Umberto Ravaioli

Network

Colleen Bannon Bushell

Person: Academic

Z. Aksamija

  • University of Wisconsin-Madison
  • University of Illinois Urbana-Champaign
  • University of Massachusetts
  • University of Massachusetts Boston
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin

External person

Karl Hess

  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Coordinated Science Laboratory
  • University of Illinois Urbana-Champaign
  • University of Kentucky
  • Samsung
  • Alcatel-Lucent
  • IEEE
  • Nokia
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Everitt Laboratoy
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

T. Van Der Straaten

  • Rush University
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • 3255 Beckman Institute
  • Department of Molecular Biophysics
  • Department of Molecular Biophysics and Physiology
  • University of Illinois at Urbana-Champaign

External person

Mohamed Mohamed

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. Kathawala

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Kerkhoven

  • University of Illinois Urbana-Champaign
  • University of Amsterdam
  • Yale University
  • Department of Computer Science
  • Computer Science, University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Center for Compound Semiconductor
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Yan Li

  • University of Illinois at Urbana-Champaign
  • University of California at Davis

External person

B. Winstead

  • Motorola
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • 3255 Beckman Institute
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Trellakis

  • Technical University of Munich
  • Intel
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Computational Electronics Group
  • Technology CAD
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Slava V. Rotkin

  • Lehigh University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Center for Advanced Materials and Nanotechnology
  • Department of Physics
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

Pierre Martin

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. T. Galick

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • AT&T
  • Center for Supercomputing Research
  • Beckman Institute for Advanced Science and Technology
  • Computational Electronics Group
  • Center for Supercomputing Research and Development
  • Center for Supercomputing Research and Development
  • University of Illinois at Urbana-Champaign

External person

Baozeng Guo

  • Hebei University
  • University of Hebei
  • Coll. of Electron. and Info. Eng.
  • Dept. of Electron. and Info. Eng.
  • College of Electronic and Informational Engineering
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

D. K. Ferry

  • Arizona State University
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Center for Solid State Electronics Research

External person

D. Guan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. B. Patil

  • University of Illinois at Urbana-Champaign
  • Indian Institute of Technology Kanpur
  • Hewlett-Packard
  • Hitachi, Ltd.
  • Indian Institute of Technology Bombay
  • University of Southern California

External person

J. Jakumeit

  • II. Physikalisches Institut
  • University of Cologne
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Michigan, Ann Arbor
  • II. Phys. Inst.
  • University of Illinois at Urbana-Champaign

External person

M. Macucci

  • University of Pisa
  • University of Illinois Urbana-Champaign
  • Dipto. Ingegneria dell'Informazione
  • Electrical Engineering Department
  • Beckman Institute for Advanced Science and Technology
  • Dipartimento di Ingegneria dell'Informazione, Elettronica, Informatica, Telecomunicazioni
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Eisenberg

  • Rush University

External person

Reza Toghraee

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. H. Park

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Tsuchiya

  • Kobe University
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • 3255 Beckman Institute
  • Department of Electrical and Electronics Engineering
  • University of Illinois at Urbana-Champaign

External person

C. J. Wordelman

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Datong Chen

  • Stanford University
  • University of Illinois Urbana-Champaign
  • National Semiconductor Corporation
  • Linear Product Division
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

A. Godoy

  • University of Granada
  • Departamento de Electrónica y Tecnología de Computadores
  • Departamento de Electrónica y Tecnología de Computadores
  • Departamento de Electrónica
  • Departamento de Electrónica

External person

J. Tang

  • Rush University
  • Department of Molecular Biophysics
  • Department of Molecular Biophysics and Physiology

External person

Leonard F. Register

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • Department of Electrical, and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Microelectronics Research Center
  • Microelectronics Research Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Nahil Sobh

  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Ctr. for Proc. Simulation and Design
  • Beckman Institute for Advanced Science and Technology
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Center for Nanoscale Science and Technology
  • Department of Theoretical Mechanics
  • Dept. of Theoretical/Appl. Mechanics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Giuseppe Iannaccone

  • University of Pisa
  • Dipartimento di Ingegneria dell'Informazione, Elettronica, Informatica, Telecomunicazioni
  • Dipto. Ingegneria dell'I.
  • Dipartimento di Ingegneria DellInformazione

