3-D companding using linear arrays for improved strain imaging

M. F. Insana, P. Chaturvedi, T. J. Hall, M. Bilgen

Research output: Contribution to journalConference article

Abstract

Three-dimensional (3-D) companding is applied to volume sets of rf echo signals to reduce decorrelation noise in strain images. Companding conditions echo signals to be cross-correlated to improve coherence and minimize decorrelation noise caused by complex 3-D motion. Previously, we showed that 2-D companding was able to eliminate decorrelation noise in strain images up to 5% compression if the out-of-plane displacement was negligible. This paper extends those methods to three dimensions, thus reducing the need to control boundary conditions. 3-D companding is also limited at high compressions (>5%) because of high strain gradients and rotation and shearing motions. A series of phantom studies illustrate the advantages and limitation of 3-D companding with and without aberrating layers.

Original languageEnglish (US)
Pages (from-to)1435-1438
Number of pages4
JournalProceedings of the IEEE Ultrasonics Symposium
Volume2
StatePublished - Dec 1 1997
Externally publishedYes
EventProceedings of the 1997 IEEE Ultrasonics Symposium. Part 1 (of 2) - Toronto, Can
Duration: Oct 5 1997Oct 8 1997

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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