Network

Adrian Perrig

  • Swiss Federal Institute of Technology Zurich
  • Carnegie Mellon University
  • Carnegie Mellon University
  • University of California, Berkeley
  • IEEE
  • Dept. of Elec. and Comp. Engineering
  • Electrical Engineering Department
  • Dept. of Elec. and Computer Engineering Engineering and Public Policy, and Computer Science
  • Department of Computer Science
  • University of California at Berkeley
  • Carnegie Mellon CyLab Japan

External person

Sang Yoon Chang

  • Advanced Digital Sciences Center
  • University of Illinois Urbana-Champaign
  • Advanced Digital Sciences Center
  • University of Colorado Colorado Springs
  • Department of the Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Colorado Boulder
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jerry T. Chiang

  • Advanced Digital Sciences Center
  • University of Illinois Urbana-Champaign
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Advanced Digital Sciences Center

External person

Jason J. Haas

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Computer Systems and Technologies Business Area
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David B. Johnson

  • Rice University
  • Carnegie Mellon University
  • Department of Computer Science
  • Carnegie Mellon University

External person

Zhuotao Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Hong Kong University of Science and Technology
  • HyperService Consortium
  • University of Illinois at Urbana-Champaign
  • Tsinghua University
  • University of Illinois at Urbana-Champaign

External person

P. R. Kumar

  • Department of Electrical and Computer Engineering
  • Texas A&M University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Texas AandM University
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Science and Engineering
  • Stanford University
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Corning Incorporated
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Texas A&m University

External person

Kenneth P. Laberteaux

  • Toyota Research Institute
  • Toyota Technological Institute
  • Toyota Technical Center
  • Toyota Motor
  • Toyota Research Institute of North America

External person

J. Harshan

  • Advanced Digital Sciences Center
  • Indian Institute of Technology Delhi
  • University of Colorado Colorado Springs
  • Advanced Digital Sciences Center

External person

Dongho Kim

  • University of Illinois Urbana-Champaign
  • Hewlett-Packard
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jihyuk Choi

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sristi Lakshmi Sravana Kumar

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center of UIUC

External person

Bo Rong Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • UIUC

External person

Jonathan Ponniah

  • Texas A&M University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering, Texas AandM University
  • San Jose State University
  • University of Illinois at Urbana-Champaign
  • Texas A&m University

External person

Ertem Esiner

  • Advanced Digital Sciences Center of UIUC
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte Ltd
  • Illinois Advanced Research Center

External person

Utku Tefek

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center of UIUC

External person

Dan Wendlandt

  • Carnegie Mellon University
  • Carnegie Mellon University
  • Carnegie Mellon CyLab Japan

External person

Daisuke Mashima

  • Fujitsu
  • Advanced Digital Sciences Center of UIUC
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte Ltd
  • Illinois at Singapore Pte.
  • Illinois Advanced Research Center
  • Illinois Advanced Research Center at Singapore (IARCS)

External person

Nicola Laurenti

  • University of Padua
  • Dipt. Ingegneria dell Informazione
  • Department of Information Engineering

External person

Binbin Chen

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced Digital Sciences Center
  • Singapore University of Technology and Design
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Illinois at Singapore Pte. Ltd.

External person

Qi Li

  • Tsinghua University
  • National Climate Center China
  • Graduate School at Shenzhen
  • Tsinghua National Laboratory for Information Science and Technology
  • East China University of Science and Technology

External person

Hsu Chun Hsiao

  • Carnegie Mellon University
  • National Taiwan University
  • National Taiwan University
  • Carnegie Mellon University
  • Academia Sinica Taiwan

External person

Yangxi Xiang

  • Beijing University of Posts and Telecommunications

External person

Haoyu Wang

  • Beijing University of Posts and Telecommunications
  • Tsinghua University

External person

Seungmin Kang

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center of UIUC

External person

Hao Wu

  • University of Illinois Urbana-Champaign
  • Rubrik, Inc.
  • Rubrik Inc
  • University of Illinois at Urbana-Champaign

