William H Sanders

Interim Director, Discovery Partners Institute

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Network

David Malcolm Nicol

Person: Academic

Michael Donald Bailey

Person: Academic

Masooda N Bashir

Person: Academic

Michel Cukier

  • University of Maryland, College Park
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Reliability Engineering
  • Department of Mechanical Engineering
  • Center for Reliable and High Performance Computing
  • Center for Reliability Engineering
  • University of Maryland

External person

Tod Courtney

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • University of Illi-nois
  • University of Illinois
  • Dept. of Elec. and Comp. Eng.
  • Coordinated Sciences Laboratory
  • University of Illinois

External person

Kam S. Tso

  • IA Tech, Inc.
  • Inc
  • IEEE
  • Technic Inc.

External person

Ann T. Tai

  • IA Tech, Inc.
  • WW Technology Group
  • Inc
  • IEEE
  • Technic Inc.

External person

Kaustubh R. Joshi

  • AT&T
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Ken Keefe

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Information Trust Institute

External person

Harigovind V. Ramasamy

  • University of Illinois at Urbana-Champaign
  • IBM Zurich Research Laboratory
  • IBM Research
  • IEEE
  • Center for Compound Semiconductor Microelectronics
  • IBM Research
  • IBM
  • IBM Research

External person

W. D. Obal

  • University of Arizona
  • Hewlett-Packard
  • University of Illinois at Urbana-Champaign
  • Center for Electronic Packaging Research
  • Center for Compound Semiconductor Microelectronics
  • Storage Solutions Center
  • Entpr. Storage Solutions Division
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Richard D. Schlichting

  • AT&T
  • University of Arizona
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science

External person

Robin Berthier

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Ahmed Fawaz

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Information Trust Institute
  • Information Trust Institute

External person

M. A. Qureshi

  • University of Arizona
  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • Lucent
  • Center for Reliable and High Performance Computing
  • Center for Electronic Packaging Research
  • Center for Compound Semiconductor Microelectronics

External person

William G. Temple

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced Digital Sciences Center

External person

Savio N. Chau

  • Jet Propulsion Laboratory, California Institute of Technology
  • IA Tech, Inc.
  • Inc
  • National Aeronautics and Space Administration
  • National Aeronautics and Space Administration
  • IEEE
  • Technic Inc.

External person

Shravan Gaonkar

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of CS
  • Department of Computer Science, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • CS Dept.
  • University of Illinois
  • Department of CS
  • Univ of Illinois
  • University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Leon Alkalai

  • Jet Propulsion Laboratory, California Institute of Technology
  • IA Tech, Inc.
  • Inc
  • National Aeronautics and Space Administration
  • National Aeronautics and Space Administration
  • IEEE
  • Technic Inc.

External person

Saman Zonouz

  • University of Miami
  • University of Illinois at Urbana-Champaign
  • University of Medicine and Dentistry of New Jersey
  • Rutgers - The State University of New Jersey, New Brunswick
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Rutgers University–New Brunswick
  • Department of Electrical and Computer Engineering
  • Rutgers University
  • University of Illi-nois

External person

D. D. Deavours

  • University of Kansas
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Info. and Telecom. Technology Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Salem Derisavi

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Dept. of Elec. and Comp. Eng.
  • Coordinated Sciences Laboratory

External person

David Daly

  • IBM
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • T.J. Watson Research Center

External person

Rakesh B. Bobba

  • National Center for Super Computing Applications (NCSA) Gunter
  • University of Illinois at Urbana-Champaign
  • Oregon State University
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Carmen Cheh

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Department of Computer Science

External person

Mohammad Noureddine

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Department of Computer Science
  • Department of Computer Science

External person

Timothy M. Yardley

  • UIUC
  • University of Illinois at Urbana-Champaign
  • U of Illinois at Urbana
  • Univerity of Illinois at Urbana
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • UIUC

