3D hardware packages for parallel architectures

J. L. Bechennec, F. Cappello, D. Etiemble

Research output: Contribution to journalArticlepeer-review

Abstract

We present different 3D hardware packages for the implementation of parallel architectures with a 3D-mesh. They can be used with shared memory MIMD multiprocessors or massively parallel message passing MIMD multicomputers. Two versions for monochip and multichip packages, and one version for 3D board assembly are detailed. The basic features are discussed : packing density, electrical properties, cooling and fault tolerance.

Original languageEnglish (US)
Pages (from-to)171-177
Number of pages7
JournalMicroprocessing and Microprogramming
Volume32
Issue number1-5
DOIs
StatePublished - Aug 1991
Externally publishedYes

ASJC Scopus subject areas

  • Engineering(all)

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