@inproceedings{7191f7f888a84d71b2621fb73c25618c,
title = "25.4 A 20nm 6GB Function-In-Memory DRAM, Based on HBM2 with a 1.2TFLOPS Programmable Computing Unit Using Bank-Level Parallelism, for Machine Learning Applications",
abstract = "In recent years, artificial intelligence (AI) technology has proliferated rapidly and widely into application areas such as speech recognition, health care, and autonomous driving. To increase the capabilities of AI more powerful systems are needed to process a larger amount of data. This requirement has made domain-specific accelerators, such as GPUs and TPUs, popular; as they can provide orders of magnitude higher performance than state-of-the-art CPUs. However, these accelerators can only operate at their peak performance when they get the necessary data from memory as quickly as it is processed: requiring off-chip memory with a high bandwidth and a large capacity [1]. HBM has thus far met the bandwidth and capacity requirement [2] -[6], but recent AI technologies such as recurrent neural networks require an even higher bandwidth than HBM [7]-[8]. While a further increase in off-chip bandwidth can be accomplished by various techniques, it is often limited by power constraints at the chip or system level [9]. Hence, it is essential to decrease demand for off-chip bandwidth with unconventional architectures: such as processing-in-memory. In this paper, we present function-In-memory DRAM (FIMDRAM) that integrates a 16-wide single-instruction multiple-data engine within the memory banks and that exploits bank-level parallelism to provide 4 \times higher processing bandwidth than an off-chip memory solution. Second, we show techniques that do not require any modification to conventional memory controllers and their command protocols, which make FIMDRAM more practical for quick industry adoption. Finally, we conclude this paper with circuit- and system-level evaluations of our fabricated FIMDRAM.",
author = "Kwon, {Young Cheon} and Lee, {Suk Han} and Jaehoon Lee and Kwon, {Sang Hyuk} and Ryu, {Je Min} and Son, {Jong Pil} and O. Seongil and Yu, {Hak Soo} and Haesuk Lee and Kim, {Soo Young} and Youngmin Cho and Kim, {Jin Guk} and Jongyoon Choi and Shin, {Hyun Sung} and Jin Kim and Phuah, {Beng Seng} and Kim, {Hyoung Min} and Song, {Myeong Jun} and Ahn Choi and Daeho Kim and Kim, {Soo Young} and Kim, {Eun Bong} and David Wang and Shinhaeng Kang and Yuhwan Ro and Seungwoo Seo and Song, {Joon Ho} and Jaeyoun Youn and Kyomin Sohn and Kim, {Nam Sung}",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 ; Conference date: 13-02-2021 Through 22-02-2021",
year = "2021",
month = feb,
day = "13",
doi = "10.1109/ISSCC42613.2021.9365862",
language = "English (US)",
series = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "350--352",
booktitle = "2021 IEEE International Solid-State Circuits Conference, ISSCC 2021 - Digest of Technical Papers",
address = "United States",
}