External person

Adnan Agbaria

  • Coordinated Science Laboratory, University of Illinois
  • IBM
  • AT&T
  • University of Illinois at Urbana-Champaign
  • IEEE
  • IBM Haifa Research Lab
  • IBM Research
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics

External person

J. F. Meyer

  • University of Michigan, Ann Arbor
  • University of Arizona
  • University of Michigan
  • Department of Electrical Engineering and Computer Science
  • EECS Department
  • Real-Time Computing Laboratory
  • Univ of Michigan, Electr Eng &
  • Real-Time Computing Laboratory
  • Univ of Arizona, Electr & Comput

External person

Eric Rozier

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Information Trust Institute

External person

Uttam Thakore

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Peter Buchholz

  • Dortmund University

External person

Brett Feddersen

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute

External person

Peter Kemper

  • Dortmund University
  • College of William and Mary
  • Department of Computer Science
  • Department of Computer Science

External person

Vinh Vi Lam

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Ryan M. Lefever

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Binbin Chen

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced Digital Sciences Center
  • Singapore University of Technology and Design

External person

Michael Rausch

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute

External person

Mouna Seri

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Michael G. McQuinn

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Varun Badrinath Krishna

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Information Trust Institute

External person

Benjamin E. Ujcich

  • Information Trust Institute
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Luai M. Malhis

  • University of Arizona
  • Storage Systems Div
  • University of Illinois at Urbana-Champaign
  • Center for Reliable and High Performance Computing
  • Center for Electronic Packaging Research
  • Center for Compound Semiconductor Microelectronics

External person

Latha Kant

  • Bellcore
  • Storage Systems Div
  • University of Arizona
  • Telcordia Technologies
  • University of Illinois at Urbana-Champaign
  • Center for Electronic Packaging Research

External person

Sankalp Singh

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

Gabriel A. Weaver

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Sudha Krishnamurthy

  • University of Virginia
  • United Technologies Corporation
  • Deutsche Telekom
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Center for Reliable and High Performance Computing
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Shuyi Chen

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

Binbin Chen

  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

A. P A van Moorsel

  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • University of Twente
  • Lucent

External person

Partha Pal

  • BBN Technologies

External person

Paul Rubel

  • BBN Technologies
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Himanshu Khurana

  • National Center for Super Computing Applications (NCSA) Gunter
  • Honeywell Automation and Control Systems Labs
  • Integrated Security Technologies Division
  • Honeywell
  • Honeywell Research Labs
  • University of Illinois at Urbana-Champaign
  • Honeywell ACS Labs
  • Honeywell
  • Honeywell Research Labs
  • Honeywell ACS Labs
  • Integrated Security Technologies Division

External person

David Bakken

  • Washington State University Pullman
  • University of Illinois at Urbana-Champaign
  • BBN Technologies
  • Sch. of Elec. Eng./Computer Science

External person

David A. Karr

  • L-3 Communications
  • University of Illinois at Urbana-Champaign
  • BBN Technologies

External person

R. Martinez

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Mark Griffith

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Ramesh Chandra

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Y. Alsafadi

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Jennifer Ren

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

David Grochocki

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Reinhard German

  • Technical University of Berlin
  • University of Illinois at Urbana-Champaign
  • Lucent

External person

Alvaro A. Cárdenas

  • University of Texas at Dallas
  • Fujitsu
  • University of Texas at Austin
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

Nils Ole Tippenhauer

  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Singapore University of Technology and Design
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Sobir Bazarbayev

  • University of Illinois at Urbana-Champaign

External person

Farnam Jahanian

  • University of Michigan, Ann Arbor
  • Arbor Networks
  • U. Michigan
  • U. Michigan
  • University of Michigan
  • University of Michigan
  • Electrical Engineering and Computer Science
  • Dept. of Electrical Engineering and Computer Science
  • Computer Science and Engineering
  • Arbor Networks, Inc.
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Dept. of Computer Science and Engineering
  • Arbor Networks, Inc.
  • Control Systems Laboratory
  • Dept. of Computer Science and Engineering
  • Department of EECS
  • Merit Network, Inc.
  • U. Michigan
  • University of Michigan Healthcare System

