William H Sanders

Interim Director, Discovery Partners Institute

1985 …2019
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Network

David Malcolm Nicol

Person: Academic

Masooda N Bashir

Person: Academic

Cukier, Michel

  • University of Maryland, College Park
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Reliability Engineering
  • Department of Mechanical Engineering
  • Center for Reliable and High Performance Computing
  • Center for Reliability Engineering
  • University of Maryland

External person

Courtney, Tod

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • University of Illi-nois
  • University of Illinois

External person

Tso, Kam S.

  • IA Tech, Inc.
  • Inc
  • IEEE

External person

Tai, Ann T.

  • IA Tech, Inc.
  • WW Technology Group
  • Inc
  • IEEE

External person

Joshi, Kaustubh R.

  • AT&T
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Keefe, Ken

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Information Trust Institute

External person

Obal, W. D.

  • University of Arizona
  • Hewlett-Packard
  • University of Illinois at Urbana-Champaign
  • Center for Electronic Packaging Research
  • Center for Compound Semiconductor Microelectronics
  • Storage Solutions Center
  • Entpr. Storage Solutions Division
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Schlichting, Richard D.

  • AT&T
  • University of Arizona
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science

External person

Ramasamy, Harigovind V.

  • University of Illinois at Urbana-Champaign
  • IBM Zurich Research Laboratory
  • IBM Research
  • IEEE
  • Center for Compound Semiconductor Microelectronics
  • IBM Research
  • IBM

External person

Qureshi, M. A.

  • University of Arizona
  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • Lucent
  • Center for Reliable and High Performance Computing
  • Center for Electronic Packaging Research
  • Center for Compound Semiconductor Microelectronics

External person

Fawaz, Ahmed

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Information Trust Institute
  • Information Trust Institute

External person

Berthier, Robin

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Temple, William G.

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced Digital Sciences Center

External person

Chau, Savio N.

  • Jet Propulsion Laboratory, California Institute of Technology
  • IA Tech, Inc.
  • Inc
  • National Aeronautics and Space Administration
  • National Aeronautics and Space Administration
  • IEEE

External person

Gaonkar, Shravan

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of CS
  • Department of Computer Science, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • CS Dept.
  • University of Illinois
  • Department of CS
  • Univ of Illinois

External person

Alkalai, Leon

  • Jet Propulsion Laboratory, California Institute of Technology
  • IA Tech, Inc.
  • Inc
  • National Aeronautics and Space Administration
  • National Aeronautics and Space Administration
  • IEEE

External person

Zonouz, Saman

  • University of Miami
  • University of Illinois at Urbana-Champaign
  • University of Medicine and Dentistry of New Jersey
  • Rutgers - The State University of New Jersey, New Brunswick
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Rutgers University–New Brunswick
  • Department of Electrical and Computer Engineering
  • Rutgers University
  • University of Illi-nois

External person

Deavours, D. D.

  • University of Kansas
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Info. and Telecom. Technology Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Derisavi, Salem

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Daly, David

  • IBM
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Bobba, Rakesh B.

  • National Center for Super Computing Applications (NCSA) Gunter
  • University of Illinois at Urbana-Champaign
  • Oregon State University
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Cheh, Carmen

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science

External person

Noureddine, Mohammad

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Department of Computer Science

External person

Yardley, Timothy M.

  • UIUC
  • University of Illinois at Urbana-Champaign
  • U of Illinois at Urbana
  • Univerity of Illinois at Urbana
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • UIUC

External person

Agbaria, Adnan

  • Coordinated Science Laboratory, University of Illinois
  • IBM
  • AT&T
  • University of Illinois at Urbana-Champaign
  • IEEE
  • IBM Haifa Research Lab
  • IBM Research
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics

External person

Meyer, J. F.

  • University of Michigan, Ann Arbor
  • University of Arizona
  • University of Michigan
  • Department of Electrical Engineering and Computer Science
  • EECS Department
  • Real-Time Computing Laboratory
  • Univ of Michigan, Electr Eng &
  • Real-Time Computing Laboratory
  • Univ of Arizona, Electr & Comput

External person

Rozier, Eric

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Buchholz, Peter

  • Dortmund University

External person

Feddersen, Brett

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute

External person

Kemper, Peter

  • Dortmund University
  • College of William and Mary
  • Department of Computer Science
  • Department of Computer Science

External person

Lam, Vinh Vi

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Lefever, Ryan M.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Chen, Binbin

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced Digital Sciences Center
  • Singapore University of Technology and Design

External person

Rausch, Michael

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute

External person

Thakore, Uttam

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Seri, Mouna

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

McQuinn, Michael G.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Krishna, Varun Badrinath

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Information Trust Institute

External person

Ujcich, Benjamin E.

