joe Liu and Dr. Ben Liaw. This work is supported in part by Dr. Michael Gerhold, Army Research Office (ARO) under Grant W911NF-17-1-0112, as well as Dr. Kenneth C. Goretta, Air Force of Scientific Research (AFOSR) under Grant FA9550-15-1-0122. Mr. Curtis Wang would like to thank the National Defense Science and Engineering Graduate (NDSEG) Fellowship for the support.

PY - 2017

Y1 - 2017

N2 - This paper reviews the on-wafer testing and subsequent data analysis procedures of 40 Gb/s oxide-confined VCSELs. Several key performance metrics are carefully defined and their measurement procedure explained. After data collection, a wafer-scale heat map is constructed to help to visualize device performance uniformity in terms of output power, threshold, and optical aperture diameter. Further data analysis reveals that the large variation of output power in this sample can be attributed to the VCSEL window quality, which is confirmed by reexamining the sample. Thus we have used VCSEL testing data analysis techniques to identify device processing issues, fully utilizing device testing as important quality assurance and information feedback step.

AB - This paper reviews the on-wafer testing and subsequent data analysis procedures of 40 Gb/s oxide-confined VCSELs. Several key performance metrics are carefully defined and their measurement procedure explained. After data collection, a wafer-scale heat map is constructed to help to visualize device performance uniformity in terms of output power, threshold, and optical aperture diameter. Further data analysis reveals that the large variation of output power in this sample can be attributed to the VCSEL window quality, which is confirmed by reexamining the sample. Thus we have used VCSEL testing data analysis techniques to identify device processing issues, fully utilizing device testing as important quality assurance and information feedback step.

KW - Data analysis

KW - Testing

KW - VCSEL

UR - http://www.scopus.com/inward/record.url?scp=85029480370&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85029480370&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:85029480370

T2 - 2017 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2017

Y2 - 22 May 2017 through 25 May 2017

ER -

40 Gb/s VCSELs test data collection, analysis, and process problem identification

Abstract

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Keywords

ASJC Scopus subject areas

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