Network

Hanzhi Ma

  • Zhejiang University
  • ZJU-UIUC Institute

External person

Er Ping Li

  • College of Information Science and Electronic Engineering
  • Zhejiang University
  • College of Information Science and Electronic Engineering
  • ZJU-UIUC Institute

External person

Andrew Page

  • IBM
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiao Ma

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bobi Shi

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert F. Kummerer

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thong Nguyen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Yang

  • University of Illinois at Urbana-Champaign

External person

K. Aygün

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Leslie Struble

  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Department of Civil Engineering
  • Departments of Civil and Environmental Engrg.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Prannoy Suraneni

  • University of Miami
  • Department of Civil
  • Swiss Federal Institute of Technology Zurich
  • Institute for Building Materials
  • University of Illinois Urbana-Champaign
  • Department of Civil, Environmental, and Geomatic Engineering
  • Dept. of Civil and Environmental Engineering
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Miami College of Engineering
  • University of Illinois at Urbana-Champaign

External person

Yuechen Wang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eric P. Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xing Jian Shangguan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xinying Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tong Zhang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael Qiu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Der Han Huang

  • University of Illinois at Urbana-Champaign

External person

Juan S. Ochoa

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person