External person

Patrick Webster

  • ARM Inc.
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Jun Ho Huh

  • University of Illinois at Urbana-Champaign
  • Honeywell ACS Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Honeywell ACS Labs

External person

Xinshu Dong

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Richard E. Schantz

  • BBN Technologies
  • University of Illinois at Urbana-Champaign

External person

Chetan Sabnis

  • SingleSignOn.Net
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Yansong Ren

  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Lucent
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Michael D. Ford

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

James Lyons

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

Elizabeth LeMay

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Carol Muehrcke

  • Cyber Defense Agency

External person

Yongkyu An

  • University of Illinois at Urbana-Champaign
  • Department of Nuclear
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign

External person

Jean Peccoud

  • Virginia Polytechnic Institute and State University
  • Virginia Bioinformatics Institute

External person

Holger Hermanns

  • University of Twente
  • Saarland University
  • Faculty of Computer Science
  • Database Group

External person

Ulf Lindqvist

  • SRI International

External person

Erich Heine

  • University of Illinois at Urbana-Champaign

External person

Jing Zhang

  • University of Michigan, Ann Arbor
  • University of Michigan
  • Dept. of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Real-Time Computing Laboratory
  • University of Michigan Healthcare System

External person

Ronald Joseph Wright

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Steven Cheung

  • SRI International

External person

Amanda Hsu

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Fabrice Stevens

  • France Telecom R and D
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • France Telecom Research and Development
  • University of Illi-nois
  • University of Illinois

External person

Will Rhee

  • University of Michigan, Ann Arbor
  • University of Michigan
  • Office of Information and Infrastructure Assurance
  • Office of Information and Infrastructure Assurance
  • University of Michigan Healthcare System

External person

Jessica Pistole

  • University of Illinois at Urbana-Champaign

External person

Kevin H. Prodromides

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Robert Cunningham

  • Massachusetts Institute of Technology
  • Information Systems Technology Group

External person

J. E. Tvedt

  • University of Arizona
  • Center for Electronic Packaging Research

External person

J. Nam

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Michael Zhivich

  • Massachusetts Institute of Technology

External person

Roberto S. Freire

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Ronald Pawlowski

  • Pacific Northwest National Laboratory

External person

Sumeet Jauhar

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Franklin Webber

  • BBN Technologies

External person

Elizabeth Van Ruitenbeek

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering

External person

Jay M. Doyle

  • Honeywell
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory

External person

Graham Clark

  • Citrix Systems Inc.
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Citrix Systems, Inc.

External person

Bradley Woodworth

  • Pacific Northwest National Laboratory

External person

David Henke

  • University of Illinois at Urbana-Champaign

External person

Arif Merchant

  • Hewlett-Packard
  • Alphabet Inc.

External person

An Hoa Vu

  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Martin Fong

  • SRI International

External person

Kimberly Keeton

  • Hewlett-Packard

External person

Atul Bohara

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Abhijit Kudrimoti

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Alfonso Valdes

  • SRI International
  • University of Illinois at Urbana-Champaign

External person

Eric Robinson

  • Pacific Northwest National Laboratory

External person

Joseph A. Couvillion

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Joseph Loyall

  • BBN Technologies

External person

Pin Zhou

  • IBM
  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • Siebel Center for Computer Science

External person

Roy Maxion

  • CMU
  • Carnegie Mellon University

External person

Eskins, Douglas

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Rupak Chandra

  • Cisco Systems

External person

Insup Lee

  • University of Pennsylvania

External person

Salman Malik

  • University of Illinois at Urbana-Champaign

External person

Jiannong Cao

  • Hong Kong Polytechnic University
  • Polytechnic U
  • SMARTCOMP

External person

Mark Overholt

  • University of Illinois at Urbana-Champaign

External person

Adnan Agbariat

  • University of Illinois

External person

Skowyra, Richard

  • Massachusetts Institute of Technology

External person

Anthony Tong

  • University of Illinois at Urbana-Champaign

External person

Andrew Marturano

  • University of Illinois at Urbana-Champaign
  • Information Trust Institute

External person

Amir Houmansadra

  • University of Illinois School of Dentistry
  • Department of Electrical and Computer Engineering

External person

Sharma, A.

