Network

Placid Mathew Ferreira

Person: Academic

Songbin Gong

Person: Academic

Jose E Schutt-Aine

Person: Academic

Kent D Choquette

Person: Academic

Ralph G Nuzzo

Person: Academic

William Paul King

Person: Academic

Shaloo Rakheja

Person: Academic

Wenjuan Zhu

Person: Academic

Jeffrey S Moore

Person: Academic

Pingfeng Wang

Person: Academic

Yi Lu

  • Chemistry - Jay and Ann Schenck Professor Emeritus

Person: Academic

J. J. Coleman

  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory
  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • NASA Goddard Space Flight Center
  • University of Texas at Dallas
  • Ctr. Compd. Semiconduct. M.
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Department of Materials Science
  • Microeectronics Laboratory
  • Materials Research Laboratory and Everitt Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Center for Nutrition
  • Materials Research Laboratory and Microelectronics Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical Engineering
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Parsian Katal Mohseni

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Rochester Institute of Technology
  • Micro and Nanotechnology Lab
  • Microsystems Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jeong Dong Kim

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Chen Zhang

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • IBM Research
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • IBM
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ik Su Chun

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. G. Bishop

  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Microeectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Wonsik Choi

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jae Cheol Shin

  • Korea Photonics Technology and Institute
  • Korea Photonics Technology Institute
  • Korea Potonics Technology Institute
  • University of Illinois Urbana-Champaign
  • Yeungnam University
  • Department of Physics
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Photonics-Energy Center
  • Photonic-Energy Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Korea Photonics Technology Institute
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Weidong Zhou

  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • National Yang Ming Chiao Tung University
  • Department of Materials Science and Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Texas at Arlington
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Hsien Chih Huang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wen Huang

  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Hefei University of Technology
  • University of Electronic Science and Technology of China
  • University of Illinois at Urbana-Champaign

External person

Wen Huang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • EHF Key Laboratory of Fundamental Science
  • University of Electronic Science and Technology of China
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER)
  • Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER)
  • School of Microelectronics Engineering
  • Hefei University of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Xin Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • U.S Research and Development Center
  • University of Illinois
  • U.S Research and Development Center @ Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hao Chung Kuo

  • National Yang Ming Chiao Tung University
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Photonics
  • Dept. of Mat. Sci. and Engineering
  • Department of Photonics
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Photonic
  • Department of Photonics and Institute of Electro-Optical Engineering
  • National Chiao Tuna University
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • Hon Hai Precision Industry
  • University of Illinois at Urbana-Champaign

External person

Kevin P. Bassett

  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Zhendong Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign

External person

Paul Froeter

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER)
  • Micro and Nanotechnology Lab
  • Micro and Nano Technology Laboratory
  • Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Seth A. Fortuna

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Clarence Chan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Munho Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Electrical and Electronic Engineering
  • Nanyang Technological University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kelson Chabak

  • Air Force Research Laboratory
  • Sensors Direc.
  • Wright-Patterson AFB
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Air Force Research Laboratory
  • Micro and Nanotechnology Lab
  • Sensors Directorate
  • Department of Electrical and Computer Engineering
  • Air Force Research Lab.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xin Miao

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • IBM Research
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • IBM
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Korea University
  • Electrical Engineering Department
  • Ctr. Compd. Semiconducter M
  • Microeectronics Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. J. Rhee

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ryan Dowdy

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul W. Bohn

  • University of Notre Dame
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry and Biochemistry and Department of Chemical and Biomolecular Engineering, University of Notre Dame
  • Department of Chemical and Biomolecular Engineering, University of Notre Dame
  • Department of Chemistry and Biochemistry, University of Notre Dame
  • University of Illinois Urbana-Champaign
  • National Instruments
  • Yale University
  • United States Army Engineer Research and Development Center
  • Department of Chemistry
  • Micro and Nanotechnology Lab
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Environmental Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Mech. and Indust. Eng.
  • Department of Chemistry and the Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • University of Missouri at St. Louis
  • Department of Chemistry
  • Department of Chemistry and Biochemistry
  • Dept. of Chemical and Biomolecular Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemistry and Biochemistry
  • Departments of Chemistry
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemistry and Biochemistry
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • University of Notre Dame
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Varun Boehm Verma

  • National Institute of Standards and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Apratim Khandelwal

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Karthik Balasundaram

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhongjie Ren

  • University of Texas at Austin
  • University of Texas

External person

Kuo Ju Chen

  • University of Illinois Urbana-Champaign
  • National Yang Ming Chiao Tung University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonics
  • Department of Photonic
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xihang Wu

  • University of Illinois at Urbana-Champaign
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign

External person

Xiaogang Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Julian Michaels

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Micro and Nano Technology Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyooho Jung

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Moyang Li

  • University of Illinois Urbana-Champaign
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Neville L. Dias

  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Bruno Azeredo

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Mechanical Scienceand Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Arizona State University
  • Polytechnic School
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yi Song

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Xiang Zhao

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chien Chung Lin

  • National Yang Ming Chiao Tung University
  • Institute of Photonic System
  • Institute of Photonic System
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonic

External person

D. A. Turnbull

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zong Yi Tu

  • National Yang Ming Chiao Tung University
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonics
  • Department of Applied Chemistry
  • Department of Photonic

External person

Archana Challa

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Uttam Reddy

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Ki Jun Yu

  • Dept. of Mat. Sci. and Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Yonsei University
  • School of Electrical and Electronic Engineering, Yonsei University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. H. Shih

  • Academia Sinica Taiwan
  • Research Center for Applied Sciences
  • University of Illinois Urbana-Champaign
  • National Yang Ming Chiao Tung University
  • Research Center for Applied Sciences, Academia Sinica
  • Research Center for Applied Sciences
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Photonics
  • Academia Sinica - Research Center for Applied Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert L. Whetten

  • University of California, Los Angeles
  • The University of Chicago
  • Department of Chemistry and Biochemistry, University of California at Los Angeles
  • Department of Chemistry and Biochemistry
  • Department of Chemistry and Biochemistry
  • James Franck Institute
  • The University of Chicago
  • University of California at Los Angeles
  • Georgia Institute of Technology

External person

D. J. Sievers

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Cygnus Photonics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Keng Hsu

  • University of Illinois Urbana-Champaign
  • Arizona State University
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Polytechnic School
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Polytechnic School
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shunya Namiki

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

William L. Wilson

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Harvard University
  • Seitz Materials Research Laboratory
  • Center for Nanoscale Systems
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Brown University
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

W. Chern

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sheng Huan Chiu

  • National Yang Ming Chiao Tung University
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonics
  • Institute of Photonic System
  • Department of Photonic

External person

Teng Ming Chen

  • National Yang Ming Chiao Tung University
  • Department of Applied Chemistry and Institute of Molecular Science
  • Department of Applied Chemistry
  • Departmet of Photonics and Institute of Electro-Optical Engineering

External person

Kristen Nguyen

  • University of Texas at Austin

External person

P. T. Lee

  • National Yang Ming Chiao Tung University
  • Institute of Photonic System
  • Department of Photonics
  • Institute of Photonic System
  • Departmet of Photonics and Institute of Electro-Optical Engineering