  • Information Trust Institute
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Kant, Latha

  • Bellcore
  • Storage Systems Div
  • University of Arizona
  • Telcordia Technologies
  • University of Illinois at Urbana-Champaign
  • Center for Electronic Packaging Research

External person

Singh, Sankalp

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

Weaver, Gabriel A.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Krishnamurthy, Sudha

  • University of Virginia
  • United Technologies Corporation
  • Deutsche Telekom
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Center for Reliable and High Performance Computing
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Chen, Shuyi

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

Chen, Binbin

  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

van Moorsel, A. P A

  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • University of Twente
  • Lucent

External person

Malhis, Luai M.

  • University of Arizona
  • Storage Systems Div
  • University of Illinois at Urbana-Champaign
  • Center for Reliable and High Performance Computing
  • Center for Electronic Packaging Research
  • Center for Compound Semiconductor Microelectronics

External person

Rubel, Paul

  • BBN Technologies
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Khurana, Himanshu

  • National Center for Super Computing Applications (NCSA) Gunter
  • Honeywell Automation and Control Systems Labs
  • Integrated Security Technologies Division
  • Honeywell
  • Honeywell Research Labs
  • University of Illinois at Urbana-Champaign
  • Honeywell ACS Labs
  • Honeywell
  • Honeywell Research Labs
  • Honeywell ACS Labs
  • Integrated Security Technologies Division

External person

Bakken, David

  • Washington State University Pullman
  • University of Illinois at Urbana-Champaign
  • BBN Technologies
  • Sch. of Elec. Eng./Computer Science

External person

Karr, David A.

  • L-3 Communications
  • University of Illinois at Urbana-Champaign
  • BBN Technologies

External person

Martinez, R.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Pal, Partha

  • BBN Technologies

External person

Griffith, Mark

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Chandra, Ramesh

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Alsafadi, Y.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Ren, Jennifer

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Grochocki, David

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

German, Reinhard

  • Technical University of Berlin
  • University of Illinois at Urbana-Champaign
  • Lucent

External person

Cárdenas, Alvaro A.

  • University of Texas at Dallas
  • Fujitsu

External person

Tippenhauer, Nils Ole

  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Singapore University of Technology and Design
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Bazarbayev, Sobir

  • University of Illinois at Urbana-Champaign

External person

Ford, Michael D.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Webster, Patrick

  • ARM Inc.
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Huh, Jun Ho

  • University of Illinois at Urbana-Champaign
  • Honeywell ACS Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Honeywell ACS Labs

External person

Dong, Xinshu

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Schantz, Richard E.

  • BBN Technologies
  • University of Illinois at Urbana-Champaign

External person

Sabnis, Chetan

  • SingleSignOn.Net
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Ren, Yansong

  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Lucent
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Lyons, James

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

LeMay, Elizabeth

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Muehrcke, Carol

  • Cyber Defense Agency

External person

An, Yongkyu

  • University of Illinois at Urbana-Champaign
  • Department of Nuclear
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign

External person

Peccoud, Jean

  • Virginia Polytechnic Institute and State University
  • Virginia Bioinformatics Institute

External person

Hermanns, Holger

  • University of Twente
  • Saarland University
  • Faculty of Computer Science
  • Database Group

External person

Lindqvist, Ulf

  • SRI International

External person

Heine, Erich

  • University of Illinois at Urbana-Champaign

External person

Wright, Ronald Joseph

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Cheung, Steven

  • SRI International

External person

Hsu, Amanda

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Stevens, Fabrice

  • France Telecom R and D
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • France Telecom Research and Development
  • University of Illi-nois

External person

Pistole, Jessica

  • University of Illinois at Urbana-Champaign

External person

Prodromides, Kevin H.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Cunningham, Robert

  • Massachusetts Institute of Technology
  • Information Systems Technology Group

External person

Jahanian, Farnam

  • University of Michigan, Ann Arbor
  • Arbor Networks
  • U. Michigan
  • U. Michigan
  • University of Michigan
  • University of Michigan
  • Electrical Engineering and Computer Science
  • Dept. of Electrical Engineering and Computer Science
  • Computer Science and Engineering
  • Arbor Networks, Inc.
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Dept. of Computer Science and Engineering
  • Arbor Networks, Inc.
  • Control Systems Laboratory
  • Dept. of Computer Science and Engineering
  • Department of EECS
  • Merit Network, Inc.