External person

A. Duncan

  • Intel
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Edwin C. Kan

  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

Ozgur Aktas

  • Bilkent University
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Electrical and Electronics Engineering
  • Dept. of Electrical and Electronics Engineering
  • University of Illinois at Urbana-Champaign

External person

A. Pacelli

  • Polytechnic University of Milan
  • University of Illinois Urbana-Champaign
  • Dipto. di Elettronica e Informazione
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Deyu Lu

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Physics
  • Brookhaven National Laboratory
  • Center for Functional Nanomaterials
  • University of Illinois at Urbana-Champaign

External person

Christopher H. Lee

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

A. Kepkep

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • 3255 Beckman Institute
  • University of Illinois at Urbana-Champaign

External person

S. Iyer

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. Cancellieri

  • Villa Griffone

External person

M. Raschke

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. W. Dutton

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • Bldg 500
  • Butler Hospital
  • Brown University
  • Division of Applied Mathematics
  • Department of Electrical Engineering
  • Stanford University

External person

Wolfgang Vitale

  • Swiss Federal Institute of Technology
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Swiss Federal Institute of Technology Lausanne
  • University of Illinois at Urbana-Champaign

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

F. Sols

  • Universidad Autónoma de Madrid
  • Univ. Autónoma de Madrid
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Departamento de Física Téoica de la Materia Condensada
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Depto. Fis. Teor. Materia Condensada
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Singh

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jürgen Jakumeit

  • Fraunhofer - NW-NI-HB-HH-SH
  • Fraunhofer Institute for Algorithms and Scientific Computing
  • Fraunhofer Institute for Applied Information Technology
  • Frauenhofer-Institute for Algorithm and Scientific Computing

External person

Edwin C. Kan

  • University of Illinois Urbana-Champaign
  • Stanford University
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Cornell University
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

Zhicheng Yang

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Gino Giusi

  • University of Calabria
  • Dipartimento di Elettronica, Informatica e Sistemistica

External person

Maritin Staedele

  • Hebei University
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Electron. and Info. Eng.
  • University of Illinois at Urbana-Champaign

External person

F. Gámiz

  • University of Granada
  • Departamento de Electrónica y Tecnología de Computadores
  • Departamento de Electrónica y Tecnología de Computadores
  • Departamento de Electrónica

External person

Kyu II Lee

  • Seoul National University
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Dengyuan Song

  • University of New South Wales
  • Hebei University
  • Center for Photovoltaic Engineering
  • Coll. of Electron. and Info. Eng.
  • University of Hebei
  • College of Electronic and Informational Engineering

External person

Z. J. Estrada

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Rose Hulman Institute Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Hannan

  • University of Illinois Urbana-Champaign
  • RAS - Institute of Solid State Physics
  • Department of Electrical and Computer Engineering
  • Institute of Solid State Physics, USSR Academy of Sciences Chernogolovka
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

George I. Haddad

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Real-Time Computing Laboratory

External person

S. Yamakawa

  • The University of Osaka
  • Department of Electronic Engineering

External person

Kyu Il Lee

  • Seoul National University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Electrical Engineering and Computer Sciences
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Taniguchi

  • Department of Electronic Engineering
  • The University of Osaka

External person

M. Lundstrom

  • Department of Electrical Engineering
  • Purdue University
  • Network for Computational Nanotechnology
  • 1285 Electrical Engineering Building

External person

Jack R. East

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Real-Time Computing Laboratory

External person

B. R. Tuttle

  • Behrend College
  • Pennsylvania State University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

Fawad Hassan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Young June Park

  • School of Electrical Engineering and Computer Sciences
  • Seoul National University

External person

Mohamed Mohamed

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Masaki

  • Anan College of Technology
  • National Institute of Technology, Japan
  • National Institute of Technology, Anan College

External person

David Papke

  • Neuroscience Program
  • University of Illinois Urbana-Champaign
  • University of Illinois at Chicago
  • Center for Plasma Material Interactions
  • Medical Scholars Program
  • Beckman Institute for Advanced Science and Technology
  • Neuroscience Program, University of Illinois at Urbana-Champaign
  • Plasma Materials Interactions Group
  • University of Illinois at Urbana-Champaign