External person

Nicholas Fang

  • Massachusetts Institute of Technology
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Mechanical Engineering Department
  • Hatsopoulos Microfluids Laboratory
  • Department of Mechanical Scienceand Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Allen T. Wang

  • University of Texas at Austin

External person

Angela C. Pizzuto

  • Brown University

External person

Henry C. Roberts

  • University of Texas at Austin

External person

E. E. Reuter

  • University of Illinois Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Daniel M. Mittleman

  • Brown University

External person

Sing Yang Chiam

  • Agency for Science, Technology and Research, Singapore
  • ASTAR (Agency for Science

External person

Yi Chun Lai

  • National Yang Ming Chiao Tung University
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonics
  • Department of Photonic

External person

Ehsan Arbabi

  • Micro and Nanotechnology Laboratory, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • T. J. Watson Laboratory of Applied Physics
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Mark D. Kraman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Che Yu Liu

  • National Yang Ming Chiao Tung University
  • Department of Photonics
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Photonics and Institute of Electro-Optical Engineering
  • National Chiao Tuna University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaochen Ge

  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • University of Texas at Arlington

External person

Lan Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • IBM Research
  • IBM
  • UIUC
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

Aadil Waseem

  • University of Texas at Austin

External person

Scott A. Wicker

  • University of Texas at Austin

External person

Dong Liu

  • University of Wisconsin-Madison
  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Texas at Arlington
  • University of Wisconsin

External person

Peichen Yu

  • National Yang Ming Chiao Tung University
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonics
  • Department of Photonic

External person

Gou Chung Chi

  • National Yang Ming Chiao Tung University
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Photonics
  • Department of Photonic

External person

Jian Guo Wen

  • Argonne National Laboratory
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Electron Microscopy Center
  • Materials Science Division, Argonne National Laboratory
  • Center for Microanalysis of Materials
  • Electron Microscopy Center
  • Materials Science Division
  • Department of Chemistry
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Electron Microscopy Center
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Momchil Minkov

  • Stanford University
  • Stanford University

External person

Zhenqiang Ma

  • University of Wisconsin-Madison
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin
  • University of Illinois at Urbana-Champaign

External person

Lingyu Kong

  • National University of Singapore
  • Agency for Science, Technology and Research, Singapore
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • ASTAR (Agency for Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shanhui Fan

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • E. L. Ginzton Laboratory, Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Stanford University

External person

H. F. Meng

  • National Yang Ming Chiao Tung University
  • Institute of Physics

External person

Xiaogang Chen

  • Columbia University
  • Microelectronics Sciences Laboratories
  • Department of Electrical Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Electrical Engineering Dept.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Yongfeng Mei

  • Fudan University
  • Department of Materials Science

External person

Shih Chia Liu

  • The University of Texas at Arlington
  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • University of Wisconsin-Madison
  • Materials Science Center
  • University of Wisconsin-Madison
  • University of Texas at Arlington
  • University of Wisconsin-Madison

External person

Yonggang Huang

  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • University of Connecticut
  • Tsinghua University
  • Department of Chemistry
  • Center for Engineering and Health and Skin Disease Research Center
  • CAS - Institute of Semiconductors
  • University of Pennsylvania
  • Center for Engineering and Health
  • University of Illinois at Urbana-Champaign
  • Zhejiang University

External person

Zongfu Yu

  • Stanford University
  • University of Wisconsin-Madison
  • E. L. Ginzton Laboratory, Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Stanford University
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • Stanford University
  • University of Wisconsin

External person

Xin Yin

  • University of Wisconsin-Madison
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Yihui Zhang

  • Tsinghua University
  • Northwestern University
  • Zhejiang University
  • Center for Engineering and Health
  • Center for Engineering and Health and Skin Disease Research Center
  • Center for Mechanics and Materials, Tsinghua University
  • Department of Engineering Mechanics
  • Department of Engineering Mechanics, Tsinghua University
  • Center for Flexible Electronics Technology
  • Mechanical Engineering
  • Department of Civil and Environmental Engineering
  • Dept. of Civ. Eng. and Mech. Eng.
  • Department of Civil and Environmental Engineering
  • Department of Civil and Environmental Engineering
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Center for Flexible Electronics Technology and Center for Mechanics and Materials

External person

Zetian Mi

  • University of Michigan, Ann Arbor

External person

Seung Hyun Kim

  • University of Illinois at Urbana-Champaign

External person

Zheng Yan

  • University of Illinois Urbana-Champaign
  • University of Missouri
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical Engineering
  • Department of Mechanical and Aerospace Engineering
  • Department of Materials Science and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Missouri
  • University of Illinois at Urbana-Champaign

External person

W. K. Chim

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

Soongyu Yi

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Kyou Hyun Kim

  • University of Illinois Urbana-Champaign
  • Korea Institute of Industrial Technology
  • Dept. of Mat. Sci. and Engineering
  • Advanced Process and Materials R and BD Group
  • Seitz Materials Research Laboratory
  • Advanced Process and Materials RandD Group
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jyothi S. Sadhu

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Engineering and Sciences
  • Department of Mechanical Science and Engineering
  • Department of Mechanical and Science Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Edmond K C Chow

  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Nano Sensors Group
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. C. Lin

  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • National Yang Ming Chiao Tung University
  • Department of Photonics
  • Institute of Photonic System

External person

Xudong Wang

  • University of Wisconsin-Madison
  • Department of Materials Science and Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Lei Pan

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • CAS - Institute of Vertebrate Paleontology and Paleoanthropology
  • CAS - Nanjing Institute of Geology and Palaeontology
  • University of Illinois at Urbana-Champaign

External person

Debashis Chanda

  • College of Optics and Photonics (CREOL), University of Central Florida
  • University of Central Florida
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • CREOL
  • Nanoscience Technology Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Enrique Castro-Camus

  • University of Marburg
  • Centro de Investigaciones en Optica

External person

Dennis E. Walker

  • Air Force Research Laboratory
  • Sensors Direc.
  • Wright-Patterson AFB
  • Air Force Research Laboratory
  • Sensors Directorate

External person

Lukas Janavicius

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alexander Kvit

  • Materials Science Center
  • University of Wisconsin-Madison
  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • University of Wisconsin-Madison
  • University of Texas at Arlington
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Kyle H. Montgomery

  • Purdue University
  • Air Force Research Labs.
  • Kirtland AFB
  • University of California at Davis
  • School of Electrical and Computer Engineering
  • Air Force Research Laboratory

External person

Suenne Kim

  • Georgia Institute of Technology
  • Hanyang University
  • Department of Applied Physics
  • School of Physics
  • Center for Relativistic Astrophysics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zihao Ou

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. Sang

  • University of Illinois Urbana-Champaign
  • University of Electronic Science and Technology of China
  • EHF Key Laboratory of Fundamental Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Microelectronics Engineering
  • Hefei University of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Runyu Liu

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gaoshan Huang

  • Department of Materials Science
  • Fudan University

External person

Stephanie Tomasulo

  • Yale University
  • Naval Research Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Su Chun Ik