  • University of Illinois at Urbana-Champaign
  • Center for Reliable and High Performance Computing
  • Center for Compound Semiconductor Microelectronics

External person

Keith Marzullo

  • University of California at San Diego

External person

Daniel Siewiorek

  • Carnegie Mellon University
  • Department of Computer Science and Electrical and Computer Engineering
  • Electrical Engineering Department
  • Dept. of Electrical Engineering

External person

Giulio Masetti

  • National Research Council of Italy
  • University of Pisa

External person

Paulo Verissimo

  • Instituto Superior Tecnico Lisboa
  • Alameda da Universidade
  • University of Lisbon

External person

Edmundson, Anne

  • Princeton University

External person

Hermann Kopetz

  • Vienna University of Technology

External person

Daisuke Mashima

  • Fujitsu
  • Advanced Digital Sciences Center of UIUC

External person

Gautam Kar

  • IBM
  • T.J. Watson Research Center

External person

M. A. Qureshit

  • University of Illinois at Urbana-Champaign
  • Center for Reliable and High Performance Computing

External person

David K Y Yau

  • Advanced Digital Sciences Center
  • Singapore University of Technology and Design
  • Advanced Digital Sciences Center
  • Illinois at Singapore
  • Advanced Digital Sciences Center

External person

C. Sollima

  • University of Pisa
  • University of Illinois at Urbana-Champaign
  • Department of Nuclear
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign

External person

Peng Gu

  • Information Trust Institute
  • University of Illinois at Urbana-Champaign

External person

Norman, Gethin

  • University of Glasgow

External person

Steven T. Beaudet

  • General Dynamics

External person

Christoph Schmittner

  • Austrian Institute of Technology

External person

Reza Farivar

  • University of Illinois at Urbana-Champaign
  • Yahoo Research Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Hamed Okhravi

  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Sch. of Elec./Computer Engineering
  • Massachusetts Institute of Technology

External person

Gammel, Dennis

  • Schweitzer Engineering Laboratories, Inc.
  • Schweitzer Engineering Laboratories, Inc.

External person

Rogers, Edmond

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Michael Atighetchi

  • BBN Technologies

External person

Anil K. Sharma

  • University of Maryland, College Park
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Engineering
  • Departments of Chemistry
  • Roger Adams Laboratory
  • University of Maryland
  • Roger Adams Laboratory
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

F. K. Widjanarkot

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Kiryung Lee

  • Technion-Israel Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Georgia Institute of Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of ECE
  • School of Electrical and Computer Engineering
  • Department of Computer Science
  • Department of Statistics
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Ohio State University
  • Department of Electrical and Computer Engineering
  • School of ECE

External person

Davis, Katherine R.

  • PowerWorld Corporation
  • University of Illinois at Urbana-Champaign

External person

Josá Rufino

  • U. Lisboa
  • U. Lisboa
  • University of Lisbon
  • Alameda da Universidade

External person

Sumi Helal

  • U. Florida
  • U. Florida
  • University of Florida

External person

Jane Liu

  • Academia Sinica Taiwan

External person

Felicita Di Giandomenico

  • National Research Council of Italy

External person

Jean Arlat

  • Université Toulouse 1 Capitole
  • Laboratoire d'analyse et d'architectures des systèmes
  • Université de Toulouse
  • LAAS-NRS
  • Laboratory for Analysis and Architecture of Systems

External person

Roman Obermaisser

  • U. Siegen
  • U. Siegen
  • University of Siegen

External person

Bao Anh N Tran

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Wargaming
  • Advanced Digital Sciences Center

