2nd microtherm workshop and tutorial Albuquerque convention center

David G Cahill, G. Chen, M. S. Dresselhaus, K. E. Goodson, C. M. Ho, J. Longtin, A. Majumdar, L. Phinney, R. Pohl, C. L. Tien, C. Wong

Research output: Contribution to journalArticle

Original languageEnglish (US)
Pages (from-to)215-225
Number of pages11
JournalMicroscale Thermophysical Engineering
Volume2
Issue number4
StatePublished - Oct 1 1998
Externally publishedYes

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science (miscellaneous)
  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Physics and Astronomy (miscellaneous)

Cite this

Cahill, D. G., Chen, G., Dresselhaus, M. S., Goodson, K. E., Ho, C. M., Longtin, J., ... Wong, C. (1998). 2nd microtherm workshop and tutorial Albuquerque convention center. Microscale Thermophysical Engineering, 2(4), 215-225.

2nd microtherm workshop and tutorial Albuquerque convention center. / Cahill, David G; Chen, G.; Dresselhaus, M. S.; Goodson, K. E.; Ho, C. M.; Longtin, J.; Majumdar, A.; Phinney, L.; Pohl, R.; Tien, C. L.; Wong, C.

In: Microscale Thermophysical Engineering, Vol. 2, No. 4, 01.10.1998, p. 215-225.

Research output: Contribution to journalArticle

Cahill, DG, Chen, G, Dresselhaus, MS, Goodson, KE, Ho, CM, Longtin, J, Majumdar, A, Phinney, L, Pohl, R, Tien, CL & Wong, C 1998, '2nd microtherm workshop and tutorial Albuquerque convention center', Microscale Thermophysical Engineering, vol. 2, no. 4, pp. 215-225.
Cahill DG, Chen G, Dresselhaus MS, Goodson KE, Ho CM, Longtin J et al. 2nd microtherm workshop and tutorial Albuquerque convention center. Microscale Thermophysical Engineering. 1998 Oct 1;2(4):215-225.
Cahill, David G ; Chen, G. ; Dresselhaus, M. S. ; Goodson, K. E. ; Ho, C. M. ; Longtin, J. ; Majumdar, A. ; Phinney, L. ; Pohl, R. ; Tien, C. L. ; Wong, C. / 2nd microtherm workshop and tutorial Albuquerque convention center. In: Microscale Thermophysical Engineering. 1998 ; Vol. 2, No. 4. pp. 215-225.
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