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. F.M.Anhar Uddin Bhuiyan

  • Ohio State University

External person

Xin Yu

  • University of Illinois at Urbana-Champaign

External person

Haoran Fu

  • Zhejiang University
  • Department of Civil Engineering and Architecture, Zhejiang University
  • Northwestern University
  • Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University
  • Department of Civil Engineering

External person

Jun Ma

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jennifer K. Hite

  • Naval Research Laboratory

External person

Olivia V. Cangellaris

  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois Urbana-Champaign
  • Department of Bioengineering
  • Micro and Nanotechnology Lab
  • Micro and Nano Technology Laboratory
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Chicago
  • Medical Scholars Program
  • College of Medicine
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign

External person

Jeffrey O. White

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Yixin Xiao

  • University of Michigan, Ann Arbor

External person

Jihye Bong

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Jun Li

  • Department of Materials Science and Engineering
  • University of Wisconsin-Madison
  • Department of Materials Science and Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

S. Kim

  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Korea University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Jongseung Yoon

  • University of Southern California
  • Mork Family Department of Chemical Engineering and Materials Science, University of Southern California
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemical Engineering and Materials Science
  • Department of Electrical Engineering, University of Southern California
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Departments of Electrical Engineering
  • Department of Chemistry
  • Departments of Chemical Engineering and Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Southern California
  • University of Illinois at Urbana-Champaign

External person

Xing Sheng

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Tsinghua University
  • Department of Electronic Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Tsinghua National Laboratory for Information Science and Technology

External person

Siyu Liu

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

V. Podolskiy

  • University of Massachusetts Lowell
  • Oregon State University
  • UMass Lowell
  • Department of Physics and Applied Physics
  • One University Avenue
  • Department of Physics
  • Department of Physics
  • Oregon State University

External person

Hongping Zhao

  • Ohio State University

External person

Hefei Hu

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Physics
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brad Derickson

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Scienceand Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Q. Gu

  • University of Illinois Urbana-Champaign
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Junhwan Kim

  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • ACRC
  • MechSE department
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. Roberts

  • University of Massachusetts Lowell
  • University of Massachusetts Boston
  • Department of Physics and Applied Physics
  • One University Avenue
  • Department of Physics

External person

Xixi Luo

  • University of Texas at Austin
  • University of Texas

External person

D. M. Hansen

  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Nagendra Bala Murali Athreya

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Binayak Dasgupta

  • National University of Singapore
  • Agency for Science, Technology and Research, Singapore
  • ASTAR (Agency for Science

External person

Yu Huang

  • Department of Biomedical Engineering, University of Wisconsin
  • University of Wisconsin-Madison
  • Department of Nanomedicine and Biomedical Engineering
  • Methodist Hospital
  • Department of Nanomedicine and Biomedical Engineering
  • Houston Methodist
  • University of California at Los Angeles

External person

S. D. Roh

  • University of Illinois Urbana-Champaign
  • Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign

External person

Won Jun Choi

  • Korea Institute of Science and Technology
  • Center for OptoElectronic Convergence System
  • Nano-Photonics Center

External person

Hau Vei Han

  • National Yang Ming Chiao Tung University
  • Institute of Photonic System
  • Departmet of Photonics and Institute of Electro-Optical Engineering

External person

Tatsumi Ishihara

  • Kyushu University
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University
  • Department of Applied Chemistry, Graduate School of Engineering, Kyushu University.
  • International Institute for Carbon Neutral Energy Research

External person

W. H. Weinberg

  • University of California at Santa Barbara
  • University of California Office of the President
  • Department of Chemical Engineering
  • Department of Chemical Engineering, University of California, Santa Barbara
  • Department of Chemical Engineering

External person

P. B. Klein

  • Naval Research Laboratory

External person

T. F. Kuech

  • University of Wisconsin-Madison
  • University of Illinois Urbana-Champaign
  • Microeectronics Laboratory
  • Department of Chemical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Sang Il Park

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Deyin Zhao

  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • University of Texas at Arlington

External person

Ungyu Paik

  • Hanyang University
  • WCU Department of Energy Engineering, Hanyang University
  • Department of Material Science and Engineering, Department of Energy Engineering
  • Division of Materials Science and Engineering
  • Department of Energy Engineering
  • Department of Materials Science and Engineering, Hanyang University
  • Division of Advanced Materials Science Engineering
  • Division of Materials Science and Engineering

External person

Rak Hwan Kim

  • Institute of High Performance Computing A Star
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Institute for High Performance Computing
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Agency for Science, Technology and Research, Singapore
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. A. Ahmari

  • EpiWorks, Inc.
  • EpiWorks
  • University of Illinois Urbana-Champaign
  • IEEE
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Inc.
  • University of Illinois at Urbana-Champaign

External person

Ashish Bansal

  • California Institute of Technology
  • Division of Chemistry and Chemical Engineering
  • Div. of Chem. and Chem. Engineering
  • California Institute of Technology

External person

Zixuan Feng

  • Ohio State University

External person

Jingchao Zhou

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kewang Nan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Harvard University
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

Sang I. Yi

  • University of California at Santa Barbara
  • University of California Office of the President
  • Department of Chemical Engineering
  • Department of Chemical Engineering, University of California, Santa Barbara
  • Department of Chemical Engineering

External person

Ling Shen

  • Department of Physics, College of Sciences, China University of Mining and Technology
  • Shanghai University
  • China University of Mining and Technology
  • China University of Mining and Technology
  • University of Illinois Urbana-Champaign
  • SHU-SolarE R and D Lab
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Zhang

  • University of Illinois at Urbana-Champaign
  • University of Wisconsin

External person

Jung Woo Lee

  • Hanyang University
  • WCU Department of Energy Engineering, Hanyang University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, Hanyang University
  • Department of Energy Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Pusan National University
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • School of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David V. Forbes

  • Rochester Institute of Technology
  • University of Illinois Urbana-Champaign
  • Microelectronics Laboratory
  • Materials Research Laboratory
  • Center for Nutrition
  • Materials Research Laboratory and Microelectronics Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matthew A. Meitl

  • Semprius, Inc.
  • University of Illinois Urbana-Champaign
  • X-Celeprint Ireland
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alex Q. Huang

  • University of Texas
  • University of Texas at Austin

External person

Donald A. Walko

  • Advanced Photon Source Argonne National Laboratory
  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • United States Department of Energy

External person

Yijie Zhang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jie Ru Li

  • National Yang Ming Chiao Tung University
  • Institute of Photonic System
  • Department of Photonics

External person

Vaanchit Srikumar

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bill Jiang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrew J. Green

  • Wyle Laboratories, Inc.
  • Air Force Research Laboratory

External person

B. J. Roof

  • EpiWorks, Inc.
  • Inc.

