3-D full-package signal integrity analysis using domain decomposition method

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.

Original languageEnglish (US)
Title of host publication2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
PublisherIEEE Computer Society
Pages157-160
Number of pages4
ISBN (Print)9781424468652
DOIs
StatePublished - Jan 1 2010
Externally publishedYes

Publication series

Name2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

Fingerprint

Domain decomposition methods
Signal systems
Integrated circuits
Metals
Computer simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Shao, Y., Peng, Z., & Lee, J. F. (2010). 3-D full-package signal integrity analysis using domain decomposition method. In 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 (pp. 157-160). [5642570] (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010). IEEE Computer Society. https://doi.org/10.1109/EPEPS.2010.5642570

3-D full-package signal integrity analysis using domain decomposition method. / Shao, Yang; Peng, Zhen; Lee, Jin Fa.

2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, 2010. p. 157-160 5642570 (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Shao, Y, Peng, Z & Lee, JF 2010, 3-D full-package signal integrity analysis using domain decomposition method. in 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010., 5642570, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, IEEE Computer Society, pp. 157-160. https://doi.org/10.1109/EPEPS.2010.5642570
Shao Y, Peng Z, Lee JF. 3-D full-package signal integrity analysis using domain decomposition method. In 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society. 2010. p. 157-160. 5642570. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010). https://doi.org/10.1109/EPEPS.2010.5642570
Shao, Yang ; Peng, Zhen ; Lee, Jin Fa. / 3-D full-package signal integrity analysis using domain decomposition method. 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, 2010. pp. 157-160 (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).
@inproceedings{9e8ba5decba94854aa5c660031fdfc34,
title = "3-D full-package signal integrity analysis using domain decomposition method",
abstract = "Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.",
author = "Yang Shao and Zhen Peng and Lee, {Jin Fa}",
year = "2010",
month = "1",
day = "1",
doi = "10.1109/EPEPS.2010.5642570",
language = "English (US)",
isbn = "9781424468652",
series = "2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010",
publisher = "IEEE Computer Society",
pages = "157--160",
booktitle = "2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010",

}

TY - GEN

T1 - 3-D full-package signal integrity analysis using domain decomposition method

AU - Shao, Yang

AU - Peng, Zhen

AU - Lee, Jin Fa

PY - 2010/1/1

Y1 - 2010/1/1

N2 - Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.

AB - Advances in integrated circuit and package technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for faster speed and higher performance in today's electronic products. However, whether the high-speed systems preserve signal integrity has become a crucial question for system designers. In this work, we introduce a systematic numerical simulation method for 3-D full package simulation. A non-conformal finite element domain decomposition method with second order transmission condition is proposed to iterative the matrix equation solution. Numerical results verify the analysis and demonstrate the effectiveness of the proposed method on a real-life 3-D full package signal integrity analysis.

UR - http://www.scopus.com/inward/record.url?scp=78650953459&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78650953459&partnerID=8YFLogxK

U2 - 10.1109/EPEPS.2010.5642570

DO - 10.1109/EPEPS.2010.5642570

M3 - Conference contribution

AN - SCOPUS:78650953459

SN - 9781424468652

T3 - 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

SP - 157

EP - 160

BT - 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

PB - IEEE Computer Society

ER -