External person

Thomas E. Carroll

  • PNNL
  • Pacific Northwest National Laboratory

External person

Vinh Vi Lam

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Jeff Dagle

  • Pacific Northwest National Laboratory

External person

Sankalp Singh

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illi-nois
  • University of Illinois

External person

Mohamed Kaaniche

  • Université Toulouse 1 Capitole
  • Université de Toulouse
  • Laboratoire d'analyse et d'architectures des systèmes

External person

Bernard P. Zeigler

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Anand Kuratti

  • University of Illinois at Urbana-Champaign

External person

Ric Klaren

  • University of Twente
  • Database Group

External person

Eleftheria Athanasopoulou

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Nuno Ferreira Neves

  • Instituto Superior Tecnico Lisboa
  • Alameda da Universidade
  • University of Lisbon

External person

Faraz Faghri

  • University of Illinois at Urbana-Champaign
  • National Institutes of Health
  • Laboratory of Neurogenetics
  • Computer Science, University of Illinois at Urbana-Champaign
  • Molecular Genetics Section
  • National Institutes of Health (NIH)

External person

K. M. Rogers

  • PowerWorld Corporation
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois

External person

Joost Pieter Katoen

  • University of Twente
  • Database Group

External person

Rui Tan

  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Advanced Digital Sciences Center
  • Nanyang Technological University
  • Illinois at Singapore
  • Advanced Digital Sciences Center
  • School of Computer Science and Engineering

External person

Richard Macwan

  • University of Illinois at Urbana-Champaign

External person

Feng Xia

  • Dalian U. of Technology
  • Dalian University of Technology

External person

Masooda Bashiry

  • School of Information Science

External person

Mark E. Berman

  • University of Illinois at Urbana-Champaign

External person

G. P. Kavanaugh

  • University of Illinois at Urbana-Champaign

External person

Kazuo Iwano

  • Smarter Cities-IBM
  • IBM, Japan

External person

Yves Roudier

  • Eurecom
  • EURECOM
  • Institut Mines-Télécom

External person

Jeremy Jones

  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Fadi A. Zaraket

  • American University of Beirut
  • Department of Electrical and Computer Engineering

External person

F. K. Widjanarko

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Martin Buss

  • Ludwig Maximilian University of Munich
  • Technical University of Munich

External person

Michael Harrison

  • Queen Mary University of London

External person

Varun Badrinath Krishna

  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign

External person

Ronald Watro

  • BBN Technologies

External person

Kevin McAuliffe

  • IBM Research
  • IBM
  • IBM Research

External person

Landry, James

  • Massachusetts Institute of Technology

External person

W. Richardson

  • University of Arizona

External person

Rai Manish

  • University of Arizona

External person

Purvesh Thakker

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • ION Project
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Janak H. Patel

  • USA
  • University of Illinois at Urbana-Champaign
  • Syracuse University
  • IEEE
  • Jet Propulsion Laboratory, California Institute of Technology
  • Center for Reliable and High Performance Computing
  • Center for Reliable and High-Performance Computing
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Coord. Sci. Lab.
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Thin Film and Charged Particle Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Davis, Charles M.

  • PowerWorld Corporation
  • University of Illinois at Urbana-Champaign
  • PowerWorld Corporation
  • PowerWorld Corporation
  • PowerWorld Corporation
  • Department of Electrical and Computer Engineering
  • Sch. of Elec./Computer Engineering

External person

Rakesh B. Bobbo

  • University of Illinois at Urbana-Champaign

External person

Jason R. Martin

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Eric Cope

  • IBM Research
  • IBM
  • IBM Research

External person

Ozeki, T.