External person

Julio Soares

  • University of Illinois at Urbana-Champaign

External person

Min Xu

  • University of Illinois at Urbana-Champaign
  • Institute of Applied Materials
  • University of Illinois at Urbana-Champaign

External person

Tom Comberiate

  • Johns Hopkins Applied Physics Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Applied Physics Laboratory
  • Department of Electrical and Computer Engineering
  • Applied Physics Laboratory
  • Johns Hopkins University
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Yi Ren

  • ASTAR (Agency for Science
  • Agency for Science, Technology and Research, Singapore

External person

Justin C. Williams

  • Department of Biomedical Engineering, University of Wisconsin
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Huang Yu Lin

  • National Yang Ming Chiao Tung University
  • Department of Photonics
  • Departmet of Photonics and Institute of Electro-Optical Engineering

External person

Do Yang Kim

  • Korea Institute of Science and Technology
  • Ulsan National Institute of Science and Technology
  • Nano-Photonics Center
  • Department of Mechanical and Advanced Materials Engineering

External person

Haiwen Luan

  • Northwestern University
  • Center for Engineering and Health and Skin Disease Research Center
  • Departments of Mechanical Engineering
  • Departments of Civil and Environmental Engineering
  • Departments of Materials Science and Engineering
  • Departments of Civil and Environmental Engineering
  • Department of Civil and Environmental Engineering

External person

Huan Hu

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Northwestern University
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • ZJU-UIUC Institute
  • Zhejiang University
  • University of Illinois at Urbana-Champaign

External person

J. Redwing

  • Epitronics/ATMI
  • University of Illinois Urbana-Champaign
  • Pennsylvania State University
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Peide D. Ye

  • Purdue University
  • Birck Nanotechnology Center
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering

External person

Arif M. Abdullah

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jian Wu

  • Northwestern University
  • Department of Civil and Environmental Engineering

External person

H. J. Lee

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shawn G. Thomas

  • Motorola
  • ASM International NV

External person

Q. J. Hartmann

  • EpiWorks, Inc.
  • EpiWorks
  • University of Illinois Urbana-Champaign
  • IEEE
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Inc.
  • University of Illinois at Urbana-Champaign

External person

Juntong Wang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ray Hua Horng

  • National Chung Hsing University
  • Graduate Institute of Precision Engineering
  • National Yang Ming Chiao Tung University

External person

Xi Zeng

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jayavel Pachamuthu

  • Western Digital

External person

Y. Huang

  • Northwestern University
  • Department of Mechanical Science and Engineering
  • Tsinghua University
  • Center for Engineering and Health
  • Zhejiang University
  • University of Connecticut
  • University of Illinois Urbana-Champaign
  • Center for Engineering and Health and Skin Disease Research Center
  • CAS - Institute of Semiconductors
  • Department of Engineering Mechanics
  • Department of Mechanical Science and Engineering
  • Dept. of Mech. and Indust. Eng.
  • Dept. of Mech. and Indust. Eng.
  • Department of Civil and Environmental Engineering
  • Departments of Civil and Environmental Engineering
  • Department of Mechanical Engineering
  • Dept. of Civ. Eng. and Mech. Eng.
  • Department of Civil and Environmental Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Engineering
  • Depts. of Civ. and Environ. Eng.
  • Department of Mechanical and Industrial Engineering
  • Institute of Public Health and Medicine
  • Skin Disease Research Center
  • Department of Mechanical Science and Engineering, University of Illinois
  • Laboratory of Nano-Optoelectronics
  • Dept. of Mat. Sci. and Engineering
  • Department of Civil and Environmental Engineering
  • Mechanical Science and Engineering Department
  • Department of Engineering Mechanics, Tsinghua University
  • Center for Bio-Integrated Electronics
  • Mechanical Engineering
  • University of Pennsylvania
  • Department of Physical Medicine and Rehabilitation
  • University of Illinois at Urbana-Champaign

External person

Mark A. Shannon

  • Department of Mechanical Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • University of Notre Dame
  • United States Army Engineer Research and Development Center
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical and Industrial Engineering
  • Department of Chemistry and Biochemistry and Department of Chemical and Biomolecular Engineering, University of Notre Dame
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical and Industrial Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Mechanical Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Chemistry
  • Department of Chemistry
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Notre Dame
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. D. Young

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Josh D. Wood

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Northwestern University
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nathan S. Lewis

  • Division of Chemistry and Chemical Engineering, Beckman Institute, Joint Center for Artificial Photosynthesis
  • Joint Center for Artificial Photosynthesis
  • California Institute of Technology
  • Kavli Nanoscience Institute
  • Division of Chemistry and Chemical Engineering
  • Div. of Chem. and Chem. Engineering
  • University of Illinois Urbana-Champaign
  • Division of Chemistry and Chemical Engineering
  • California Institute of Technology

External person

A. Garg

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shizhao Fan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics
  • Nick Holonyak
  • University of Chinese Academy of Sciences
  • University of Illinois at Urbana-Champaign

External person

Haojie Zhao

  • School of Microelectronics Engineering
  • Hefei University of Technology

External person

Kuan Yu Wang

  • National Yang Ming Chiao Tung University
  • Institute of Photonic System

External person

Kyoung Jin Choi

  • Ulsan National Institute of Science and Technology
  • KIST-UNIST Ulsan Center for Convergent Materials (KUUC)
  • Department of Mechanical and Advanced Materials Engineering

External person

A. M. Jones

  • University of Illinois Urbana-Champaign
  • Microelectronics Laboratory
  • Department of Physics
  • Rutherford Appleton Laboratory
  • University of Illinois at Urbana-Champaign

External person

Kathy A. Walsh

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Srikanth Ranganathan

  • Western Digital

External person

Yichen Shuai

  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • University of Texas at Arlington

External person

Ashkan Behnam

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hyo Jin Kim

  • Korea Potonics Technology Institute
  • Korea Photonics Technology Institute

External person

Zhaohui Zhong

  • Brookhaven National Laboratory

External person

Xiaowei Wang

  • University of Illinois at Chicago
  • University of Illinois at Chicago
  • Washington University St. Louis

External person

Yuan Liu

  • Tsinghua University

External person

Joerg Appenzeller

  • School of Electrical and Computer Engineering
  • Purdue University

External person

E. C. Nelson

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhuo Wang

  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Quantitative Light Imaging Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Taehwan Kim

  • Pennsylvania State University

External person

Ke Bai

  • Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University

External person

Jun Ho Jeong

  • Korea Institute of Machinery and Materials
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Saptarshi Das

  • Purdue University
  • School of Electrical and Computer Engineering
  • The University of Chicago
  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • Argonne National Laboratory
  • Argonne National Laboratory
  • Pennsylvania State University

External person

Ruqiang Bao

  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM

External person

Adina Badea

  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

C. M. Finnie

  • Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Xun Zhan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Myoung Hee Yun

  • School of Energy and Chemical Engineering, Ulsan National Institute of Science and Technology (UNIST)
  • Ulsan National Institute of Science and Technology
  • School of Energy and Chemical Engineering
  • University of Illinois Urbana-Champaign
  • Ulsan National Institute Science and Technology (UNIST)
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gunter Wagner

  • Leibniz Institute for Crystal Growth

External person

Sungjin Jo

  • Hanyang University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • WCU Department of Energy Engineering, Hanyang University
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. D. Kim

  • Kyung Hee University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert Fitch

  • Wright-Patterson AFB
  • Air Force Research Laboratory
  • Air Force Research Laboratory

External person

Steve R. Ross

  • Argonne National Laboratory
  • The University of Chicago
  • Argonne Nationial Laboratory
  • Argonne National Laboratory