External person

Helen J. Wang

  • Microsoft USA
  • Systems and Networking Research Group

External person

Jinhui Song

  • University of Illinois at Urbana-Champaign

External person

Cristina Basescu

  • Swiss Federal Institute of Technology Zurich

External person

Manthan Kabra

  • Indian Institute of Technology Delhi

External person

Amogh Vithalkar

  • Indian Institute of Technology Delhi

External person

Kyung Joon Park

  • Seoul National University
  • Daegu Gyeongbuk Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Computer Science, University of Illinois
  • School of Electrical Eng./Comp. Sci.
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Information and Communication Engineering
  • Department of Information and Communication Engineering
  • School of Electrical Engineering and Computer Science
  • Dept. of ICE
  • School of Electrical Eng. & Computer Science
  • Department of Information and Communication Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Bruce Maggs

  • Carnegie Mellon University
  • Akamai
  • Duke University
  • Dukes
  • Akamai Technologies
  • Emerald Innovations
  • Duke University
  • Carnegie Mellon University
  • Emerald Technologies

External person

Ke Xu

  • Tsinghua National Laboratory for Information Science and Technology
  • Tsinghua University

External person

Xusheng Xiao

  • North Carolina State University
  • NEC Laboratories America, Inc.
  • Dept. of Computer Science
  • Case Western Reserve University
  • HyperService Consortium
  • Case Western Reserve University

External person

Bao Anh N Tran

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Wargaming
  • Advanced Digital Sciences Center

External person

Limin Jia

  • CyLab, CMU
  • Carnegie Mellon University
  • ECE, INI, CMU
  • Carnegie Mellon University
  • INI
  • Carnegie Mellon CyLab Japan

External person

Prafull Manav

  • Indian Institute of Technology Delhi

External person

Wade Trappe

  • University of Medicine and Dentistry of New Jersey
  • Rutgers - The State University of New Jersey, New Brunswick
  • WinLab

External person

Jian Shi

  • Case Western Reserve University
  • Case Western Reserve University

External person

Elaine Shi

  • Carnegie Mellon University
  • University of Maryland, College Park
  • Cornell University
  • Initiative for CryptoCurrencies and Contracts (IC3)
  • Initiative for Cryptocurrencies and Contracts (IC3)
  • Jacobs Technion-Cornell Innovation Institute, Cornell Tech
  • Computer Science Dept
  • Carnegie Mellon University
  • University of Maryland
  • University of Illinois at Urbana-Champaign

External person

Jorjeta G. Jetcheva

  • Fujitsu
  • Carnegie Mellon University

External person

Younghee Park

  • San Jose State University
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Meiyuan Zhao

  • Intel
  • Dartmouth College
  • Department of CS
  • Department of Computer Science
  • Department of Computer Science

External person

Bryan Parno

  • Carnegie Mellon University
  • Microsoft USA
  • Carnegie Mellon University

External person

Roberto Solis Robles

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Daniele Asoni

  • Swiss Federal Institute of Technology Zurich

External person

Peng Gao

  • University of California, Berkeley
  • University of California at Berkeley
  • University of Notre Dame
  • Virginia Polytechnic Institute and State University

External person

Tiffany Hyun Jin Kim

  • CyLab, CMU
  • Swiss Federal Institute of Technology Zurich
  • Carnegie Mellon University
  • Carnegie Mellon University
  • Carnegie Mellon CyLab Japan

External person

Hao Jin

  • Nanjing University
  • Computer Science and Technology

External person

Farhana Ashraf

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sreejaya Viswanathan

  • Advanced Digital Sciences Center

External person

Yu Tsao

  • Academia Sinica - Research Center for Information Technology Innovation
  • Chinese Academy of Sciences

External person

Bo Wu

  • Tsinghua National Laboratory for Information Science and Technology (TNList)
  • Tsinghua University
  • National Climate Center China
  • Tsinghua National Laboratory for Information Science and Technology

External person

Naman Jhunjhunwala

  • Indian Institute of Technology Delhi

External person

Bihan Wen

  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IFP
  • IBM Research
  • Nanyang Technological University
  • IBM
  • IFP
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jabir Shabbir Karachiwala

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center of UIUC

External person

Pulkit Yadav

  • Indian Institute of Technology Delhi

External person

Martin J. Reed

  • University of Essex

External person

Chang Wu Chen

  • Ethereum Asia Pacific

External person

Kyungtae Kang

  • Hanyang University
  • University of Illinois Urbana-Champaign
  • Department of Computer Science and Engineering
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science and Engineering
  • Dept. of CSE
  • University of Illinois at Urbana-Champaign
  • Korea Advanced Institute of Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Parisa Haghani

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Diko Ko

  • Seoul National University
  • Sch. of Computer Science and Eng.

