TY - JOUR
T1 - 3D hardware packages for parallel architectures
AU - Bechennec, J. L.
AU - Cappello, F.
AU - Etiemble, D.
N1 - Funding Information:
This work is currently supported by french national research program on New Computer Architectures (PRC-ANM) and by DRET under grant #8934232004707501
PY - 1991/8
Y1 - 1991/8
N2 - We present different 3D hardware packages for the implementation of parallel architectures with a 3D-mesh. They can be used with shared memory MIMD multiprocessors or massively parallel message passing MIMD multicomputers. Two versions for monochip and multichip packages, and one version for 3D board assembly are detailed. The basic features are discussed : packing density, electrical properties, cooling and fault tolerance.
AB - We present different 3D hardware packages for the implementation of parallel architectures with a 3D-mesh. They can be used with shared memory MIMD multiprocessors or massively parallel message passing MIMD multicomputers. Two versions for monochip and multichip packages, and one version for 3D board assembly are detailed. The basic features are discussed : packing density, electrical properties, cooling and fault tolerance.
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U2 - 10.1016/0165-6074(91)90341-P
DO - 10.1016/0165-6074(91)90341-P
M3 - Article
AN - SCOPUS:0026202383
VL - 32
SP - 171
EP - 177
JO - Euromicro Newsletter
JF - Euromicro Newsletter
SN - 1383-7621
IS - 1-5
ER -