External person

Hohyun Keum

  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Korea Institute of Industrial Technology

External person

Lanfang Li

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • 3M Materials Laboratory
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tzu Hsuan Chang

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

An Phong Le

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • University of Illinois at Urbana-Champaign

External person

Joseph P. Feser

  • Department of Materials Science and Engineering
  • Department of Mechanical Engineering, University of Delaware
  • University of Delaware
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Tzu Neng Lin

  • Chung Yuan Christian University

External person

Philip X.L. Feng

  • Case Western Reserve University
  • Case Western Reserve University
  • University of Florida

External person

Zhun Yong Ong

  • University of Texas at Dallas
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Wong

  • IBM Research
  • IBM Semiconduct. Res./Devmt. Ctr.
  • IBM

External person

Hongxiang Tian

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Engineering and Sciences
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Yunpeng Liu

  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chun Yen Chang

  • National Yang Ming Chiao Tung University

External person

Yutong Zhang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. E. Wickenden

  • Naval Research Laboratory

External person

Inhwa Jung

  • Kyung Hee University
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Engineering, Kyung Hee University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dong Sing Wuu

  • National Chi Nan University

External person

Paulius Elvikis

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ananth Saran Yalamarthy

  • Stanford University
  • Stanford University

External person

Zhida Liu

  • The University of Texas at Austin
  • Texas Materials Institute

External person

J. T. Verdeyen

  • CU Aerospace
  • University of Illinois Urbana-Champaign
  • CU Aerospace
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Suk Won Hwang

  • Dept. of Mat. Sci. and Engineering
  • KU-KIST, Graduate School of Converging Science and Technology, Korea University
  • KU-KIST Graduate School of Converging Science and Technology, Korea University
  • Korea University
  • University of Illinois Urbana-Champaign
  • Northwestern University
  • Korea Institute of Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jan Paul Menzel

  • Yale University

External person

Elise A. Corbin

  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Micro and Nanotechnology Lab
  • University of Illinois Urbana-Champaign
  • Department of Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Bioengineering, University of Illinois at Urbana-Champaign
  • University of Pennsylvania
  • Department of Bioengineering, University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Cardiovascular Institute
  • Department of Bioengineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • The Children's Hospital of Philadelphia
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Scienceand Engineering
  • Department of Cardiology
  • Micro and Nano Technology Laboratory
  • University of Delaware
  • Alfred I. duPont Hospital for Children
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Joselle M. Mccracken

  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

Xiaohui Song

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sang Ho Shin

  • Nanyang Technological University

External person

Zijun Wei

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yueh Han Chuang

  • National Yang Ming Chiao Tung University

External person

Hansheng Chen

  • University of Sydney
  • School of Physics

External person

Adrian Cernescu

  • Neaspec GmbH

External person

Eric Seabron

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ashwin Tunga

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Saumitra Mehrotra

  • School of Electrical and Computer Engineering
  • Purdue University

External person

Stanley Kim

  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dong Wook Lee

  • Korea Photonics Technology Institute

External person

Ruimin Xu

  • University of Electronic Science and Technology of China
  • EHF Key Laboratory of Fundamental Science
  • School of Electronic Engineering

External person

Hao Zhou

  • School of Microelectronics Engineering
  • Hefei University of Technology

External person

Mikhail Chubarov

  • Pennsylvania State University

External person

Hailong Ning

  • University of Illinois Urbana-Champaign
  • Xerion Advanced Battery Corp.
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Xerion Advanced Battery Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Xerion Advanced Battery Corp

External person

Tzu Pei Chen

  • National Yang Ming Chiao Tung University

External person

Chang Jae Yu

  • Hanyang University
  • University of Illinois Urbana-Champaign
  • Department of Electronics and Computer Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hyejin Jeong

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Akhil Raj Kumar Kalapala

  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • University of Texas at Arlington

External person

X. Gao

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IQE plc
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Richard D. Braatz

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • The Electrochemical Society
  • IEEE
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Roger Adams Laboratory
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineerin
  • Department of Chemical Engineering
  • Departments of Chemical and Biomolecular Engineering
  • Departments of Chemistry of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • National University of Singapore
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Large Scale Syst. Res. Laboratory

External person

Xin Miao

  • IBM Research
  • IBM

External person

A. D K Finck

  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • IBM
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Keiji Honjo

  • ICE Cube Center WOW 3DI Laboratory

External person

Keh Chih Hwang

  • Tsinghua University
  • Center for Mechanics and Materials, Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University
  • Department of Engineering Mechanics
  • AML
  • Department of Engineering Mechanics
  • Dept. of Eng. Mech.
  • Department of Engineering Mechanics
  • Department of Engineering Mechanics
  • Department of Engineering Mechanics

External person

Bruce Green

  • Nxp Semiconductor

External person

R. L. Henry

  • Naval Research Laboratory

External person

Miao Xin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eric Pop

  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

R. Gunawan

  • University of Illinois Urbana-Champaign
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineerin
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • University of Illinois at Urbana-Champaign

External person

Gongjin Li

  • Department of Materials Science
  • Fudan University

External person

Feifei Lian

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

V. C. Elarde

  • QPC Lasers, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. Lin

  • National Yang Ming Chiao Tung University

External person

Xiaoqin Li

  • Department of Physics
  • University of Texas at Austin
  • The University of Texas at Austin
  • Texas Materials Institute

External person

Fabrizio Lombardi

  • EIC, IEEE TNano, Northeastern University
  • Northeastern University
  • Texas A&M University

External person

Neil A. Krueger

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael Q. Tu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shih Hsuan Chien

  • National Yang Ming Chiao Tung University
  • Institute of Photonic System

External person

Maria Masouraki

  • Department of Physics
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Fu Gow Tarntair

  • National Yang Ming Chiao Tung University

External person

Jiangtao Qu

  • University of Sydney
  • School of Physics

External person

Numair Ahmed

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chao Li

  • Plasma-Therm LLC

External person

David B. Janes

  • School of Electrical and Computer Engineering
  • Purdue University
  • School of Electrical and Computer Engineering

External person

Cun Zheng Ning

  • Arizona State University
  • School of Electrical

External person

Jinlong Zhu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Huazhong University of Science and Technology
  • State Key Laboratory Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. K. Zheng

  • Hong Kong University of Science and Technology
  • University of Sydney
  • Department of Physics
  • School of Physics

External person

A. M. Mitofsky

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yingjie Zhang

  • Australian Nuclear Science and Technology Organisation

External person

Ali Razavieh

  • School of Electrical and Computer Engineering
  • Purdue University

External person

Stephan Grunow

  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM

External person

Unoh Kwon

  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM

External person

Hongjun Yang

  • Semerane, Inc.
  • The University of Texas at Arlington
  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • University of Texas at Arlington

External person

M. Y. Hahn

  • University of California, Los Angeles
  • Department of Chemistry and Biochemistry, University of California at Los Angeles
  • University of California at Los Angeles

External person

Clarence Tracy

  • Advanced Products Research and Development Laboratory

External person

Zihao Ou

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Huang Ming Chen

  • National Yang Ming Chiao Tung University
  • Department of Photonics
  • University of Minnesota Twin Cities