External person

Yanxin Jiang

  • University of Illinois at Urbana-Champaign

External person

Bingyang Liu

  • Huawei Technologies Co., Ltd.

External person

Yi Min Wang

  • Microsoft USA
  • Systems and Networking Research Group
  • Keio University

External person

Hsin Min Wang

  • Academia Sinica - Institute of Information Science

External person

David McGrew

  • Cisco Systems

External person

Yu Heng Chen

  • National Taiwan University

External person

Manish Bansal

  • Indian Institute of Technology Delhi

External person

Qing Li

  • University of Medicine and Dentistry of New Jersey
  • Rutgers - The State University of New Jersey, New Brunswick
  • WinLab

External person

Hsin Tien Chiang

  • Academia Sinica - Research Center for Information Technology Innovation
  • Chinese Academy of Sciences

External person

Mingwei Xu

  • Tsinghua University

External person

Soo Bum Lee

  • Qualcomm
  • Qualcomm Incorporated

External person

Hsun Lee

  • National Taiwan University

External person

Tao Jiang

  • University of Maryland, College Park

External person

Gong Zhang

  • Huawei Future Network Theory Lab

External person

Hsin Tien Chiang

  • Chinese Academy of Sciences

External person

Taehyoung Kim

  • Kyungpook National University

External person

David K Y Yau

  • Advanced Digital Sciences Center
  • Singapore University of Technology and Design
  • Advanced Digital Sciences Center
  • Illinois at Singapore
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Seyedali Tabaeiaghdaei

  • Swiss Federal Institute of Technology Zurich

External person

Tomoki Toda

  • Nagoya University

External person

Sristi Lakshmi Sravana Kumar

  • Advanced Digital Sciences Center

External person

Evelyn Y.L. Huang

  • University of Illinois at Chicago
  • University of Illinois at Chicago

External person

Virgil D. Gligor

  • Microsoft's Trusted Computing Academic Advisory Board
  • Carnegie Mellon University
  • IEEE
  • Dept. of Elec. and Comp. Engineering
  • Carnegie Mellon University

External person

Cheng Yu

  • Academia Sinica - Research Center for Information Technology Innovation

External person

Varsha Sadekar

  • General Motors

External person

Fan Yang

  • Tsinghua National Laboratory for Information Science and Technology (TNList)
  • Tsinghua University

External person

Prateek Mittal

  • University of California, Berkeley
  • University of Illinois Urbana-Champaign
  • Princeton University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Hasan S.M. Erol

  • Massachusetts Institute of Technology

External person

Soo Young Chang

  • S Y Chang and Associates

External person

Markus Jakobsson

  • Indiana University Bloomington

External person

Hyuk Lim

  • Gwangju Institute of Science and Technology
  • Seoul National University
  • School of Electrical Eng./Comp. Sci.
  • Department of Nanobio Materials and Electronics
  • Department of Information and Communications

External person

Xinle Du

  • Tsinghua University
  • National Climate Center China
  • Tsinghua National Laboratory for Information Science and Technology

External person

Zhoushi Zhu

  • University of Illinois at Urbana-Champaign

External person

Subhash Lakshminarayana

  • Advanced Digital Sciences Center

External person

Fanhui Zeng

  • University of Illinois at Urbana-Champaign

External person

Huayu Zhou

  • University of Nevada, Reno

External person

Jing Jie Wang

  • National Taiwan University

External person

Philipp Winter

  • Princeton University

External person

Zheng Zhang

  • Zhejiang University
  • Hewlett-Packard
  • Microsoft USA

External person

Heng Cheng Kuo

  • Chinese Academy of Sciences

External person

Brian Weis

  • Cisco Systems

External person

Jianping Wu

  • Tsinghua University

External person

Paolo Santi

  • National Research Council of Italy
  • IIT-CNR
  • IIT-CNR

External person

Simon Scherrer

  • Swiss Federal Institute of Technology Zurich

External person

David A. Maltz

  • Carnegie Mellon University

External person

Hans Anderson

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ercan Ucan

  • University of Illinois Urbana-Champaign
  • Dept. of Computer Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Jiajia Liu

  • Xidian University

External person

Josh Broch

  • Carnegie Mellon University

External person

Haitao Wu

  • Hong Kong University of Science and Technology
  • Google

External person

Fuyuan Zhang

  • Swiss Federal Institute of Technology Zurich

External person

Jonghoon Kwon

  • Swiss Federal Institute of Technology Zurich

External person

S. V. Sriraam

  • Indian Institute of Technology Delhi

External person

Shoushou Ren

  • Huawei Technologies Co., Ltd.