External person

Nam, J.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Zhivich, Michael

  • Massachusetts Institute of Technology

External person

Freire, Roberto S.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Pawlowski, Ronald

  • Pacific Northwest National Laboratory

External person

Jauhar, Sumeet

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Webber, Franklin

  • BBN Technologies

External person

Van Ruitenbeek, Elizabeth

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering

External person

Doyle, Jay M.

  • Honeywell
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Clark, Graham

  • Citrix Systems Inc.
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Citrix Systems, Inc.

External person

Woodworth, Bradley

  • Pacific Northwest National Laboratory

External person

Henke, David

  • University of Illinois at Urbana-Champaign

External person

Merchant, Arif

  • Hewlett-Packard
  • Alphabet Inc.

External person

Vu, An Hoa

  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Fong, Martin

  • SRI International

External person

Keeton, Kimberly

  • Hewlett-Packard

External person

Bohara, Atul

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Tvedt, Janet E.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Kudrimoti, Abhijit

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Valdes, Alfonso

  • SRI International
  • University of Illinois at Urbana-Champaign

External person

Robinson, Eric

  • Pacific Northwest National Laboratory

External person

Couvillion, Joseph A.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Loyall, Joseph

  • BBN Technologies

External person

Zhou, Pin

  • IBM
  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • Siebel Center for Computer Science

External person

Maxion, Roy

  • CMU
  • Carnegie Mellon University

External person

Eskins, Douglas

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Chandra, Rupak

  • Cisco Systems

External person

Malik, Salman

  • University of Illinois at Urbana-Champaign

External person

Cao, Jiannong

  • Hong Kong Polytechnic University
  • Polytechnic U
  • SMARTCOMP

External person

Overholt, Mark

  • University of Illinois at Urbana-Champaign

External person

Zhang, Jing

  • University of Michigan, Ann Arbor
  • University of Michigan
  • Dept. of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science

External person

Skowyra, Richard

  • Massachusetts Institute of Technology

External person

Tong, Anthony

  • University of Illinois at Urbana-Champaign

External person

Marturano, Andrew

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute

External person

Houmansadra, Amir

  • University of Illinois School of Dentistry
  • Department of Electrical and Computer Engineering

External person

Sharma, A.

  • University of Illinois at Urbana-Champaign
  • Center for Reliable and High Performance Computing
  • Center for Compound Semiconductor Microelectronics

External person

Marzullo, Keith

  • University of California at San Diego

External person

Siewiorek, Daniel

  • Carnegie Mellon University
  • Department of Computer Science and Electrical and Computer Engineering
  • Electrical Engineering Department

External person

Masetti, Giulio

  • CNR
  • University of Pisa

External person

Verissimo, Paulo

  • Instituto Superior Tecnico Lisboa
  • Alameda da Universidade
  • University of Lisbon

External person

Edmundson, Anne

  • Princeton University

External person

Kopetz, Hermann

  • Vienna University of Technology

External person

Agbariat, Adnan

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illi-nois

External person

Mashima, Daisuke

  • Fujitsu
  • Advanced Digital Sciences Center of UIUC

External person

Rhee, Will

  • University of Michigan, Ann Arbor
  • University of Michigan
  • Office of Information and Infrastructure Assurance
  • Office of Information and Infrastructure Assurance

External person

Qureshit, M. A.

  • University of Illinois at Urbana-Champaign
  • Center for Reliable and High Performance Computing

External person

Yau, David K Y

  • Advanced Digital Sciences Center
  • Singapore University of Technology and Design
  • Advanced Digital Sciences Center
  • Illinois at Singapore
  • Advanced Digital Sciences Center

External person

Sollima, C.

  • University of Pisa
  • University of Illinois at Urbana-Champaign
  • Department of Nuclear
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign

External person

Gu, Peng

  • Information Trust Institute
  • University of Illinois at Urbana-Champaign

External person

Norman, Gethin

  • University of Glasgow

External person

Beaudet, Steven T.

  • General Dynamics

External person

Schmittner, Christoph

  • Austrian Institute of Technology

External person

Farivar, Reza

  • University of Illinois at Urbana-Champaign
  • Yahoo Research Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Okhravi, Hamed

  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Sch. of Elec./Computer Engineering
  • Massachusetts Institute of Technology

External person

Gammel, Dennis

  • Schweitzer Engineering Laboratories, Inc.
  • Schweitzer Engineering Laboratories, Inc.