External person

Stephen E. Tetlak

  • Wright-Patterson AFB
  • Air Force Research Laboratory
  • Air Force Research Laboratory

External person

Seung Hyun Kim

  • University of Illinois at Urbana-Champaign

External person

Kaicheung (Edmond) Chow

  • University of Illinois at Urbana-Champaign

External person

Victoria Chen

  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Minghui Hong

  • Department of Electrical and Computer Engineering
  • National University of Singapore

External person

Shermin Arab

  • University of Southern California
  • Department of Electrical Engineering
  • University of Southern California

External person

Clarence Chan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Catrina Coleman

  • The University of Texas at Arlington
  • University of Texas at Arlington

External person

T. O. Drews

  • University of Illinois Urbana-Champaign
  • Department of Chemical Engineering
  • Departments of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Chem. and Bimolecular Eng.
  • Department of Chemical Engineering
  • University of Illinois at Urbana-Champaign

External person

Dongseok Kang

  • University of Southern California
  • Mork Family Department of Chemical Engineering and Materials Science, University of Southern California
  • Department of Chemical Engineering and Materials Science
  • Departments of Chemical Engineering and Materials Science
  • University of Southern California

External person

Wei Sun

  • Lehigh University

External person

R. A. Kruse

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign

External person

Ari Lee

  • Korea Photonics Technology Institute
  • Korea Potonics Technology Institute
  • Korea Photonics Technology Institute

External person

Xing Jiang

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yujie Xiong

  • University of Washington
  • Washington University St. Louis
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Soon Hyoung Hwang

  • Korea Institute of Machinery and Materials

External person

Chien Chung Fu

  • National Tsing Hua University

External person

Longhua Tang

  • Tsinghua University
  • Zhejiang University
  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemistry, Key Laboratory of Bioorganic Phosphorus Chemistry and Chemical Biology (Ministry of Education), Tsinghua University
  • Department of Optical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chia Yen Huang

  • National Yang Ming Chiao Tung University

External person

Pierre Wiltzius

  • University of California at Santa Barbara
  • Bell Laboratories
  • Department of Physics
  • Bell Laboratories, Lucent Technologies
  • Lucent Technologies
  • Alcatel-Lucent
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Lucent
  • Division of Mathematical, Life, and Physical Sciences
  • Department of Materials Science and Engineering
  • Department of Physics
  • Bell Labs
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Nokia
  • University of Illinois at Urbana-Champaign

External person

Dong Seob Kim

  • The University of Texas at Austin
  • Texas Materials Institute

External person

Zhenyang Xia

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Matt Dejarld

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. B. Qadri

  • Naval Research Laboratory

External person

Mohammad Malik

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tobias Gokus

  • Neaspec GmbH

External person

Anthony Banks

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Physics
  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • Neurolux Inc
  • Wearifi Inc.
  • University of Illinois at Urbana-Champaign

External person

D. D. Koleske

  • Naval Research Laboratory
  • Sandia National Laboratories
  • Chemical Processing Science Dept.

External person

Siddarth Krishnan

  • IBM Research
  • IBM

External person

Seon Woo Lee

  • Argonne National Laboratory
  • The University of Chicago
  • Argonne Nationial Laboratory
  • Argonne National Laboratory

External person

Sin Liang Ou

  • National Chung Hsing University
  • Department of Materials Science and Engineering

External person

Guoyan Zhou

  • East China University of Science and Technology
  • Northwestern University
  • Key Laboratory of Pressure Systems and Safety (MOE)

External person

H. Frisch

  • University of Wisconsin-Madison
  • The University of Chicago
  • Yale University
  • Slovak Academy of Sciences
  • University of Bologna
  • Enrico Fermi Institute, University of Chicago
  • Argonne National Laboratory
  • Enrico Fermi Institute, University of Chicago
  • Brandeis University
  • Fermi National Accelerator Laboratory
  • National Institute for Nuclear Physics
  • Harvard University
  • University of Illinois Urbana-Champaign
  • High Energy Accelerator Research Organization, Tsukuba
  • Lawrence Berkeley National Laboratory
  • University of Pennsylvania
  • Scuola Normale Superiore di Pisa
  • Purdue University
  • Rockefeller University
  • Rutgers - The State University of New Jersey, New Brunswick
  • Texas A&M University
  • University of Tsukuba
  • Tufts University
  • Johns Hopkins University
  • University of Rochester
  • Enrico Fermi Institute, University of Chicago
  • Enrico Fermi Institute, University of Chicago
  • Superconducting Super Collider Laboratory
  • University of California, Los Angeles
  • University of Padua
  • University of New Mexico
  • University of Michigan, Ann Arbor
  • University of Pittsburgh
  • Michigan State University
  • Duke University
  • Massachusetts Institute of Technology
  • Osaka City University
  • Academia Sinica Taiwan
  • McGill University
  • University of Toronto
  • Istituto Nazionale di Fisica Nucleae
  • Di Frascati Istituto Nazionale
  • Texas Tech University
  • Academia Sinica - Institute of Physics
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale di Fisica Nucleare
  • Enrico Fermi Institute
  • Istituto Nazionale di Fisica Nucleare
  • INFNSezione di Padova
  • National Laboratory for High Energy Physics (KEK)
  • Institute of Physics
  • Istituto Nazionale di Fisicia Nucleare
  • KEK
  • Istituto Nazionale di Fisica Nucleare
  • University and Scuola Normale Superiore of Pisa
  • Istituto Nazionale di Fisica Nucleare
  • United States Department of Energy
  • Fermi National Accelerator Laboratory
  • Argonne Nationial Laboratory
  • University of Illinois at Urbana-Champaign
  • The University of Chicago
  • Argonne National Laboratory
  • Duke University
  • Michigan State University
  • University of Wisconsin-Madison
  • University of California at Los Angeles
  • Harvard University
  • University of Pisa
  • Osaka Metropolitan University

External person

Ahyoung Kim

  • University of Illinois at Urbana-Champaign

External person

Borui Xu

  • Department of Materials Science
  • Fudan University

External person

Eli Yablonovitch

  • Department of Electrical Engineering and Computer Sciences, University of California, Berkeley
  • Berkeley
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Electrical Engineering and Computer Sciences Department
  • Electrical Engineering and Computer Sciences Department
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • University of California at Berkeley

External person

J. H. Eraker

  • Ball Corporation

External person

G. C. Papen

  • University of Illinois Urbana-Champaign
  • University of California at San Diego
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. W. Kim

  • Seoul National University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Beckman Institute for Advanced Science and Technology
  • Sch. of Mat. Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. W. Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Aadil Wassem

  • University of Texas at Austin

External person

Yong Zhang

  • University of Electronic Science and Technology of China

External person

Wen Ren

  • University of Illinois at Urbana-Champaign

External person

Jun Li

  • Kansas State University

External person

Tzu Wei Wang

  • National Chung Hsing University

External person

Po Liang Liu

  • National Chi Nan University
  • National Chung Hsing University

External person

Young Min Song

  • Seitz Materials Research Laboratory
  • Department of Electronic Engineering, Pusan National University
  • University of Illinois Urbana-Champaign
  • Pusan National University
  • Gwangju Institute of Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • School of Electrical Engineering and Computer Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jonathan P. McCandless

  • Wyle Laboratories, Inc.