External person

Anyu Ying

  • Carnegie Mellon University

External person

Meng Shen

  • School of Computer Science
  • Beijing Institute of Technology

External person

Patrick Bamert

  • Cantonal Bank of Zurich

External person

Sanjay Shakkottai

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • IEEE
  • Stanford University
  • Texas A&M University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical, and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Texas AandM University
  • Center for Compound Semiconductor Microelectronics
  • UT Austin
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qi Li

  • Tsinghua University
  • Tsinghua National Laboratory for Information Science and Technology

External person

Suraj Sajeev

  • Indian Institute of Technology Delhi

External person

Hwajeong Seo

  • Agency for Science, Technology and Research, Singapore

External person

Qing Li

  • Rutgers - The State University of New Jersey, New Brunswick

External person

Yi Chiao Wu

  • Nagoya University

External person

Jemin Lee

  • Singapore University of Technology and Design

External person

Shuihai Hu

  • University of Illinois Urbana-Champaign
  • Hong Kong University of Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Hao Cheng Yang

  • National Taiwan University

External person

Bisheng Liu

  • Fudan University
  • School of Computer Science

External person

Kai Chen

  • Hong Kong University of Science and Technology

External person

Chun Yuan

  • Microsoft USA

External person

Laurent Chuat

  • Swiss Federal Institute of Technology Zurich
  • Department of Computer Science

External person

Zhichao Zhang

  • Tsinghua University
  • National Climate Center China
  • Tsinghua National Laboratory for Information Science and Technology

External person

Yushan Liu

  • Princeton University

External person

Danesh J. Esteki

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Girish Revadigar

  • Singapore University of Technology and Design

External person

Lin Wei

  • Advanced Digital Sciences Center

External person

Ting Fu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tianzhu Zhang

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Chinese Academy of Sciences
  • Advanced Digital Sciences Center of Illinois
  • CAS - Institute of Automation
  • Advanced Digital Sciences Center (ADSC)
  • Advanced Digital Sciences Center of UIUC
  • Advanced Digital Sciences Center
  • University of Illinois Urbana-Champaign
  • Institute of Automation
  • National Laboratory of Pattern Recognition
  • University of Illinois at Urbana-Champaign

External person

Hui Lin

  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Nevada, Reno
  • Department of Computer Science and Engineering
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Yen Wen Chen

  • National Central University
  • National Central University

External person

Im Y. Jung

  • Kyungpook National University

External person

Marvin A. Sirbu

  • Carnegie Mellon University
  • Department of Engineering and Public Policy
  • Carnegie Mellon University

External person

Taeho Lee

  • Swiss Federal Institute of Technology Zurich

External person

Amit Kumar Saha

  • Rice University

External person

Huzur Saran

  • Indian Institute of Technology Delhi

External person

Siva Phani Keshav Bachu

  • University of Illinois at Urbana-Champaign

External person

Bowen Song

  • University of California at Davis

External person

Jennifer C. Hou

  • ACM
  • University of Illinois Urbana-Champaign
  • IEEE
  • University of IIlinois
  • ACM
  • Computer Science, University of Illinois at Urbana-Champaign
  • Dept. of Computer Science
  • Department of Computer Science, University of Illinois
  • Department of Computer Science
  • Department of Computer Science
  • Department of Compute Science
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Yuming Hsu

  • National Taiwan University

External person

Jiayu Zhu

  • University of Illinois at Urbana-Champaign

External person

Yi Wang

  • Southern University of Science and Technology

External person

Christos Pappas

  • Swiss Federal Institute of Technology Zurich

External person

Shaoying Cai

  • Agency for Science, Technology and Research, Singapore

External person

Martin Mauve

  • Heinrich Heine University Düsseldorf

External person

Jianing Zhuang

  • University of Nevada, Reno

External person