20132019
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Fingerprint Fingerprint is based on mining the text of the expert's scholarly documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 2 Similar Profiles
Networks (circuits) Engineering & Materials Science
Electric lines Engineering & Materials Science
Printed circuit boards Engineering & Materials Science
Fast Fourier transforms Engineering & Materials Science
collocation Physics & Astronomy
Crosstalk Engineering & Materials Science
Circuit simulation Engineering & Materials Science
Microstrip lines Engineering & Materials Science

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Research Output 2013 2019

  • 14 Conference contribution

A deep learning approach for volterra kernel extraction for time domain simulation of weakly nonlinear circuits

Nguyen, T., Wang, X., Chen, X. & Schutt-Aine, J. E., May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1889-1896 8 p. 8811319. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Feedforward neural networks
Networks (circuits)
Buffers
Topology
Neural networks

Stochastic LIM for Transient Solution of Electromagnetic and Circuit Problems with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., May 10 2019, 2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019. Institute of Electrical and Electronics Engineers Inc., 8712858. (2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Transient Solution
electromagnetism
Uncertainty
Networks (circuits)
Augmented System

Adaptive wavelet stochastic collocation for resonant transmission line circuits

Yang, A. S., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Apr 2 2018, 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric lines
Resonant circuits
Networks (circuits)
Statistics
Polynomials

FFT-based macromodeling of power delivery network with uncertainties using Latency Insertion Method and stochastic collocation

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

collocation
fast Fourier transformations
Fast Fourier transforms
insertion
delivery

Stochastic LIM for uncertainty characterization of fiber-weave effect on coupled transmission lines

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-January. p. 1-3 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

transmission lines
Electric lines
Glass fibers
fibers
Fibers