External person

Qiang Ma

  • Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University

External person

Chaoqun Zhou

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Columbia University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kazuki Shigeta

  • Departments of Materials Science and Engineering, Beckman Institute, Frederick Seitz Materials Research Laboratory
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Debbie G. Senesky

  • Stanford University
  • Department of Aeronautics and Astronautics
  • Stanford University

External person

Meng Yin Wu

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Junxia Shi

  • University of Illinois at Chicago

External person

Xinran Wang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Nanjing University

External person

Fei Liu

  • Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University
  • Northwestern University

External person

K. Lee

  • University of Illinois at Urbana-Champaign

External person

Klaus Attenkofer

  • The University of Chicago
  • Enrico Fermi Institute
  • The University of Chicago

External person

Hoon Sik Kim

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Neil Moser

  • George Mason University

External person

Jhih Kai Huang

  • National Yang Ming Chiao Tung University
  • Department of Photonics

External person

Zhuoyuan Zheng

  • University of Illinois Urbana-Champaign
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Nanjing Tech University
  • University of Illinois at Urbana-Champaign

External person

Rainer D. Beck

  • University of California at Los Angeles

External person

Jae Hun Kim

  • Korea Institute of Science and Technology

External person

Kyle G. Tezanos

  • Rochester Institute of Technology

External person

Miguel Muñoz Rojo

  • Department of Electrical Engineering, Stanford University
  • University of Twente
  • Stanford University
  • Stanford University

External person

J. M. Myoung

  • Samsung Advanced Inst of Technology
  • University of Illinois Urbana-Champaign
  • Samsung Advanced Institute of Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Depts. of Mat. Sci. and Eng.
  • Department of Electrical and Computer Engineering
  • Samsung
  • University of Illinois at Urbana-Champaign
  • Yonsei University
  • University of Illinois at Urbana-Champaign

External person

Jin Young Kim

  • Ulsan National Institute Science and Technology (UNIST)
  • Ulsan National Institute of Science and Technology
  • School of Energy and Chemical Engineering
  • School of Energy and Chemical Engineering, Ulsan National Institute of Science and Technology (UNIST)

External person

Ha Uk Chung

  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Seitz Materials Research Laboratory
  • Northwestern University
  • Department of Materials Science and Engineering
  • Center for Quantum Devices
  • Simpson Querrey Institute
  • Center for Photonic Communication and Computing
  • University of Illinois at Urbana-Champaign
  • Sibel Inc.
  • University of Illinois at Urbana-Champaign

External person

Xiaogang Chen

  • University of Illinois Urbana-Champaign
  • Columbia University
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Weihao Weng

  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM

External person

Simon Dunham

  • Seitz Materials Research Laboratory
  • Department of Chemistry
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry and Biochemistry, Georgia Institute of Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Georgia Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Weill Cornell Medicine
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Radiology
  • Department of Radiology
  • Cornell University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ji Lin Shen

  • Chung Yuan Christian University
  • Department of Physics

External person

Yujie Liu

  • University of Michigan, Ann Arbor

External person

Etienne Menard

  • Semprius, Inc.
  • Universite Pierre et Marie Curie
  • SPCSI/DRECAM
  • University of Illinois Urbana-Champaign
  • Beckman Institute
  • SPCSI/DRECAM/DSM
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Sorbonne Université
  • DuPont
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Laboratoire de Chimie
  • Central Research
  • Laboratoire de Chimie Organique
  • Université Paris-Saclay
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hao Chih Yuan

  • National Renewable Energy Laboratory

External person

Kanglin Xiong

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Tanushree Choudhury

  • Pennsylvania State University

External person

Nerissa Draeger

  • Lam Research Corporation

External person

Effendi Rusli

  • University of Illinois Urbana-Champaign
  • Departments of Chemistry of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • National University of Singapore
  • University of Illinois at Urbana-Champaign

External person

Parsian K. Mohseni

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Pochet

  • CEREM-SRMP
  • CE-Saclay
  • Sect. de Rech. de Metall. Physique
  • CE Saclay
  • DEN-DMN-SRMP
  • CEA-Saclay
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Grenoble Alpes
  • Commissariat a L'Energie Atomique CEA
  • Atomistic Simulation Laboratory (L-Sim)
  • Laboratoire de Simulation Atomistique (L-Sim)
  • Université Paris-Saclay
  • Laboratory of Atomistic Simulation (L-Sim)
  • ComUE Paris-Saclay

External person

Sami Znati

  • Rochester Institute of Technology

External person

Ruobing Pan

  • Department of Materials Science
  • Fudan University

External person

Xu Cheng

  • Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University

External person

Fan Zhang

  • Tsinghua University
  • Center for Mechanics and Materials, Tsinghua University
  • Center for Flexible Electronics Technology
  • Department of Engineering Mechanics, Tsinghua University

External person

Changqing Jiang

  • Tsinghua University
  • Man-Machine-Environment Engineering Institute

External person

R. Stephen Berry

  • University of California, Los Angeles
  • The University of Chicago
  • James Franck Institute
  • Department of Chemistry and Biochemistry
  • The University of Chicago
  • University of California at Los Angeles

External person

Hsieh Chih Huang

  • University of Illinois at Urbana-Champaign

External person

Gregg Jessen

  • Wright-Patterson AFB
  • Air Force Research Laboratory
  • Air Force Research Laboratory

External person

Jonathan R. Felts

  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering, Texas A and M University
  • Texas A&M University
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering and Sciences
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Manos Kapritsos

  • University of Michigan, Ann Arbor

External person

Nitin Choudhary

  • Plasma-Therm LLC

External person

Qingyi Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Jeong Dong Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. W. Bonn

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Huanyu Cheng

  • Northwestern University
  • Tsinghua University
  • Center for Engineering and Health
  • Korea University College of Medicine
  • Korea University
  • University of Illinois Urbana-Champaign
  • Pennsylvania State University
  • Center for Engineering and Health and Skin Disease Research Center
  • Department of Engineering Science and Mechanics
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Civ. Eng. and Mech. Eng.
  • Department of Civil and Environmental Engineering
  • Global Research Laboratory, Department of Biochemistry and Molecular Biology, Korea University College of Medicine
  • Department of Civil and Environmental Engineering
  • Department of Engineering Mechanics, Tsinghua University
  • Mechanical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sheng Wen Wang

  • National Yang Ming Chiao Tung University
  • Department of Photonics

External person

Erik W. Dent

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Shuodao Wang

  • Northwestern University
  • University of Illinois Urbana-Champaign
  • Oklahoma State University
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Mechanical and Aerospace Engineering
  • School of Mechanical/Aerospace Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Steven Randolph

  • Oak Ridge National Laboratory

External person

Anoop Kumar Singh

  • National Chi Nan University

External person

Dongqing Xiao

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Haotian Yu

  • School of Microelectronics Engineering
  • Hefei University of Technology

External person

Jimmy H. Ni

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Sergey Suslov

  • School of Electrical and Computer Engineering
  • Purdue University
  • Qatar Environment and Energy Research Institute
  • Qatar Foundation
  • Birck Nanotechnology Center
  • Hamad bin Khalifa University

