3-D full-package signal integrity analysis using domain decomposition method

Yang Shao; Zhen Peng; Jin Fa Lee

doi:10.1109/EPEPS.2010.5642570

3-D full-package signal integrity analysis using domain decomposition method

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.

Original language	English (US)
Title of host publication	2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
Publisher	IEEE Computer Society
Pages	157-160
Number of pages	4
ISBN (Print)	9781424468652
DOIs	https://doi.org/10.1109/EPEPS.2010.5642570
State	Published - 2010
Externally published	Yes

Publication series

Name	2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Online availability

10.1109/EPEPS.2010.5642570

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Shao, Y., Peng, Z., & Lee, J. F. (2010). 3-D full-package signal integrity analysis using domain decomposition method. In 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 (pp. 157-160). [5642570] (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010). IEEE Computer Society. https://doi.org/10.1109/EPEPS.2010.5642570

3-D full-package signal integrity analysis using domain decomposition method. / Shao, Yang ; Peng, Zhen; Lee, Jin Fa.

2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, 2010. p. 157-160 5642570 (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shao, Y , Peng, Z & Lee, JF 2010, 3-D full-package signal integrity analysis using domain decomposition method. in 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010., 5642570, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, IEEE Computer Society, pp. 157-160. https://doi.org/10.1109/EPEPS.2010.5642570

Shao Y , Peng Z, Lee JF. 3-D full-package signal integrity analysis using domain decomposition method. In 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society. 2010. p. 157-160. 5642570. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010). doi: 10.1109/EPEPS.2010.5642570

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3-D full-package signal integrity analysis using domain decomposition method

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