William Paul King

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Research Output

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Paper
2005

Materials and processes and high resolution patterning using thermal cantilever array lithography

Henderson, C. L., King, W. P., Hua, Y. & Saxena, S., Dec 1 2005. 1 p.

Research output: Contribution to conferencePaper

2004

Nanoscale inking, melting, and soldering with a heated atomic force microscope cantilever tip

King, W. P., Nelson, B. A., Wright, T. L., Sheehan, P. A. & Whitman, L. J., Dec 1 2004, p. 509-510. 2 p.

Research output: Contribution to conferencePaper

2003

A novel compact method for thermal modeling of on-chip interconnects based on the finite element method

Gurrum, S. P., Joshi, Y. K., King, W. P. & Ramakrishna, K., Jan 1 2003, p. 441-445. 5 p.

Research output: Contribution to conferencePaper