External person

Steven J. McKeown

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Derek R. Wood

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tae Il Kim

  • University of Illinois Urbana-Champaign
  • Sungkyunkwan University
  • Institute for Basic Science
  • Dept. of Mat. Sci. and Engineering
  • School of Chemical Engineering, Sungkyunkwan University (SKKU)
  • Department of Materials Science and Engineering
  • IBS Center for Neuroscience Imaging Research (CNIR), Institute for Basic Science (IBS)
  • Center for Neuroscience Imaging Research (CNIR), Institute of Basic Science (IBS), Sungkyunkwan University (SKKU)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Renhan Wang

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Nakamura

  • Sony Group Corporation

External person

Qingyi Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hongyi Mi

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

S. B. Cronin

  • University of Southern California
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • University of Southern California

External person

Sohee Jeon

  • Korea Institute of Machinery and Materials

External person

Ning C. Wang

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

Richard Wachnik

  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM

External person

Jinghong Li

  • Tsinghua University
  • Department of Chemistry
  • Department of Chemistry, Key Laboratory of Bioorganic Phosphorus Chemistry and Chemical Biology (Ministry of Education), Tsinghua University

External person

Wubin Bai

  • Northwestern University
  • Center for Bio-Integrated Electronics
  • University of North Carolina at Chapel Hill
  • Department of Applied Physical Sciences

External person

Leijun Yin

  • Arizona State University
  • School of Electrical

External person

Antonio Crespo

  • Wright-Patterson AFB
  • Air Force Research Laboratory
  • Air Force Research Laboratory

External person

Michael Arnold

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Kedar Hippalgaonkar

  • Agency for Science, Technology and Research, Singapore
  • ASTAR (Agency for Science

External person

Young Ho Song

  • Korea Photonics Technology Institute

External person

Xiang Luo

  • Hefei University of Technology

External person

Sheng Xu

  • University of Illinois Urbana-Champaign
  • University of California at San Diego
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of NanoEngineering
  • Department of NanoEngineering
  • Department of NanoEngineering
  • Department of NanoEngineering
  • Department of Materials Science and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yifan Shen

  • University of Michigan, Ann Arbor

External person

Zhuoran Long

  • Yale University

External person

Z. J. Liu

  • Agency for Science, Technology and Research, Singapore
  • Institute of High Performance Computing A Star
  • Institute of High Performance Computing, Astar
  • Institute for High Performance Computing
  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Hyeok Joong Kang

  • Korea Institute of Machinery and Materials

External person

Soma Chattopadhyay

  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign

External person

Juwon Wharwood

  • Rochester Institute of Technology
  • Howard University

External person

Cheng Wei Qiu

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

Michael A. Mastro

  • Naval Research Laboratory

External person

Christopher D. English

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Scott Wicker

  • University of Texas at Austin

External person

K. Jacobs

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Suhas Somnath

  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yiqi Wang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

E. Yoon

  • Seoul National University
  • School of Materials Science and Engineering
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Department of Materials Science and Engineering
  • Compound Semiconductor Epitaxy Laboratory
  • Sch. of Mat. Science and Engineering

External person

Vijay Narayanan

  • IBM
  • Research Division
  • IBM Semiconductor Research and Development Center (SRDC)

External person

Mengdi Han

  • Peking University
  • University of Illinois Urbana-Champaign
  • National Key Laboratory of Science and Technologyon Micro/Nano Fabrication
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Northwestern University
  • Center for Bio-Integrated Electronics
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jun Luo

  • CAS - Institute of Microelectronics
  • Chinese Academy of Sciences
  • University of Western Australia
  • Huazhong University of Science and Technology
  • Embry-Riddle Aeronautical University
  • Indiana University Bloomington

External person

Daniel Rosenmann

  • Argonne National Laboratory
  • Argonne National Laboratory

External person

Yuan Liu

  • Tsinghua University

External person

Chris Edwards

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Quantitative Light Imaging Laboratory
  • Micro and Nanotechnology Lab
  • Quantitative Phase Imaging Laboratory
  • Department of Electrical and Computer Engineering
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Doo Gun Kim

  • Chung-Ang University
  • Microwave and Lightwave Telecommunications Laboratory
  • School of Electrical and Electronics Engineering
  • Microwave and Lightwave Telecommunications Laboratory
  • Korea Photonics Technology Institute

External person

Jongho Lee

  • Gwangju Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • School of Mechatronics
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mechatronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michele Baldini

  • Leibniz Institute for Crystal Growth

External person

Subing Qu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Myunghoon Seong

  • Mechanical Science and Engineering Department, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jeong Woo Hwang

  • Korea Photonics Technology Institute

External person

Mika Saarinen

  • Tampere University of Technology
  • Tampere University of Technology
  • Tampere University

External person

Yi Yu Zhang

  • Nanyang Technological University

External person

Zidong Wang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hai Ping Cheng

  • University of California, Los Angeles
  • The University of Chicago
  • University of Florida
  • James Franck Institute
  • Department of Chemistry and Biochemistry
  • The University of Chicago
  • University of California at Los Angeles

External person

Ping Wang

  • University of Michigan, Ann Arbor

External person

Kyung In Jang

  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Daegu Gyeongbuk Institute of Science and Technology
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Seitz Materials Research Laboratory
  • Department of Robotics Engineering
  • Department of Materials Science and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. S. El-Shall

  • University of California, Los Angeles
  • Department of Chemistry and Biochemistry, University of California at Los Angeles
  • University of California at Los Angeles

External person

J. J. Coleman

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qinglei Guo

  • Center of Nanoelectronics and School of Microelectronics
  • Shandong University
  • University of Illinois at Urbana-Champaign
  • Fudan University
  • University of Illinois at Urbana-Champaign

External person

Guoqiang Zhang

  • Nippon Telegraph & Telephone

External person

Christof Teuscher

  • Portland State University
  • Department of Electrical and Computer Engineering

External person

Yuncong Liu

  • University of Florida

External person

Dae Hyeong Kim

  • Seoul National University
  • Center for Nanoparticle Research of Institute for Basic Science, School of Chemical and Biological Engineering, Seoul National University
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • School of Chemical and Biological Engineering
  • Department of Materials Science
  • Institute of Chemical Processes
  • Department of Materials Science and Engineering
  • Institute for Basic Science
  • University of Illinois at Urbana-Champaign
  • Korea Basic Science Institute
  • University of Illinois at Urbana-Champaign

External person

Jeongyong Kim

  • University of Illinois Urbana-Champaign
  • University of Cincinnati
  • Department of Physics
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Hsien Hao Tu

  • National Yang Ming Chiao Tung University
  • Departmet of Photonics and Institute of Electro-Optical Engineering

External person

Yunshan Zhao

  • National University of Singapore

External person

K. D. Leedy

  • Wright-Patterson AFB
  • University of Illinois Urbana-Champaign
  • Air Force Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Air Force Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Frank Du

  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person