External person

Wonsok Lee

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. C. Kizilyalli

  • Alcatel-Lucent
  • University of Kentucky
  • University of Illinois Urbana-Champaign
  • Lucent
  • Nokia
  • Lucent Technologies
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Bell Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaochuan Bi

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Real-Time Computing Laboratory

External person

Jayathi Y. Murthy

  • Purdue University
  • University of Texas at Austin
  • School of Mechanical Engineering
  • School of Mechanical Engineering
  • Mechanical Engineering Department, University of Texas at Austin
  • School of Mechanical Engineering
  • School of Mechanical Engineering

External person

Omar Sobh

  • University of Illinois at Urbana-Champaign

External person

Walter Pötz

  • Arizona State University
  • Center for Solid State Electronics Research

External person

Shang Chun Lu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microsystems Technology Laboratories
  • Massachusetts Institute of Technology
  • Beckman Institute and Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

W. McMahon

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Hasan

  • Department of Electrical Engineering
  • 1285 Electrical Engineering Building
  • University of Kentucky

External person

Yongqing Wang

  • Hebei University
  • Dept. of Electron. and Info. Eng.
  • Coll. of Electron. and Info. Eng.
  • University of Hebei
  • College of Electronic and Informational Engineering

External person

E. Sangiorgi

  • University of Udine
  • University of Bologna

External person

Rong Xia Sun

  • Hebei University
  • Coll. of Electron. and Info. Eng.
  • University of Hebei
  • College of Electronic and Informational Engineering

External person

Mohamed A. Osman

  • Arizona State University
  • Center for Solid State Electronics Research

External person

M. R. Melloch

  • Purdue University
  • RAS - Institute of Solid State Physics
  • School of Electrical and Computer Engineering
  • Institute of Solid State Physics, USSR Academy of Sciences Chernogolovka

External person

S. Chiu

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Physiology and Biophysics, University of Illinois at Urbana-Champaign
  • Natl. Ctr. Supercomputing Applic.
  • Department of Food Science and Human Nutrition
  • University of South Florida
  • Department of Biochemistry
  • Illinois Institute of Technology
  • Department of Physics
  • Oklahoma State University
  • Department of Biochemistry
  • University of Illinois at Urbana-Champaign

External person

Deyu Lu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paolo Lugli

  • Arizona State University
  • University of Modena and Reggio Emilia
  • Dipartimento di Fisica

External person

C. Hamaguchi

  • The University of Osaka
  • Department of Electronic Engineering

External person

K. Miyatsuji

  • Matsushita
  • Panasonic Holdings Corporation
  • Electronics Research Laboratory
  • Electronics Research Laboratory

External person

M. B. Patil

  • Indian Institute of Technology Kanpur
  • University of Illinois at Urbana-Champaign
  • Hitachi, Ltd.
  • Indian Institute of Technology Bombay
  • University of Southern California

External person

Chunjian Ni

  • Purdue University
  • School of Mechanical Engineering
  • School of Mechanical Engineering

External person

Norman Kluksdahl

  • Arizona State University
  • Center for Solid State Electronics Research

External person

Hyung Seok Hahm

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Youngseok Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Ueno

  • The University of Osaka
  • Department of Electronic Engineering

External person

Brian Dellabetta

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Micro and Nanotechnology Laboratory and Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Michael Jo

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Rose Hulman Institute Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Vasileska

  • Arizona State University
  • School of Electrical

External person

Ra Ravishankar

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Eric Michielssen

  • Tel Aviv University
  • University of Michigan, Ann Arbor
  • Ansoft Corporation
  • Commission B
  • University of Illinois Urbana-Champaign
  • IEEE
  • Center for Computational Electromagnetics
  • Real-Time Computing Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • International Union of Radio Scientists (URSI)
  • Center for Computational Electromagnetics
  • Department of Electrical Engineering and Computer Science
  • Electromagnetics Laboratory
  • Department of EE
  • Coordinated Science Laboratory
  • ANSYS, Inc.
  • Center of Computational Electromagnetics
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

R. Ravishankar

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. Bonci

  • Dipartimento di Ingegneria dell'Informazione, Elettronica, Informatica, Telecomunicazioni
  • University of Pisa

External person

Michael K. Jo

  • Rose Hulman Institute Technology
  • University of Illinois at Urbana-Champaign

External person

S. K. Banerjee

  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering
  • Microelectronics Research Center
  • Microelectronics Research Center