  • University of Arizona

External person

M. L. Bailey

  • University of Arizona

External person

Zhendong Ma

  • Austrian Institute of Technology

External person

Harpreet S. Duggal

  • University of Illinois at Urbana-Champaign

External person

Ziping Wu

  • University of Illinois at Urbana-Champaign

External person

K. H. Muralidhar

  • University of Michigan, Ann Arbor
  • Univ of Michigan, Electr Eng &

External person

Jennifer Rexford

  • Princeton University
  • AT&T
  • Dept. of Computer Science

External person

Vicario, Enrico

  • University of Florence

External person

Vaidehi V. Ambardekar

  • University of Illinois at Urbana-Champaign

External person

Silvano Chiaradonna

  • National Research Council of Italy

External person

Vishu Gupta

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics

External person

Aad P.A. Van Moorsei

  • University of Illinois at Urbana-Champaign
  • Lucent

External person

Sandeep Uttamchandani

  • IBM
  • IBM Almaden Research Center

External person

Johnson Ron

  • University of Arizona

External person

Stratton, Frank

  • University of Illinois at Urbana-Champaign

External person

Robin Berthiera

  • University of Illinois School of Dentistry
  • Department of Electrical and Computer Engineering

External person

Idit Keidar

  • Technion-Israel Institute of Technology
  • Department of Electrical Engineering

External person

Henrik Bohnenkamp

  • University of Twente
  • Database Group

External person

David O. Manz

  • PNNL
  • Pacific Northwest National Laboratory

External person

K. S. Trivedi

  • University of Illinois at Urbana-Champaign
  • Duke University
  • College of William and Mary
  • Department of Electrical Engineering, Duke University
  • Department of Electrical Engineering

External person

Birgit Pfitzmann

  • IBM Research
  • IBM
  • IBM Research

External person

Quincy Mitchell

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Information Trust Institute

External person

Daniel Chen

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Center for Reliable and High Performance Computing
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

William Niemira

  • University of Illinois at Urbana-Champaign

External person

Constantine D. Polychronopoulos

  • University of Illinois at Urbana-Champaign
  • Center for Supercomputing Research and Development
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Aad P A Vanmoorsel

  • University of Illinois at Urbana-Champaign

External person

Guldner, Cody

  • Department of Computer Science

External person

Freire Roberto

  • University of Arizona

External person

Donald Parks

  • U.S. Department of Defense

External person

Komatsu, K.

  • University of Arizona

External person

Thomas W. Edgar

  • PNNL
  • Pacific Northwest National Laboratory

External person

Jero, Samuel

  • Massachusetts Institute of Technology

External person

Nitin Anand

  • University of Maryland, College Park
  • Department of Mechanical Engineering
  • University of Maryland

External person

Michael Ihde

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Hamed Haddadi

  • Queen Mary U. London
  • Queen Mary U. London
  • Queen Mary University of London

External person

Raymond Plante

  • University of Illinois at Urbana-Champaign
  • Natl. Ctr. Supercomputing Applic.
  • Natl. Ctr. Supercomputing Applic.
  • Department of Astronomy
  • Department of Astronomy

External person

Yen Kuang Chen

  • Intel
  • Architecture Research Lab

External person

M. Rai

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Geert Deconinck

  • Katholic U
  • KU Leuven

External person

A. Movaghar

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

Cristina Nita-Rotaru

  • Northeastern University

External person

Wang, Qi

  • University of Illinois at Urbana-Champaign

External person

R. Johnson

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Stephen C. West

  • Storage Systems Div

External person

Willard Unkenholz

  • U.S. Department of Defense

External person

David Powell

  • Laboratoire d'analyse et d'architectures des systèmes

External person

Hanna, Steve

  • University of Illinois at Urbana-Champaign

External person

Vijay, Sameer

  • Department of Computer Science

External person

Michael Paulitsch

  • EADS Innovation Works
  • Airbus Group

External person

Paulo Sousa

  • University of Lisbon
  • Alameda da Universidade

External person

Liang Heng

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • LLC
  • Baidu
  • Roadstar AI
  • Baidu USA LLC
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign, 306 Talbot Laboratory
  • Department of Electrical Engineering
  • Department of Aeronautics and Astronautics
  • Department of Electrical Engineering
  • Baidu Research

External person

Douglas M. Blough

  • Georgia Institute of Technology
  • GA Tech

External person

Ted Faber

  • USC/ISI

External person