3-D full-package signal integrity analysis using domain decomposition method

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.

Original languageEnglish (US)
Title of host publication2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
PublisherIEEE Computer Society
Pages157-160
Number of pages4
ISBN (Print)9781424468652
DOIs
StatePublished - Jan 1 2010

Publication series

Name2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Shao, Y., Peng, Z., & Lee, J. F. (2010). 3-D full-package signal integrity analysis using domain decomposition method. In 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 (pp. 157-160). [5642570] (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010). IEEE Computer Society. https://doi.org/10.1109/EPEPS.2010.5642570