External person

Mohamed A. Osman

  • Arizona State University
  • Center for Solid State Electronics Research

External person

Jan F. Eschermann

  • Technical University of Munich
  • Institute for Nanoelectronics

External person

C. Victor Jongeneel

  • University of Illinois Urbana-Champaign
  • High Performance Biological Computing Group
  • University of Illinois at Urbana-Champaign

External person

Xiaoping Zong

  • Coll. of Electron. and Info. Eng.
  • Hebei University
  • University of Hebei
  • College of Electronic and Informational Engineering

External person

Subhashini Srinivasan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiao Feng Fan

  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering

External person

M. Balasubramanian

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yong Chen

  • University of Electronic Science and Technology of China
  • Sch. of Microelectron.

External person

Steve H. Yeo

  • University of Illinois at Urbana-Champaign

External person

David Raila

  • Department of Computer Science
  • University of Illinois Urbana-Champaign
  • Department of Computer Science
  • Department of Computer Science
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science, University of Illinois
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  • Department of Computer Science
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  • University of Illinois at Urbana-Champaign
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X. G. Peralta

  • University of California at Santa Barbara
  • Department of Physics
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Ruimin Xu

  • University of Electronic Science and Technology of China
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Christian Followell

  • University of Illinois Urbana-Champaign
  • Applied Research Institute
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Steven M. Sine

  • Mayo Clinic Rochester, MN
  • Mayo Clinic College of Medicine and Science
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Liewei Wang

  • Mayo Clinic Rochester, MN
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Yong Chen

  • University of Electronic Science and Technology of China

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Hai Long Wang

  • Mayo Clinic College of Medicine and Science
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Yi Zhang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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G. Hugh Song

  • University of Illinois at Urbana-Champaign

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Zhiping Yu

  • Stanford University
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S. J. Allen

  • University of California at Santa Barbara
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Xin Wang

  • Department of Electrical, and Computer Engineering
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Yuanchen Chu

  • Purdue University
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R. K. Smith

  • Alcatel-Lucent
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S. Luryi

  • Lucent
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C. Lee

  • University of Illinois Urbana-Champaign
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Felice Crupi

  • University of Calabria
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Marcos Sotomayor

  • Beckman Institute for Advanced Science and Technology
  • Howard Hughes Medical Institute
  • Harvard University
  • University of Illinois Urbana-Champaign
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Nicholas B. Larson

  • Mayo Clinic Rochester, MN

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Jinfeng Xiao

  • University of Illinois Urbana-Champaign
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  • Department of Computer Science, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
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Mike Lambert

  • University of Illinois at Urbana-Champaign
  • National Data Service
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Kyu I.I. Lee

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Umesh Thakkar

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
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Rami Ammourah

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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R. Jay Mashl

  • University of Illinois Urbana-Champaign
  • Natl. Ctr. for Supercomp. Applic.
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  • University of Illinois at Urbana-Champaign

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C. Ball

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
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  • University of Illinois at Urbana-Champaign

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Palash Sarker

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
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  • University of Illinois at Urbana-Champaign

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Carver A. Mead

  • University of Illinois Urbana-Champaign
  • California Institute of Technology
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Torsten Mietzner

  • University of Cologne
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  • KOSMA

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Yongbo Chen

  • University of Illinois Urbana-Champaign
  • University of Electronic Science and Technology of China
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Chi Wang Shu

  • Stanford University
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Yi Sui

  • Mayo Clinic Rochester, MN

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D. Henderson

  • Brigham Young University
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Robert J. Witte

  • Mayo Clinic Rochester, MN

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Kianoush Falahkheirkhah

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemical and Biomolecular Engineering
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  • University of Illinois at Urbana-Champaign

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Alan Beck

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Z. Kuang

  • Rush University
  • Department of Molecular Biophysics

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Milt Epstein

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Amin Emad

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Medical Scholars Program, Beckman Institute for Advanced Science and Technology, University of Illinois Urbana-Champaign
  • McGill University
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  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

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Kiaran P. McGee

  • Mayo Clinic Rochester, MN

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Pramod Rizal

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Thomaz R. Mostardeiro

  • University of Texas Southwestern Medical Center

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Jing Ge

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Omar Sobh

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Krishna Kalari

  • Mayo Clinic Rochester, MN
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Erik Lehnert