External person

Rogers, Edmond

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Atighetchi, Michael

  • BBN Technologies

External person

Lee, Insup

  • U. Pennsylvania
  • U. Pennsylvania
  • University of Pennsylvania

External person

Sharma, Anil K.

  • University of Maryland, College Park
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Engineering
  • Departments of Chemistry
  • Roger Adams Laboratory
  • University of Maryland
  • Roger Adams Laboratory
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Iwano, Kazuo

  • Smarter Cities-IBM

External person

Widjanarkot, F. K.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Lee, Kiryung

  • Technion-Israel Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Georgia Institute of Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of ECE
  • School of Electrical and Computer Engineering
  • Department of Computer Science
  • Department of Statistics
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Ohio State University
  • Department of Electrical and Computer Engineering
  • School of ECE

External person

Davis, Katherine R.

  • PowerWorld Corporation
  • University of Illinois at Urbana-Champaign

External person

Rufino, Josá

  • U. Lisboa
  • U. Lisboa
  • University of Lisbon

External person

Helal, Sumi

  • U. Florida
  • U. Florida

External person

Liu, Jane

  • Academia Sinica Taiwan

External person

Arlat, Jean

  • Universite Toulouse 1 Capitole
  • Laboratoire d'Analyse et d'Architecture des Systemes
  • Universite de Toulouse
  • LAAS-NRS
  • Laboratory for Analysis and Architecture of Systems

External person

Obermaisser, Roman

  • U. Siegen
  • U. Siegen
  • University of Siegen

External person

Tran, Bao Anh N

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Wargaming

External person

Carroll, Thomas E.

  • PNNL
  • Pacific Northwest National Laboratory

External person

Vi Lam, Vinh

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Dagle, Jeff

  • Pacific Northwest National Laboratory

External person

Singh, Sankalp

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illi-nois

External person

Kaaniche, Mohamed

  • Universite Toulouse 1 Capitole
  • Universite de Toulouse
  • Laboratoire d'Analyse et d'Architecture des Systemes

External person

Zeigler, Bernard P.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Kuratti, Anand

  • University of Illinois at Urbana-Champaign

External person

Klaren, Ric

  • University of Twente
  • Database Group

External person

Athanasopoulou, Eleftheria

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Neves, Nuno Ferreira

  • Instituto Superior Tecnico Lisboa
  • Alameda da Universidade
  • University of Lisbon

External person

Faghri, Faraz

  • University of Illinois at Urbana-Champaign
  • National Institutes of Health
  • Laboratory of Neurogenetics
  • Computer Science, University of Illinois at Urbana-Champaign
  • Molecular Genetics Section

External person

Rogers, K. M.

  • PowerWorld Corporation
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois

External person

Katoen, Joost Pieter

  • University of Twente
  • Database Group

External person

Tan, Rui

  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Advanced Digital Sciences Center
  • Nanyang Technological University
  • Illinois at Singapore
  • Advanced Digital Sciences Center
  • School of Computer Science and Engineering

External person

Macwan, Richard

  • University of Illinois at Urbana-Champaign

External person

Xia, Feng

  • Dalian U. of Technology
  • Dalian University of Technology

External person

Bashiry, Masooda

  • School of Information Science

External person

Kavanaugh, G. P.

  • University of Illinois at Urbana-Champaign

External person

Roudier, Yves

  • Eurecom
  • EURECOM

External person

Jones, Jeremy

  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Zaraket, Fadi A.

  • American University of Beirut
  • Department of Electrical and Computer Engineering

External person

Widjanarko, F. K.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Buss, Martin

  • Ludwig Maximilian University of Munich
  • Technical University of Munich

External person

Harrison, Michael

  • Queen Mary University of London

External person

Badrinath Krishna, Varun

  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign

External person

Watro, Ronald

  • BBN Technologies

External person

McAuliffe, Kevin

  • IBM Research

External person

Landry, James

  • Massachusetts Institute of Technology

External person

Richardson, W.

  • University of Arizona

External person

Manish, Rai

  • University of Arizona

External person

Thakker, Purvesh

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • ION Project
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Patel, Janak H.

  • USA
  • University of Illinois at Urbana-Champaign
  • Syracuse University
  • IEEE
  • Jet Propulsion Laboratory, California Institute of Technology
  • Center for Reliable and High Performance Computing
  • Center for Reliable and High-Performance Computing
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Coord. Sci. Lab.
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Thin Film and Charged Particle Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Davis, Charles M.

  • PowerWorld Corporation
  • University of Illinois at Urbana-Champaign
  • PowerWorld Corporation
  • PowerWorld Corporation
  • PowerWorld Corporation
  • Department of Electrical and Computer Engineering
  • Sch. of Elec./Computer Engineering

External person

Berman, Mark E.

