TY - GEN
T1 - 3-D full-package signal integrity analysis using domain decomposition method
AU - Shao, Yang
AU - Peng, Zhen
AU - Lee, Jin Fa
PY - 2010
Y1 - 2010
N2 - Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.
AB - Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.
UR - http://www.scopus.com/inward/record.url?scp=78650953459&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78650953459&partnerID=8YFLogxK
U2 - 10.1109/EPEPS.2010.5642570
DO - 10.1109/EPEPS.2010.5642570
M3 - Conference contribution
AN - SCOPUS:78650953459
SN - 9781424468652
T3 - 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
SP - 157
EP - 160
BT - 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
PB - IEEE Computer Society
ER -