  • Seven Bridges Genomics

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Xi Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Fawad Ismail

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Tomás Palacios

  • Massachusetts Institute of Technology
  • Microsystems Technology Laboratories

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A. A. Grinberg

  • Alcatel-Lucent
  • Lucent
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K. Raleva

  • Arizona State University
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  • SS Cyril and Methodius University in Skopje

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Daniel Lanier

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Shuyue Zhang

  • University of Illinois at Urbana-Champaign

External person

Richard Weinshilboum

  • Mayo Clinic Rochester, MN
  • Department of Molecular Pharmacology and Experimental Therapeutics
  • Department of Pharmacology
  • Department of Molecular Pharmacology and Experimental Therapeutics
  • Mayo Clinic College of Medicine and Science

External person

Yang Liu

  • Stanford University

External person

C. Sampedro

  • University of Granada
  • Departamento de Electrónica y Tecnología de Computadores

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Mohammad Almasri

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Sontowski

  • II. Physikalisches Institut
  • University of Cologne

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Jeff Gunter

  • Mayo Clinic Rochester, MN

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D. Boda

  • Brigham Young University

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J. Andrew McCammon

  • University of California at San Diego
  • National Science Foundation
  • National Biomedical Computation Resource University of California at San Diego La Jolla 92093CA
  • University of Illinois Urbana-Champaign
  • NSF Center for Theoretical Biological Physics
  • Department of Chemistry and Biochemistry
  • Department of Pharmacology
  • Department of Pharmacology
  • National Biomedical Computation Resource
  • Biomedical Sciences Program
  • Dept. of Chemistry and Biochemistry, University of California, San Diego
  • Departments of Chemistry
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  • Departments of Chemistry and Biochemistry
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  • University of Illinois at Urbana-Champaign

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Norbert G. Campeau

  • Mayo Clinic Rochester, MN

External person

Yeonsung Kim

  • University of Illinois Urbana-Champaign
  • Carl R. Woese Institute for Genomic Biology
  • University of Illinois at Urbana-Champaign

External person

Youcef Saad

  • NASA Ames Research Center

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Mark R. Pinto

  • Lucent
  • Nokia

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S. Varma

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Natl. Ctr. Supercomputing Applic.
  • Ctr. for Biophys. and Compl. Biology
  • Center for Biophysics and Computational Biology
  • Sandia National Laboratories
  • University of South Florida
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  • University of Illinois

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F. Bodine

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. Hugh Song

  • University of Illinois at Urbana-Champaign

External person

Aidan T. Epstein

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Charles Blatti

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science, University of Illinois
  • Dept. of Computer Science
  • Carl R. Woese Institute for Genomic Biology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Christopher Schwarz

  • Department of Radiology
  • Mayo Clinic Rochester, MN

External person

Hyuck In Kwon

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

M. Wanke

  • Sandia National Laboratories
  • Dept. Photonic Microsyst. Technol.

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N. L. Schryer

  • Alcatel-Lucent
  • Lucent
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D. P. Chen

  • Rush University
  • Department of Molecular Biophysics

External person

Nathan T. Russell

  • University of Illinois Urbana-Champaign
  • Applied Research Institute
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Gerhard Klimeck

  • School of Electrical and Computer Engineering
  • Purdue University

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Martin Staedele

  • Infineon Technologies AG

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M. Zhu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul Hasler

  • University of Illinois Urbana-Champaign
  • California Institute of Technology
  • Department of Computer Science
  • California Institute of Technology

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Xiao Lin Cheng

  • Oak Ridge National Laboratory
  • Center for Molecular Biophysics
  • Ohio State University

External person

Corey S. Post

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Yan Li

  • University of California at Davis

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Ananya Panda

  • University of Iowa

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John H. Arends

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Ruiz

  • University of Granada
  • Departamento de Electrónica y Tecnología de Computadores

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Kyu Il Lee

  • Seoul National University

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R. Eisenberg

  • Department of Molecular Biophysics
  • Rush University
  • Department of Molecular Biophysics and Physiology

External person

B. Shapo

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

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Ashutosh Dhekne

  • University of Illinois Urbana-Champaign
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
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  • Co-secondary authors
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Georgia Institute of Technology
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