  • University of Illinois at Urbana-Champaign

External person

Bobbo, Rakesh B.

  • University of Illinois at Urbana-Champaign

External person

Martin, Jason R.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Cope, Eric

  • IBM Research

External person

Ozeki, T.

  • University of Arizona

External person

Bailey, M. L.

  • University of Arizona

External person

Ma, Zhendong

  • Austrian Institute of Technology

External person

Duggal, Harpreet S.

  • University of Illinois at Urbana-Champaign

External person

Wu, Ziping

  • University of Illinois at Urbana-Champaign

External person

Muralidhar, K. H.

  • University of Michigan, Ann Arbor
  • Univ of Michigan, Electr Eng &

External person

Rexford, Jennifer

  • Princeton University
  • AT&T
  • Dept. of Computer Science

External person

Vicario, Enrico

  • University of Florence

External person

Ambardekar, Vaidehi V.

  • University of Illinois at Urbana-Champaign

External person

Gupta, Vishu

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

Van Moorsei, Aad P.A.

  • University of Illinois at Urbana-Champaign
  • Lucent

External person

Ron, Johnson

  • University of Arizona

External person

Stratton, Frank

  • University of Illinois at Urbana-Champaign

External person

Berthiera, Robin

  • University of Illinois School of Dentistry
  • Department of Electrical and Computer Engineering

External person

Keidar, Idit

  • Technion-Israel Institute of Technology
  • Department of Electrical Engineering

External person

Bohnenkamp, Henrik

  • University of Twente
  • Database Group

External person

Manz, David O.

  • PNNL
  • Pacific Northwest National Laboratory

External person

Trivedi, K. S.

  • University of Illinois at Urbana-Champaign
  • Duke University
  • College of William and Mary
  • Department of Electrical Engineering, Duke University

External person

Mitchell, Quincy

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Chen, Daniel

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Center for Reliable and High Performance Computing
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Niemira, William

  • University of Illinois at Urbana-Champaign

External person

Polychronopoulos, Constantine D.

  • University of Illinois at Urbana-Champaign
  • Center for Supercomputing Research and Development
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Vanmoorsel, Aad P A

  • University of Illinois at Urbana-Champaign

External person

Guldner, Cody

  • Department of Computer Science

External person

Roberto, Freire

  • University of Arizona

External person

Parks, Donald

  • U.S. Department of Defense

External person

Komatsu, K.

  • University of Arizona

External person

Edgar, Thomas W.

  • PNNL
  • Pacific Northwest National Laboratory

External person

Jero, Samuel

  • Massachusetts Institute of Technology

External person

Anand, Nitin

  • University of Maryland, College Park
  • Department of Mechanical Engineering
  • University of Maryland

External person

Ihde, Michael

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Haddadi, Hamed

  • Queen Mary U. London
  • Queen Mary U. London
  • Queen Mary University of London

External person

Plante, Raymond

  • University of Illinois at Urbana-Champaign
  • Natl. Ctr. Supercomputing Applic.
  • Natl. Ctr. Supercomputing Applic.
  • Department of Astronomy
  • Department of Astronomy

External person

Chen, Yen Kuang

  • Intel
  • Architecture Research Lab

External person

Rai, M.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Deconinck, Geert

  • Katholic U
  • KU Leuven

External person

Movaghar, A.

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

Nita-Rotaru, Cristina

  • Northeastern University

External person

Wang, Qi

  • University of Illinois at Urbana-Champaign

External person

Johnson, R.

  • University of Arizona
  • Center for Electronic Packaging Research

External person

West, Stephen C.

  • Storage Systems Div

External person

Unkenholz, Willard

  • U.S. Department of Defense

External person

Powell, David

  • Laboratoire d'Analyse et d'Architecture des Systemes

External person

Hanna, Steve

  • University of Illinois at Urbana-Champaign

External person

Vijay, Sameer

  • Department of Computer Science

External person

Paulitsch, Michael

  • EADS Innovation Works
  • Airbus Group

External person

Sousa, Paulo

  • University of Lisbon

External person

Heng, Liang

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • LLC
  • Baidu
  • Roadstar AI
  • Baidu USA LLC
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign, 306 Talbot Laboratory
  • Department of Electrical Engineering
  • Department of Aeronautics and Astronautics
  • Department of Electrical Engineering
  • Baidu Research

External person

Blough, Douglas M.

  • Georgia Institute of Technology
  • GA Tech

External person