If you made any changes in Pure these will be visible here soon.

Network

Tso Ping Ma

  • Yale University
  • Southern Connecticut State University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Elecniccrl Engineering
  • Center for Microelectronic Materials and Structures
  • Department of Physics

External person

Miaomiao Wang

  • Yale University

External person

H. Bu

  • Research Division
  • IBM
  • Yale University
  • IBM Research

External person

M. Hargrove

  • Advanced Micro Devices

External person

D. Park

  • Research Division
  • IBM
  • IBM Semiconductor Research and Development Center (SRDC)

External person

E. Cartier

  • Research Division
  • IBM
  • IBM Semiconductor Research and Development Center (SRDC)

External person

M. Chudzik

  • IBM
  • IBM
  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Ctr.
  • Systems and Tech. Group

External person

N. Moumen

  • IBM Research
  • IBM

External person

Renee Mo

  • IBM
  • IBM East Fishkill
  • Research Division
  • IBM Research

External person

M. Gribelyuk

  • IBM
  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM System and Technology Group

External person

Vijay Narayanan

  • IBM
  • Research Division
  • IBM Semiconductor Research and Development Center (SRDC)

External person

W. Yan

  • IBM Research
  • IBM

External person

X. Wang

  • Research Division
  • IBM

External person

M. Khare

  • Yale University
  • IBM
  • IBM
  • Research Division
  • IBM Research

External person

R. Carter

  • Advanced Micro Devices

External person

J. Sleight

  • Research Division
  • IBM

External person

B. Doris

  • Research Division
  • IBM

External person

T. C. Chen

  • Research Division
  • IBM
  • IBM
  • IBM Research

External person

R. Wise

  • IBM
  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Ctr.

External person

R. Divakaruni

  • IBM Research
  • IBM

External person

D. Boyd

  • IBM Research
  • IBM

External person

Liyang Y. Song

  • Yale University

External person

K. Wong

  • IBM Research
  • IBM Semiconduct. Res./Devmt. Ctr.
  • IBM

External person

T. Graves-Abe

  • IBM Research
  • IBM

External person

Y. Liang

  • IBM Research
  • IBM

External person

J. Stathis

  • Research Division
  • IBM
  • IBM Research

External person

J. Schaeffer

  • Freescale Semiconductor

External person

K. Schonenberg

  • IBM Research
  • IBM

External person

M. M. Frank

  • IBM
  • Research Division
  • IBM Semiconductor Research and Development Center (SRDC)

External person

R. Knarr

  • IBM Research
  • IBM

External person

D. Casarotto

  • IBM Research
  • IBM

External person

R. Donaton

  • IBM Research
  • IBM

External person

D. Guo

  • IBM Research
  • IBM

External person

Y. Tsang

  • Advanced Micro Devices

External person

J. Sprinkle

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Unoh Kwon

  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM

External person

L. F. Edge

  • Pennsylvania State University
  • Department of Materials Science and Engineering

External person

P. J. Tobin

  • Freescale Semiconductor

External person

Fahd Shaikh

  • University of Arizona
  • Center for Electronic Packaging Research

External person

R. Jha

  • IBM Research
  • IBM

External person

V. K. Paruchuri

  • Research Division
  • IBM

External person

Siddarth Krishnan

  • IBM Research
  • IBM

External person

S. Callegari

  • Research Division
  • IBM

External person

E. Harley

  • IBM Research
  • IBM

External person

R. Ramachandran

  • IBM
  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM System and Technology Group

External person

Michelle Mills Strout

  • University of Arizona

External person

K. Ramani

  • Advanced Micro Devices

External person

S. Zafar

  • IBM
  • IBM Semiconductor Research and Development Center (SRDC)
  • Research Division

External person

A. Vayshenker

  • IBM Research
  • IBM

External person

W. Natzle

  • Research Division
  • IBM

External person

Janet M. Roveda

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Joseph Shepard

  • IBM
  • IBM Microelectronics
  • IBM East Fishkill
  • Global Foundries, Inc.
  • IBM Research

External person

M. H. Na

  • IBM Research
  • IBM

External person

M. Steen

  • Research Division
  • IBM

External person

D. G. Schlom

  • Stanford University
  • Cornell University
  • Kavli Institute at Cornell for Nanoscale Science
  • Pennsylvania State University
  • Department of Electrical Engineering, Stanford University
  • Department of Materials Science and Engineering, Stanford University
  • Department of Materials Science and Engineering, Cornell University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, Cornell University
  • Department of Electrical Engineering, Stanford University
  • Department of Materials Science and Engineering
  • Materials Science and Engineering
  • Department of Electrical Engineering
  • Department of Materials Science and Engineering
  • Kavli Institute
  • Leibniz Institute for Crystal Growth
  • Stanford University

External person

Kemeng Chen

  • University of Arizona
  • Center for Electronic Packaging Research

External person

C. Dewan

  • Research Division
  • IBM

External person

H. H. Tseng

  • Freescale Semiconductor

External person

B. Zhang

  • IBM Research
  • IBM

External person

B. P. Linder

  • IBM
  • Research Division

External person

E. Luckowski

  • Freescale Semiconductor

External person

Xie Wen Wang

  • Yale University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

C. De Wan

  • IBM Research
  • IBM

External person

C. Ouyang

  • Research Division
  • IBM

External person